TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

Acta Metall Sin

1992, Vol. 28

Issue (9): 91-94 DOI:

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TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE

LIU Changqing; LI Meishuan; JIN Zhujing; WU Weitao (Corrosion Science Lab.; Institute of Corrosion and Protection of Metals; Academia Sinica. Shenyang 110015)

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LIU Changqing; LI Meishuan; JIN Zhujing; WU Weitao (Corrosion Science Lab.; Institute of Corrosion and Protection of Metals; Academia Sinica. Shenyang 110015). TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE. Acta Metall Sin, 1992, 28(9): 91-94.

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Abstract The cantilever bending test, particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion-plated fine TiN film on pure Ti substrate. The behaviours of film damaging were found due to: for TiN facing upward, an exceeded internal tensile stress over its tensile strength, and for TiN facing downward, an exceeded shearing stress along film/substrate interface over its adhesive strength. The measured tensile and adhesive strengths are 603 and 242 MPa respectively.

Key words: tensile strength adhesive strength TiN film

Received: 18 September 1992

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https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y1992/V28/I9/91

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