POLARITY GROWTH OF INTERMETALLIC COMPOUND INDUCED BY ELECTROMIGRATION AT THE INTERFACE BETWEEN EUTECTIC SnPb AND Ni(P) FINISHES

Acta Metall Sin

2009, Vol. 45

Issue (2): 178-182 DOI:

论文

Current Issue | Archive | Adv Search

POLARITY GROWTH OF INTERMETALLIC COMPOUND INDUCED BY ELECTROMIGRATION AT THE INTERFACE BETWEEN EUTECTIC SnPb AND Ni(P) FINISHES

LU Yudong ^1;2; HE Xiaoqi ¹; EN Yunfei ¹; WANG Xin ²; ZHUANG Zhiqiang ²

1. National Key Laboratory for Reliability Physics and Application Technology of Electrical Components; the 5th Electronics Research Institute of the Ministry of Information Industry; Guangzhou 510610
2. Key Laboratory of Special Functional Materials; Ministry of Education; College of Materials Science and Engineering; South China University of Technology; Guangzhou 510640

Cite this article:

LU Yudong HE Xiaoqi EN Yunfei WANG Xin ZHUANG Zhiqiang. POLARITY GROWTH OF INTERMETALLIC COMPOUND INDUCED BY ELECTROMIGRATION AT THE INTERFACE BETWEEN EUTECTIC SnPb AND Ni(P) FINISHES. Acta Metall Sin, 2009, 45(2): 178-182.

Download:

PDF(13941KB)
Export: BibTeX | EndNote (RIS)

Abstract

The polarity growth of intermetallic compound (IMC) at the interface between eutectic SnPb BGA solder joints and Ni(P) finishes was investigated and the mechanism of microstructural evaluation was explained by the migration of atoms in interconnects. Ni₃Sn₄ IMC layer of 2 μm in thickness was formed during the soldering reaction and the subsequent annealing at 120 ℃ can not induce the visible growth of IMC. The IMC layer shows abnormal growth at the anode interface, while the growth at the cathode interface is restrained. Finally, the upper–side and lower–side interfaces of
the same solder joints show polarity effect on the growth of IMC. The polarity effect is related with the flux of atoms in interconnects. The direction of electron flow is consistent with the flux of Sn atoms, while opposite to the flux of Ni atoms. The flux of atoms induced the abnormal growth of IMC at the
anode interface but restrained the growth at cathode interface.

Key words: SnPb solder joint intermetallic compound electromigration

Received: 16 July 2008

ZTFLH:	TG401
	TG111

Fund:

Supported by R&D Foundation of the 5th Electronics Research Institute of the Ministry of Information Industry (No.XF0726130) and China Postdoctoral Science Foundation (No.20080430825)

	Service

	E-mail this article
	Add to citation manager
	E-mail Alert
	RSS
	（）
	Articles by authors
	LU Yu-Dong
	HE Xiao-Qi
	EN Yun-Fei
	YU Xin
	ZHUANG Zhi-Jiang

URL:

https://www.ams.org.cn/EN/ OR https://www.ams.org.cn/EN/Y2009/V45/I2/178

[1] Jang J W, Kim P G, Tu K N. J Appl Phys, 1999; 85: 8456
[2] Brandenburg S, Yeh S. Proceedings of Surface Mount International Conference and Exhibition, San Jose, CA: SMTA, 1998: 337
[3] Suh J O, Tu K N, Tamura N. J Appl Phys, 2007; 102: 063511
[4] Nah JW, Suh J O, Tu K N. J Appl Phys, 2005; 98: 013715
[5] Zhang L, Ou S, Huang J, Tu K N, Gee S, Nguyen L. Appl Phys Lett, 2006; 88: 012106
[6] Liang S W, Chang Y W, Chen C, Preciado J, Tu K N. J Electron Mater, 2008; 37: 692
[7] Nah J W, Suh J O, Tu K N, Yoon S W, Rao V S, Vaidyanathan K, Hua F. J Appl Phys, 2006; 100: 123513
[8] Aquawal R, Ou S, Tu K N. J Appl Phys, 2006; 100: 024909
[9] Huynh Q T, Liu C Y, Chen C, Tu K N. J Appl Phys, 2001; 89: 4332
[10] Lu Y D, He X Q, En Y F, Wang X. Adv Mater Res, 2008, 44–46: 905

[1]	DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580.
[2]	ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654.
[3]	ZHANG Zhijie, HUANG Mingliang. In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect[J]. 金属学报, 2020, 56(10): 1386-1392.
[4]	Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388.
[5]	Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228.
[6]	CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614.
[7]	HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358.
[8]	Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076.
[9]	Mingliang HUANG, Hongyu SUN. Interaction Between β-Sn Grain Orientation and Electromigration Behavior in Flip-Chip Lead-Free Solder Bumps[J]. 金属学报, 2018, 54(7): 1077-1086.
[10]	Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823.
[11]	Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868.
[12]	Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600.
[13]	Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574.
[14]	Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024.
[15]	Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865.

No Suggested Reading articles found!

Viewed

Full text

Abstract

Cited

Shared

Discussed