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Acta Metall Sin  1992, Vol. 28 Issue (2): 19-24    DOI:
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MECHANISM OF HYDROGEN FACILICATED CLEAVAGE IN TITANUM ALUMINIDE
CHU Wuyang;XIAO Jimei;THOMPSON A W University of Science and Technology Beijing; Carnegie Mellon University; U. S. A
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CHU Wuyang;XIAO Jimei;THOMPSON A W University of Science and Technology Beijing; Carnegie Mellon University; U. S. A. MECHANISM OF HYDROGEN FACILICATED CLEAVAGE IN TITANUM ALUMINIDE. Acta Metall Sin, 1992, 28(2): 19-24.

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Abstract  Both hydrogen induced cracking and overload crack initiated at same character-istic distance, r, within the plastic zone along the slip line when the plastic zone developed to a critical extent. For the overload crack:For the hydrogen induced cracking:Hydrogen pomoting the dislocation multiplication and motion would result in σ_o,(H)< σ_o,k> 1. Therefore, hydrogen promoting the cleavage fracture in titanum aluminde can be due to that hydrogen facilicates the local plastic deformation, which results in σ_F(H)< σ_F and then K_(IH)< K_(IC).
Key words:  Ti_3Al      intermetallic compound      hydrogen induced crack     
Received:  18 February 1992     
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1 王燕斌,褚武扬,肖纪美.中国科学A,1989;(10) :1065
2 Chu Wuyang, Thompson A W, Williams J c. In: Moody N R, Thompson A W eds., Hydrogen effect on Material Behavior, Proc 4th Int Confon Hydrogen, TMS-AIME, 1990: 543
3 褚武扬,肖纪美,李世琼.金属学报,1981;17:10
4 王燕斌,褚武扬,肖纪美.金属学报,1982;18:676
5 Chu Wuyang, Wang Heli, Hsiao Chimei (Xiao Jimei). Corrosion, 1984; 40: 487
6 Chu Wuyang, Thompson A W, Williams J C. Acta Metall Mater, in press.
7 褚武扬.氢损伤和滞后断裂.北京:冶金工业出版社,1988
8 Lipsitt H A, Shechtman D, Schafrik R E. Metall Trans, 1980; 11A: 1369
9 Smith E, Barnby J T. Met Sci J, 1967; 1: 56
10 Ritchie R O, Server W L, Wullaert R A. Metall Trans, 1979; 10A: 1557
11 张统一,褚武扬,肖纪美.中国科学A,1986;(3) :316
12 Oriani P A, Josephic P H. Acta Metall, 1974; 22: 1065k
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