Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

doi:10.11900/0412.1961.2021.00216

Acta Metall Sin

2022, Vol. 58

Issue (12): 1645-1654 DOI: 10.11900/0412.1961.2021.00216

Research paper

Current Issue | Archive | Adv Search

Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System

ZHOU Lijun¹^,², WEI Song¹^,²^,³, GUO Jingdong¹^,²(

), SUN Fangyuan⁴(

), WANG Xinwei⁵, TANG Dawei⁵

^1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, China
^2.School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, China
^3.School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
^4.School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China
^5.School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China

Cite this article:

ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System. Acta Metall Sin, 2022, 58(12): 1645-1654.

Download:

HTML

PDF(2437KB)
Export: BibTeX | EndNote (RIS)

Abstract

An accurate temperature analysis of electronic packaging requires an understanding of the thermal-transport parameters of the material. However, studies on the thermal conductivity of intermetallic compounds (IMCs) in micro-interconnect solder joints are scarce, particularly common IMCs forming in Cu-Sn systems, which seriously affect the precise prediction of the temperature field and thermal stress for electronic packaging structures. This work proposes a novel method to quantitatively measure the thermophysical parameters of Cu-Sn IMCs based on the dual-wavelength femtosecond laser time-domain thermoreflectance (TDTR) system. Cu-Sn diffusion couple samples were prepared using a reflow and aging process. Two layers of Cu₆Sn₅ and Cu₃Sn IMCs formed at the interface with micron thickness, and the (001) crystal plane of Cu₆Sn₅was the preferred orientation. The sensitivity of the experimental parameters to the measurement parameters affects the fitting accuracy. Therefore, before testing, the effects of the aluminum transducer thickness and pump laser modulation frequency on the phase signal sensitivity in the thermal conductivity measurements of Cu₆Sn₅ and Cu₃Sn were analyzed to help select the specific experimental parameters. After testing, the thermal conductivities of Cu₆Sn₅ and Cu₃Sn were 47.4 and 87.6 W/(m·K), respectively, which are slightly higher than the previous results because of the microstructure discrepancy caused by different material preparation techniques. Finally, the influence of the pump laser diameter, aluminum transducer thickness, and material specific heat on the measurement error of thermal conductivity for Cu₆Sn₅ and Cu₃Sn was examined. The test errors of the Cu₆Sn₅and Cu₃Sn thermal conductivity were -6.8%~4.6% and -7.1%~4.4%, respectively. Overall, the TDTR technology can evaluate the thermal-transport characteristics of micron-scale intermetallic compounds in electronic packaging and guide the thermal design and reliability evaluations of electronic components.

Key words: femtosecond laser time-domain thermoreflectance intermetallic compounds thermal conductivity

Received: 19 May 2021

ZTFLH:

TG115.25

Fund: National Natural Science Foundation of China(51971231);National Natural Science Foundation of China(52105327);National Natural Science Foundation of China(51720105007);National Key Scientific Instrument and Equipment Development Projects of China(2013YQ120355);Fundamental Research Funds for the Central Universities(FRF-BD-20-09A)

About author: SUN Fangyuan, associate professor, Tel: 15011316319, E-mail: sunfangyuan@ustb.edu.cn
GUO Jingdong, professor, Tel: 13066761355, E-mail: jdguo@imr.ac.cn

	Service

	E-mail this article
	Add to citation manager
	E-mail Alert
	RSS
	（）
	Articles by authors
	Lijun ZHOU
	Song WEI
	Jingdong GUO
	Fangyuan SUN
	Xinwei WANG
	Dawei TANG

URL:

https://www.ams.org.cn/EN/10.11900/0412.1961.2021.00216 OR https://www.ams.org.cn/EN/Y2022/V58/I12/1645

Fig.1 Schematic of femtosecond laser time-domain thermoreflectance (TDTR) system

Fig.2 Microstructure analyses of the interface for Cu-Sn diffusion couple specimens
(a) SEM image of microstructure
(b) EDS element maps of square region in Fig.2a
(c) XRD spectrum of Cu-Sn specimen

Fig.3 Orientation distributions of Cu₆Sn₅grains
(a) band contrast image (b) Euler color image (?₁, Φ, ?₂—Euler angles)
(c) orientation color image perpendicular to RD-TD plane (RD—rolling direction, TD—transverse direction)
(d) (001) pole figure (e) (100) pole figure (f) (301) pole figure

Fig.4 Orientation distributions of Cu₃Sn_grains
(a) band contrast image (b) Euler color image
(c) orientation color image perpendicular to RD-TD plane
(d) (001) pole figure (e) (100) pole figure (f) (301) pole figure

Fig.5 Influences of aluminum transducer thickness (a, b) and pump laser modulation frequency (c, d) on phase signal sensitivity in thermal conductivity measurement for Cu₆Sn₅ (a, c) and Cu₃Sn (b, d)

Fig.6 Experimental data of thermal conductivity measurement and the fitting curves of phase angle signal (a, b) and amplitude signal (c, d) for Cu₆Sn₅ (a, c) and Cu₃Sn (b, d)

Fig.7 Influences of pump laser diameter (D_pump) (a), aluminum transducer thickness (d_Al) (b), and material specific heat (c_p ) (c) on thermal conductivity measurement for Cu₆Sn₅ and Cu₃Sn

Table 1 Statistics of calculated results of thermal conductivity and corresponding error of Cu₆Sn₅

Table 2 Statistics of calculated results of thermal conductivity and corresponding error of Cu₃Sn

1	Braun T, Becker K F, Töpper M, et al. Fan-out wafer and panel level packaging—A platform for 3D integration [A]. 5th IEEE Electron Devices Technology and Manufacturing Conference [C]. Chengdu: IEEE, 2021: 1
2	Liu J H, Zhao H Y, Li Z L, et al. Microstructures and mechanical properties of Cu/Sn/Cu structure ultrasonic-tlp joint [J]. Acta Metall. Sin., 2017, 53: 227
	刘积厚, 赵洪运, 李卓霖等. Cu/Sn/Cu超声-TLP接头的显微组织与力学性能 [J]. 金属学报, 2017, 53: 227
3	Lancaster A, Keswani M. Integrated circuit packaging review with an emphasis on 3D packaging [J]. Integration, 2018, 60: 204 doi: 10.1016/j.vlsi.2017.09.008
4	Lable R, Ruythooren W, Baert K, et al. Resistance to electromigration of purely intermetallic micro-bump interconnections for 3D-device stacking [A]. 2008 International Interconnect Technology Conference [C]. Burlingame: IEEE, 2008: 19
5	Oprins H, Cherman V, Beyne E, et al. Thermal performance comparison of advanced 3D packaging concepts for logic and memory integration in mobile cooling conditions [A]. 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [C]. San Diego: IEEE, 2018: 318
6	Oprins H, Beyne E. Thermal analysis of a 3D flip-chip fan-out wafer level package (fcFOWLP) for high bandwidth 3D integration [A]. 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [C]. Las Vegas: IEEE, 2019: 1234
7	Goodson K E, Flik M I. Solid layer thermal-conductivity measurement techniques [J]. Appl. Mech. Rev., 1994, 47: 101 doi: 10.1115/1.3111073
8	Mcconnell A D, Goodson K E. Thermal conduction in silicon micro- and nanostructures [J]. Annu. Rev. Heat Transfer, 2005, 14: 129 doi: 10.1615/AnnualRevHeatTransfer.v14.120
9	Nishi T, Shibata H, Waseda Y, et al. Thermal conductivities of molten iron, cobalt, and nickel by laser flash method [J]. Metall. Mater. Trans., 2003, 34A: 2801
10	Kim J H, Feldman A, Novotny D. Application of the three omega thermal conductivity measurement method to a film on a substrate of finite thickness [J]. J. Appl. Phys., 1999, 86: 3959 doi: 10.1063/1.371314
11	Al-Ajlan S A. Measurements of thermal properties of insulation materials by using transient plane source technique [J]. Appl. Therm. Eng., 2006, 26: 2184 doi: 10.1016/j.applthermaleng.2006.04.006
12	Bentz D P. Transient plane source measurements of the thermal properties of hydrating cement pastes [J]. Mater. Struct., 2007, 40: 1073 doi: 10.1617/s11527-006-9206-9
13	Ho C Y, Bogaard R H, Gibson C C. Thermophysical and mechanical properties of structural composites and alloys [J]. High Temp.-High Press., 1998, 30: 277 doi: 10.1068/htec178
14	Frederikse H P R, Fields R J, Feldman A. Thermal and electrical properties of copper-tin and nickel-tin intermetallics [J]. J. Appl. Phys., 1992, 72: 2879 doi: 10.1063/1.351487
15	Papadogiannis N A, Moustaïzis S D, Girardeau-Montaut J P. Electron relaxation phenomena on a copper surface via nonlinear ultrashort single-photon photoelectric emission [J]. J. Phys., 1997, 30D: 2389
16	Qiu T Q, Tien C L. Heat transfer mechanisms during short-pulse laser heating of metals [J]. J. Heat Transfer, 1993, 115: 835 doi: 10.1115/1.2911377
17	Cahill D G, Goodson K, Majumdar A. Thermometry and thermal transport in micro/nanoscale solid-state devices and structures [J]. J. Heat Transfer, 2002, 124: 223 doi: 10.1115/1.1454111
18	Capinski W S, Maris H J, Ruf T, et al. Thermal-conductivity measurements of GaAs/AlAs superlattices using a picosecond optical pump-and-probe technique [J]. Phys. Rev., 1999, 59B: 8105
19	Stoner R J, Maris H J. Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K [J]. Phys. Rev., 1993, 48B: 16373
20	Losego M D, Grady M E, Sottos N R, et al. Effects of chemical bonding on heat transport across interfaces [J]. Nat. Mater., 2012, 11: 502 doi: 10.1038/nmat3303 pmid: 22522593
21	Sun F Y, Zhang T, Jobbins M M, et al. Molecular bridge enables anomalous enhancement in thermal transport across hard-soft material interfaces [J]. Adv. Mater., 2014, 26: 6093 doi: 10.1002/adma.201400954
22	Park M S, Gibbons S L, Arróyave R. Phase-field simulations of intermetallic compound growth in Cu/Sn/Cu sandwich structure under transient liquid phase bonding conditions [J]. Acta Mater., 2012, 60: 6278 doi: 10.1016/j.actamat.2012.07.063
23	Lee J B, Hwang H Y, Rhee M W. Reliability investigation of Cu/in TLP bonding [J]. J. Electron. Mater., 2015, 44: 435 doi: 10.1007/s11664-014-3373-1
24	Li J F, Agyakwa P A, Johnson C M. Kinetics of Ag₃Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process [J]. Acta Mater., 2010, 58: 3429 doi: 10.1016/j.actamat.2010.02.018
25	Zhang W, Ruythooren W. Study of the Au/In reaction for transient liquid-phase bonding and 3D chip stacking [J]. J. Electron. Mater., 2008, 37: 1095 doi: 10.1007/s11664-008-0487-3
26	Yu C C, Su P C, Bai S J, et al. Nickel-tin solid-liquid inter-diffusion bonding [J]. Int. J. Precis. Eng. Man., 2014, 15: 143 doi: 10.1007/s12541-013-0317-2
27	Sun F Y, Zhu J, Tang D W. Thermal conductivity measurement of liquids using femto-second laser pump-probe technique [J]. Chinese Sci. Bull., 2015, 60: 1320 doi: 10.1360/N972014-01282
	孙方远, 祝捷, 唐大伟. 飞秒激光抽运探测方法测量液体热导率 [J]. 科学通报, 2015, 60: 1320
28	Schmidt A J. Optical characterization of thermal transport from the nanoscale to the macroscale [D]. Cambridge: Massachusetts Institute of Technology, 2008
29	Li D, Franke P, Fürtauer S, et al. The Cu-Sn phase diagram part II: New thermodynamic assessment [J]. Intermetallics, 2013, 34: 148 doi: 10.1016/j.intermet.2012.10.010
30	Yang M. Interfacial reaction between tin-based solders and polycrystalline copper pad [D]. Harbin: Harbin Institute of Technology, 2012
	杨明. 锡基钎料与多晶铜焊盘界面反应行为研究 [D]. 哈尔滨: 哈尔滨工业大学, 2012
31	Gundrum B C, Cahill D G, Averback R S. Thermal conductance of metal-metal interfaces [J]. Phys. Rev., 2005, 72B: 245426

