EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS

doi:10.3724/SP.J.1037.2011.00601

Acta Metall Sin

2012, Vol. 48

Issue (3): 321-328 DOI: 10.3724/SP.J.1037.2011.00601

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EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS

HUANG Mingliang, CHEN Leida, ZHOU Shaoming

School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024

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HUANG Mingliang CHEN Leida ZHOU Shaoming. EFFECT OF ELECTROMIGRATION ON INTERFACIAL REACTION IN Ni/Sn3.0Ag0.5Cu/Cu FLIP CHIP SOLDER JOINTS. Acta Metall Sin, 2012, 48(3): 321-328.

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Abstract The effect of electromigration (EM) on the interfacial reaction in Ni/Sn3.0Ag0.5Cu/Cu solder joints was investigated under a current density of 5.0×10³ A/cm² at 150 ℃. All solder joints were aged at 150 ℃ for comparison purpose. It has been found that the (Cu, Ni)₆Sn₅ intermetallic compounds (IMCs) form at both solder/Ni and solder/Cu interfaces in the as-reflowed state. During aging at 150 ℃, the thickness of interfacial IMC increases with increasing aging time, and no interfacial IMC transformation occurs even after aging for 800 h. The flowing direction of electrons plays an important role in Cu consumption. When electrons flow from printed circuit board (PCB) to chip, the current crowding effect induces a rapid and localized dissolution of Cu pad on PCB and a formation of microcrack at the Sn3.0Ag0.5Cu/(Cu, Ni)₆Sn₅ interface. The dissolved Cu atoms are driven towards anode by EM, and a large amount of Cu₆Sn₅ IMC particles form in solder matrix along the flowing direction of electrons. When electrons flow from chip to PCB, no obvious consumption of Ni underbump metallogy (UBM) has been observed and few Cu₆Sn₅ IMC particles form in solder matrix near the anode interface. There is no evidence of failure induced by EM in solder joints even after EM for 800 h. To sum up, EM enhances the growth of interfacial (Cu, Ni)₆Sn₅ at anode side, no matter how the direction of electrons is. The interfacial IMC at anode side is thicker than that at cathode side. The Ni/Sn3.0Ag0.5Cu/Cu solder joint is prone to fail when electrons flowing from Cu to Ni.

Key words: electromigration Ni/Sn3.0Ag0.5Cu/Cu interfacial reaction intermetallic compound

Received: 23 September 2011

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Supported by National Natural Science Foundation of China (No.U0734006) and Natural Science Foundation of Liaoning Province (No.20082163)

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