|
|
SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化 |
肖克来提 杜黎光 孙志国 盛玫 罗乐 |
中国科学院上海冶金研究所;上海200050 |
|
引用本文:
肖克来提; 杜黎光; 孙志国; 盛玫; 罗乐 . SnAgCu表面贴装焊点在时效和热循环过程中的组织及剪切强度变化[J]. 金属学报, 2001, 37(4): 439-444 .
[1] Tomlinson W J, Fullylove A. J Moter Sci, 1992; 27: 5777 [2] Kang S K, Sarkhel A K. J Electron Mater 1994; 23: 701 [3] Hwang J S, Vargas R M. Solder Surf Mount Technol,1990;5: 38 [4] Ylijoki T L, Steen H, Forsten A. IEEE Trans ComponPackag Manuf Technol 1997; 20: 194 [5] Guo Z, Conrad H. Trans ASME J Electron Packg, 1996;118: 49 [6] Keller H N. IEEE Trans Compon Hybrids Manuf Technol,1986; 9: 433 [7] Spencer L F. Met Finish, 1974; 22: 35 [8] Schenel H G, Kreye H. Plat Surf Finish, 1990; 77: 50 [9] Lee C Y, Lin K L. Thin Solid Films, 1994; 249: 201 [10] Graham A H, Lindsay R W, Read H J. J Electrochem Soc,1965; 112: 401 [11] Lin K L, Lai P J. J Electrochem Soc, 1989; 136: 3803 [12] Yang W, Messler R W. J Electron Mater 1994; 23: 765 [13] Harada M, Satoh R. IEEE Trans Compon Hybrids ManufTechnol, 1990; 13: 119 [14] Young C D, Duh J G. IEEE Trans Compon HybridsManuf Technol, 1998; 21: 330 [15] TU P L, Chan Y C, Lai J K L. IEEE Trans ComponPackag Manuf Technol, 1997; 20: 87 [16] Bulluffi R W, Seigle L L. Acta Metall, 1967; 5: 449 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|