END GRAIN ATTACK OF LD10CS PLATES DURING CHEMICAL MILLING
ZENG Xianghua;SHA Jiande;SU Ge;YUAN Jigang;LIU Fumei;ZHONG Huiwen Institute of Metal Research; Academia Sinica; Shenyang; Southwest Aluminium Fabrication Plant; China National Nonferrous Metals Industry Corporation; Chongqing
Cite this article:
ZENG Xianghua;SHA Jiande;SU Ge;YUAN Jigang;LIU Fumei;ZHONG Huiwen Institute of Metal Research; Academia Sinica; Shenyang; Southwest Aluminium Fabrication Plant; China National Nonferrous Metals Industry Corporation; Chongqing. END GRAIN ATTACK OF LD10CS PLATES DURING CHEMICAL MILLING. Acta Metall Sin, 1988, 24(5): 343-346.
Abstract The end grain attack of LD10CS aluminium alloy plates during che-mical milling in hot aqueous solution of sodium hydroxide has been studied. Theresults show that the microsegregation of some components, i.e. Cu, Si etc., is themain reason of the end grain attack, and it is affected by the conditions of heattreatment as well. The end grain attack significantly minimizes while some technicalmeasures which are beneficial to the reduce of segregation were taken during meltingand casting.
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