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EFFECT OF Co CONTENT ON GROWTH OF ARC DISCHARGE ION-PLATING WC-Co FILM |
YU Li; JIN Zhujing (Corrosion Science laboratory; Institute of Corrosion and Protection of Metals; Chinese Academy of Sciences; Shenyang); HUANG Yanqing; ZHU Tianjin; KICHIKAW A Ichiko (College of Engineering; Tokai University; Japan) |
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Cite this article:
YU Li; JIN Zhujing (Corrosion Science laboratory; Institute of Corrosion and Protection of Metals; Chinese Academy of Sciences; Shenyang); HUANG Yanqing; ZHU Tianjin; KICHIKAW A Ichiko (College of Engineering; Tokai University; Japan). EFFECT OF Co CONTENT ON GROWTH OF ARC DISCHARGE ION-PLATING WC-Co FILM. Acta Metall Sin, 1994, 30(17): 229-232.
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Abstract Super hard refractory intermetallic WC-Co (Co= 0, 4,15 wt-%) films were prepared by arc discharge ion-plating technique. As the Co content increasing, the plasma state in vacuum chamber tends to stable, the deposition rate increases, and the structure will be T-zone in Thornton diagram and changes gradually from columnar grains into dense film.
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