Acta Metall Sin  1990, Vol. 26 Issue (3): 10-17    DOI:

Current Issue | Archive | Adv Search |

COMPUTER SIMULATION OF GRAIN BOUNDARY STRUCTURES IN Ni_3 Al

LIN Dongliang;CHEN Da T. L. Lin Shanghai Jiaotong University professor;Department of Materials Science;Shanghai Jiaotong University;Shanghai 200030

LIN Dongliang;CHEN Da T. L. Lin Shanghai Jiaotong University professor;Department of Materials Science;Shanghai Jiaotong University;Shanghai 200030. COMPUTER SIMULATION OF GRAIN BOUNDARY STRUCTURES IN Ni_3 Al. Acta Metall Sin, 1990, 26(3): 10-17.

Abstract References Related Articles Recommended Metrics Download:  PDF(717KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The embedded atom type potentials and static relaxation method combin-ed with highest gradient computational technique have been used to simulate thegrain boundary atomic structures, grain boundary energies, grain boundary cohesiveenergies, the distribution of electron density and stress field in the grain boundaryregion, and other related problems of [100], [110] and [111] symmetric tilt grainboundaries in Ni_3Al with different grain boundary geometrical index and composi-tion.Their relations with the segragation of B, behaviours of the grain boundary,and especially the stoichiometrical effect of B induced ductility have also beenstudied and discussed. Key words:  Ni_3Al      intermetallic compound      grain boundary structure      computer simulation      Received:  18 March 1990      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1990/V26/I3/10 1 Koch C C, Liu C T, Stoloff N S. Mat Res Soc Symp Proc, Vol. 39 and Vol. 81, Materials Research Society, USA., 1985 and 1987 2 Stoloff N S. Int Metall Rev. 1984; 29: 123 3 Liu C T, White C L. Mat Res Soc Symp Proc. Vol. 39, Materials Research Society, USA, 1985: 365 4 Schulson E M, Weihs T P, Baker I, Frost H J, Horton J A. Acta Metall, 1986; 34: 1395 5 Bond G M, Robertson I M, Birnbaum H K. J Mater Res, 1987; 2: 436 6 Daw M S, Baskes M I. Phys Rev, 1984; B29: 6443 7 Vitek V, Sutton A P Smith D A, Pond R C. In: Balluffi R W ed, Grain Boundary Structure and Kinetics, Metals Park, Ohio: ASM, 1980: 115 8 Wang G J. Ph. D Thesis, University of Pennsylvania, USA., 1984 9 Voter A F, Chen S P. Mat. Res. Soc. Symp. Proc., Vol. 82． Materials Research Society, USA, 1987: 175 10 Yamaguchi M, Paidar V. Pope D P, Vitek V. Philos Mag, 1982; A45: 867 11 Handa S, Ogura T. Watanabe S, Izumi O, Masumoto T. Acta Metall, 1986; 34: 13 l2 Handa S, Kim M S, Watanabe S, Izumi O. Scr Metall, 1987; 21: 277 13 Dasgupta A, Smedskjaer L C. Legnini D G, Siegel R W. Mater Lett, 1985; 3: 457x [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [7] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [8] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [9] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [10] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [11] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [12] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [13] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. [14] Manjiao CHEN,Jiankang HUANG,Cuicui HE,Yu SHI,Ding FAN. THERMODYNAMIC ANALYSIS OF THE FORMATION OF Fe-Al-Zn INTERMETALLIC COMPOUNDS IN Al/GALVANIZED STEEL INTERFACE[J]. 金属学报, 2016, 52(1): 113-119. [15] Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG. PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM[J]. 金属学报, 2015, 51(7): 873-882. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed