PHYSICAL SIMULATION OF Ar BUBBLE BEHAVIOR IN THE SOLID/LIQUID INTERFACE OF CONTINUOUS CASTING BILLET

doi:10.3724/SP.J.1037.2010.00690

Acta Metall Sin

2011, Vol. 47

Issue (6): 763-768 DOI: 10.3724/SP.J.1037.2010.00690

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PHYSICAL SIMULATION OF Ar BUBBLE BEHAVIOR IN THE SOLID/LIQUID INTERFACE OF CONTINUOUS CASTING BILLET

JIN Xiaoli, LEI Zuosheng, YU Zhan, ZHANG Haobin, DENG Kang, REN Zhongming

Shanghai Key Laboratory of Modern Metallurgy & Materials Processing, Shanghai University, Shanghai 200072

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JIN Xiaoli LEI Zuosheng YU Zhan ZHANG Haobin DENG Kang REN Zhongming. PHYSICAL SIMULATION OF Ar BUBBLE BEHAVIOR IN THE SOLID/LIQUID INTERFACE OF CONTINUOUS CASTING BILLET. Acta Metall Sin, 2011, 47(6): 763-768.

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Abstract Ar gas was injected to the nozzle during continuous casting to prevent from nozzle clogging caused by solid inclusions, however, some gas bubbles were captured by the initial solidified billet shell, and subsequently billet defects were formed in final product. In present work, a physical model applying mold simulator was designed and used to investigate the bubble behavior in the solid/liquid interface. Different mold simulator angels and bubble diameters were considered, three typical behaviors were observed, some bubbles were captured by the solidified shell, several bubbles coalescence in the solid/liquid interface, and other bubbles stayed in the interface for a moment, and then left. The possible mechaism of gas bubble entrapped in solidified hell was anayzed. Besides, industial billets were studied, many dendites wee found around the hole, it was consdered to be a key factor for gas bubble engulfed in the solidification billets in the meniscus area. Further morethe effective technologes, such as electrical brake near the submerged entry nozzle and electrical stirring in the mold narrow face, can improve billet quality and reduce gas bubbles in solidified shewere imposed

Key words: gas bubble continuous casting billet solid/liquid interface simulation meniscus

Received: 23 December 2010

ZTFLH:

TF777

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Supported by National Natural Science Foundation of China (Nos.50874133 and 50604010) and Shanghai Educational Committee (No.09QA1402200)

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2010.00690 OR https://www.ams.org.cn/EN/Y2011/V47/I6/763

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