[1]	LI Dou, XU Changjiang, LI Xuguang, LI Shuangming, ZHONG Hong. Thermoelectric Properties of P-Type Ce_yFe₃CoSb₁₂ Thermoelectric Materials and Coatings Doped with La[J]. 金属学报, 2023, 59(2): 237-247.
[2]	ZENG Xiaoqin, WANG Jie, YING Tao, DING Wenjiang. Recent Progress on Thermal Conductivity of Magnesium and Its Alloys[J]. 金属学报, 2022, 58(4): 400-411.
[3]	DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580.
[4]	ZHAO Li-Dong, WANG Sining, XIAO Yu. Carrier Mobility Optimization in Thermoelectric Materials[J]. 金属学报, 2021, 57(9): 1171-1183.
[5]	ZHOU Hongyu, RAN Minrui, LI Yaqiang, ZHANG Weidong, LIU Junyou, ZHENG Wenyue. Effect of Diamond Particle Size on the Thermal Properties of Diamond/Al Composites for Packaging Substrate[J]. 金属学报, 2021, 57(7): 937-947.
[6]	CUI Yang, LI Shouhang, YING Tao, BAO Hua, ZENG Xiaoqin. Research on the Thermal Conductivity of Metals Based on First Principles[J]. 金属学报, 2021, 57(3): 375-384.
[7]	ZHU Weiqiang, YU Muzhi, TANG Xu, CHEN Xiaoyang, XU Zhengbing, ZENG Jianmin. Effect of Er and Si on Thermal Conductivity and Latent Heat of Phase Transformation of Aluminum-Based Alloy[J]. 金属学报, 2020, 56(11): 1485-1494.
[8]	Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228.
[9]	Di ZHANG, Mengying YUAN, Zhanqiu TAN, Ding-Bang XIONG, Zhiqiang LI. Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites[J]. 金属学报, 2018, 54(11): 1586-1596.
[10]	Xiaoyun LIU,Wenguang WANG,Dong WANG,Bolv XIAO,Dingrui NI,Liqing CHEN,Zongyi MA. Effect of Graphite Flake Size on the Strength and Thermal Conductivity of Graphite Flakes/Al Composites[J]. 金属学报, 2017, 53(7): 869-878.
[11]	ZHOU Dianwu, PENG Yan, XU Shaohua, LIU Jinshui. MICROSTRUCTURE AND MECHANICAL PROPERTY OF STEEL/Al ALLOY LASER WELDING WITH Sn POWDER ADDITION[J]. 金属学报, 2013, 49(8): 959-968.
[12]	XIANG Jianying CHEN Shuhai HUANG Jihua ZHAO Xingke ZHANG Hua. THERMAL SHOCK RESISTANCE OF La₂(Zr_0.7Ce_0.3)₂O₇THERMAL BARRIER COATING PREPARED BY ATMOSPHERIC PLASMA SPRAYING[J]. 金属学报, 2012, 48(8): 965-970.
[13]	LI Xunping ZHOU Minbo XIA Jianmin MA Xiao ZHANG Xinping. EFFECT OF THE CROSS-INTERACTION ON THE FORMATION AND EVOLUTION OF INTERMETALLIC COMPOUNDS IN Cu(Ni)/Sn-Ag-Cu/Cu(Ni) BGA STRUCTURE SOLDER JOINTS[J]. 金属学报, 2011, 47(5): 611-619.
[14]	GAO Yufei MENG Qingyuan. MOLECULAR DYNAMICS SIMULATION ON THERMAL CONDUCTIVITY OF ONE DIMENISON NANOMATERIALS[J]. 金属学报, 2010, 46(10): 1244-1249.
[15]	Dong Xing-Long; Jun-Peng Lei. Prediction of the primary intermetallic compound formed in Fe(Ni)-Sn nanoparticles system[J]. 金属学报, 2008, 44(8): 922-926 .

No Suggested Reading articles found!

Viewed

Full text

Abstract

Cited

Shared

Discussed