INTERACTION BETWEEN Cu AND LIQUID Sn (Ⅱ) SEM Observation of Intermetallic Growth

Acta Metall Sin

1992, Vol. 28

Issue (9): 47-51 DOI:

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INTERACTION BETWEEN Cu AND LIQUID Sn (Ⅱ) SEM Observation of Intermetallic Growth

ZHANG Qiyun; LIU Shuqi; XU Yaping (Peking University; Beijing)

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ZHANG Qiyun; LIU Shuqi; XU Yaping (Peking University; Beijing). INTERACTION BETWEEN Cu AND LIQUID Sn (Ⅱ) SEM Observation of Intermetallic Growth. Acta Metall Sin, 1992, 28(9): 47-51.

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Abstract The features of Cu_6Sn_s, growing slowly at lower temperature and growing rapidly up over 350℃, and of Cu_3Sn, growing at higher temperature, have been detailedly observed under SEM. The increase of Pb content seems to inhibit sequentially the growth of Cu_6Sn_5 in Sn-Pb alloy.

Key words: Cu liquid Sn Cu_6Sn_5 Cu_3Sn lead wire solderability

Received: 18 September 1992

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