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EXPERIMENTAL RESEARCH ON HEAT TRANSFER PERFORMANCE OF DIRECTIOANLLY SOLIDIFIED POROUS COPPER HEAT SINK |
CHEN Liutao, ZHANG Huawei, LIU Yuan, LI Yanxiang |
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education, Department of Mechanical Engineering, Tsinghua University, Beijing 100084 |
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Cite this article:
CHEN Liutao ZHANG Huawei LIU Yuan LI Yanxiang. EXPERIMENTAL RESEARCH ON HEAT TRANSFER PERFORMANCE OF DIRECTIOANLLY SOLIDIFIED POROUS COPPER HEAT SINK. Acta Metall Sin, 2012, 48(3): 329-333.
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Abstract Porous copper with long cylindrical pores has been fabricated by unidirectional solidification of metal-gas eutectic system, which can be used to manufacture a special kind of micro-channel heat sink. The heat transfer performance of the directionally solidified porous copper heat sink with a length of 20 mm along the axial direction of pores was studied. The experimental results show that the directionally solidified porous copper heat sink has excellent heat transfer performance and a heat transfer coefficient of 5 W/(cm2·K) is attainable when a porosity is 29% and mean pore diameter is\linebreak 400 μm, and it shows a larger heat transfer coefficient of 6.5 W/(cm2·K) after cutting the porous copper along the vertical direction of pore axis into two sections alined in the direction of pore axis. Increasing the length of porous copper heat sink along the direction of pore axis will reduce the penetration ratio of pores and then weaken the heat transfer performance of the heat sink. Thus some methods have to be taken to increase the pore length and ratio of penetrating pores when fabricating directionally solidified porous copper heat sink.
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Received: 14 November 2011
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Fund: Supported by Joint Funds of National Natural Science Foundation of China and Yunnan Province No.U0837603), Beijing Natural Science Foundation (No.2092017), National Natural Science Foundation of China for Young Scientists (No.{\footnotesize\it 51101092}), Found of Key Laboratory for Advanced Materials Processing Technology, Ministry of Education (No.2010011) |
[1] Shapovalov V I. MRS Bull, 1994; 4: 24[2] Liu Y, Li Y X, Zhang H W, Wan J. Acta Metall Sin, 2005; 41: 886(刘源, 李言祥, 张华伟, 万 疆. 金属学报, 2005; 41: 886)[3] Liu Y, Li Y X, Wan J, Zhang H W. Mater Sci Eng, 2005; A402: 47[4] Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1165(张华伟, 李言祥, 刘源. 金属学报, 2006; 42: 1165)[5] Li Y X, Liu Y, Zhang H W, Wang X. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 237[6] Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1171(张华伟, 李言祥, 刘源. 金属学报, 2006; 42: 1171)[7] Wang X, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1075(王雪, 李言祥, 刘 源. 金属学报, 2006; 42: 1075)[8] Kov´aˇcik J. Acta Mater, 1998; 46: 5413[9] Hyun S K, Murakami H, Nakajima H. Mater Sci Eng, 2001; A299: 241[10] Ogushi T, Chiba H, Nakajima H, Ikeda T. J Appl Phys, 2004; 95: 5843[11] Chiba H, Ogushi T, Nakajima H, Torji K, Tomimura T, Ono F. J Appl Phys, 2008; 103: 013515[12] Tane M, Hyun S K, Nakajima H. J Appl Phys, 2005; 97: 103701[13] Xie Z K, Ikeda T, Okuda Y, Nakajima H. Mater Sci Eng, 2004; A386: 390[14] Xie Z K, Ikeda T, Okuda Y, Nakajima H. Mater Sci Forum, 2004; 449–452: 661[15] Mahajan R, Nair R, Wakharkar V, Swan J, Tang J, Vandentop G. Intel Technol J, 2002; 6: 61[16] Tuckerman D B, Pease R F W. IEEE Electron Dev Lett, 1981; 2: 126[17] Rosa P, Karayiannis T G, Collins M W. Appl Therm Eng, 2009; 29: 3447[18] Wei X J. J Electron Packaging, 2004; 126: 60[19] Ogushi T, Chiba H, Nakajima H. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 27[20] Chiba H, Ogushi T, Nakajima H. In: Nakajima H, Kanetake N eds., Proceedings of MetFoam 2005, Sendai: The Japan Institute of Metals, 2006: 35[21] Li M. Master Dissertation, Tsinghua University, Beijing, 2002(李勐. 清华大学硕士学位论文, 北京, 2002) |
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