Acta Metall Sin  1993, Vol. 29 Issue (4): 25-29    DOI:

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THEORETICAL CALCULATION OF POINT DEFECTS IN Ni_3Al

SUN Jian;LIN Dongliang Shanghai Jiaotong University professor;Department of Materials Science;Shanghai Jiaotong University; Shanghai 200030

SUN Jian;LIN Dongliang Shanghai Jiaotong University professor;Department of Materials Science;Shanghai Jiaotong University; Shanghai 200030. THEORETICAL CALCULATION OF POINT DEFECTS IN Ni_3Al. Acta Metall Sin, 1993, 29(4): 25-29.

Abstract References Related Articles Recommended Metrics Download:  PDF(397KB)  Export:  BibTeX | EndNote (RIS)       Abstract  Equilibrium equation of point defects in Ll_2 type intermetallic compoundswas established to calculate the relations of the concentration of antisite defects and vacanciesand bulk composition in Ni_3Al. The examination of temperature effects on the point defectscleared up the misunderstanding of the properties of the "constitutional point defects" inNi_3Al. Key words:  intermetallic compound      Ni_3Al      vacancy      antisite defect      Received:  18 April 1993      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1993/V29/I4/25 1 Dasgupta A, Smedskjar L C, Legnini D G, Siegel R W. Mater Lett, 1985; 3: 457 2 杨文英,吕反修,章守华.金属学报,1990;26A:385 3 孙坚.上海交通大学博士学位论文,1992 4 Foils S M, Daw M S. J Mater Res, 1987; 2: 5 5 Seeger A, Mehrer H. Vacancies and Interstitials in Metals. Amsterdem: North-Holland, 1970; 1 6 Liu C T, White C L, Horton J A. Acta Metall, 1985; 33: 213) [1] LIAO Jingjing, ZHANG Wei, ZHANG Junsong, WU Jun, YANG Zhongbo, PENG Qian, QIU Shaoyu. Periodic Densification-Transition Behavior of Zr-Sn-Nb-Fe-V Alloys During Uniform Corrosion in Superheated Steam[J]. 金属学报, 2023, 59(2): 289-296. [2] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [3] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [4] Zongwei JI,Song LU,Hui YU,Qingmiao HU,Levente Vitos,Rui YANG. First-Principles Study on the Impact of Antisite Defects on the Mechanical Properties of TiAl-Based Alloys[J]. 金属学报, 2019, 55(5): 673-682. [5] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [6] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [7] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [8] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [9] Shuaipeng WANG, Wenhua LUO, Gan LI, Haibo LI, Guangfeng ZHANG. Effect of La Content on Hydriding Kinetics of Ce-La Alloys[J]. 金属学报, 2018, 54(8): 1187-1192. [10] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [11] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [12] Jun SUN, Suzhi LI, Xiangdong DING, Ju LI. Hydrogenated Vacancy: Basic Properties and Its Influence on Mechanical Behaviors of Metals[J]. 金属学报, 2018, 54(11): 1683-1692. [13] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [14] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [15] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed