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INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve |
ZHANG Oiyun;HAN Wanshu;LIU Junkang Peking University; Beijing ZHANG Qiyun; professor; Department of Chemistry; Peking University 100871 |
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Cite this article:
ZHANG Oiyun;HAN Wanshu;LIU Junkang Peking University; Beijing ZHANG Qiyun; professor; Department of Chemistry; Peking University 100871. INTERACTION BETWEEN Cu AND LIQUID Sn——Also on Physical Meaning of Wetting Curve. Acta Metall Sin, 1989, 25(6): 85-90.
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Abstract The interaction between Cu and liquid Sn was studied by microstruc-ture observation. The curve of the dipping time with related to dissolving anddiffusion of Cu in liquid Sn was given. The Cu dissolves rapidly in liquid Sn atthe beginning, then an intermetallic compound, Cu_6Sn_5, forms, and the dissolvingfollows to slow down. At temperature up to 350℃, the feather-like Cu_6Sn_5 is sud-denly growing up and spreads through the dipped Sn layer. The way to inhibitthe growth of the intermetallic compound, Cu_6Sn_5, was also approached. Thus, onthe above mentioned basis, the phyical meaning of the wetting curve traced by themeniscograph wettability tester has been derived as film detaching, Cu dissolvingand Cu_6Sn_5 growing.
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Received: 18 June 1989
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