Acta Metall Sin  1995, Vol. 31 Issue (20): 374-378    DOI:

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FORMATION OF SEPARATED EUTECTIC PHENOMENON BY ELECTROMAGNETIC STIRRING

JIN Junze; CAO Zhiqiang; ZHENG Xianshu; ZHANG Shangru(Dalian University of Technology; Dalian 116023)(Manuscript received 1994-06-10; in revised form 1995-03-15)

JIN Junze; CAO Zhiqiang; ZHENG Xianshu; ZHANG Shangru(Dalian University of Technology; Dalian 116023)(Manuscript received 1994-06-10; in revised form 1995-03-15). FORMATION OF SEPARATED EUTECTIC PHENOMENON BY ELECTROMAGNETIC STIRRING. Acta Metall Sin, 1995, 31(20): 374-378.

Abstract References Related Articles Recommended Metrics Download:  PDF(365KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The separated eutectic for nearly 20 kinds of simple and complex eutectic alloys was investigated. It shows that most metal-nonmetal eutectic and a part of metal-intemietallic compound eutectic were separated by electromagnetic stirring. The eutectic in which one of its component phases possesses an entropy of solution over 23 J/(mol. K) shows noted separation.Correspondent. JIN Junze, professor, The Engineering Research Center of Foundry, Dalian University of Technology, Dalian 116023 Key words:  separated eutectic      electromagnetic stirring      solution entropy      intermetallic compound      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1995/V31/I20/374 1ChalmersB．PrinciplesofSolidification．NewYork:JohnWiley&Sons,1964:2022JinJunze,KobayashiKF,ShinguPH．MetallTrans,1984;15A:3073CrokerMN,FidlerRS,SmithRW．RoySocLond,1973;A335:154HuntJD,JacksonKA．TransMetallSocAIME,1966;236:8485胡汉起．金属凝固原理．北京:机械工业出版社,1991:556ShinguPH,KurosakiM,JinJunze．TransJpeInstMet,1986;27:546T [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] ZHANG Lin, GUO Xiao, GAO Jianwen, DENG Anyuan, WANG Engang. Effect of Electromagnetic Stirring on Microstructure and Mechanical Properties of TiB2 Particle-Reinforced Steel[J]. 金属学报, 2020, 56(9): 1239-1246. [4] REN Zhongming,LEI Zuosheng,LI Chuanjun,XUAN Weidong,ZHONG Yunbo,LI Xi. New Study and Development on Electromagnetic Field Technology in Metallurgical Processes[J]. 金属学报, 2020, 56(4): 583-600. [5] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [6] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [7] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [8] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [9] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [10] Guohua WU, Yushi CHEN, Wenjiang DING. Current Research and Future Prospect on Microstructures Controlling of High Performance Magnesium Alloys During Solidification[J]. 金属学报, 2018, 54(5): 637-646. [11] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [12] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [13] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [14] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [15] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed