Cu/Al laminated composites combine the lightweight advantage of aluminum with the high electrical and thermal conductivity of copper, and are widely used in the new energy, communication, electric power, and related industries. Traditionally, cold rolling has been the primary method for producing these composites; however, it often results in poor interfacial bonding and promotes the formation of oxides at the interface. In contrast, the high-temperature oxygen-free rolling process can significantly improve composite preparation by enabling precise layer temperature control and creating an anaerobic environment. This process typically forms a mechanical bonding interface, necessitating subsequent annealing to achieve a metallurgical bond that enhances interfacial integrity and optimizes performance. Therefore, developing an annealing process that complements the rolling method is essential. Based on this context, a Cu/1060Al/Cu three-layer composite was fabricated using T2 copper and 1060 aluminum as base materials. The effects of rolling passes and annealing parameters on the mechanical properties and conductivity of the composite were investigated. In addition, the current density distribution within the composite was simulated using Ansys software. After annealing at 350 ^oC for 2 h, the interface layer of the Cu/1060Al/Cu composite became uniform and continuous, with microcracks in the rolled interface layer effectively eliminated. According to strength-plasticity product calculations, the composite exhibited optimal overall performance after two rolling passes, achieving a yield strength of 107 MPa, tensile strength of 178 MPa, and elongation of 67%. Under the combined influence of the interface layer and the constraining effect of the copper layers on both sides of the aluminum core, the composite displayed a collaborative tensile fracture mode. The measured conductivity of the Cu/1060Al/Cu composite reached 70.1%IACS satisfying the requirements for conductor applications. The current density distribution in the annealed Cu/1060Al/Cu composite primarily varied with current frequency, demonstrating the skin effect characteristics typical of alternating current. The current density decreased with increasing frequency and increased with a higher proportion of the copper layer. Notably, increasing the copper layer proportion does not always lead to better performance. It is necessary to comprehensively consider electrical conductivity and material usage when determining the copper layer proportion. An appropriate range for the single-sided copper layer proportion is 10.0%-17.5%.