|
|
|
| Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响 |
| 王小京1; 祝清省1; 王中光1; 尚建库1;2 |
1. 中国科学院金属研究所沈阳材料科学国家(联合)实验室; 沈阳 110016
2. Department of Materials Science and Engineering; University of Illinois at Urbana--Champaign; Urbana; IL61801; USA |
|
| MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER |
| WANG Xiaojing1; ZHU Qingsheng 1; WANG Zhongguang1; SHANG Jianku1;2 |
1. Institute of Metal Research; Chinese Academy of Sciences; Shenyang 110016
2. Department of Materials Science and Engineering; University of Illinois at Urbana--Champaign; Urbana; IL61801; USA |
引用本文:
王小京 祝清省 王中光 尚建库. Ag3Sn粗化模型及其对Sn-Ag-Cu焊料蠕变的影响[J]. 金属学报, 2009, 45(8): 912-918.
,
.
MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER[J]. Acta Metall Sin, 2009, 45(8): 912-918.
| [1] Atkinson H V. Acta Metall, 1988; 36: 469
[2] Thornton K, Ågren J, Voorhees P W. Acta Mater, 2003; 51: 5675
[3] Bray A J, Adv Phys, 2002; 51: 481
[4] Matin M A, Vellinga W P, Geers M G D. Acta Metall, 2004; 52: 3475
[5] Conrad H, Guo Z, Fahmy Y, Yang D. J Electron Mater, 1999; 28: 1062
[6] Vianco P T, Burchett S N, Neilsen M K, Rejent J A, Frear D R. J Electron Mater, 1999; 28: 1290
[7] Hacke P L, Fahmy Y, Conrad H. J Electron Mater, 1998; 27: 941
[8] Frear D, Burchett B, Neisen M, Stephens J. Solder Surf Mount Technol, 1997; 25: 39
[9] LaLonde A, Emelande D, Jeannette J, Larson C, Rietz W, Swenson D, Henderson D W. J Electron Mater, 2004; 33: 1545
[10] Lehman L P, Athavale S N, Fullem T Z, Giamis A C, Kinyanjui R K, Lowenstein M, Mather K, Patel R, Rae D, Wang J, Xing Y, Zavalij L, Borgesen P, Cotts E J. J Electron Mater, 2004; 33: 1429
[11] Bieler T R, Telang A U, Lucas J P, Subramanian K N, Lehman L P, Xing Y, Cotts E J. J Electron Mater, 2004; 33: 1412
[12] Dutta I. J Electron Mater, 2003; 32: 201
[13] Gong J C, Liu C Q, Conway P P, Silberschmidt V V. Mater Sci Eng, 2006; A427: 60
[14] Dutta I, Pan D, Marks R A, Jadhav S G. Mater Sci Eng, 2005; A410–411: 48
[15] Qi L, Huang J, Zhao X, Zhang H. J Alloys Compd, 2009; 469: 102
[16] Blech I A. J Appl Phys, 1976; 47: 1203
[17] Gan H, Tu K N. IEEE Proc 52nd Electronic Components and Technology Conference, 28–31 May 2002, San Diego, California: IEEE, 2002: 1206
[18] Gan H, Choi W J, Xu G, Tu K N. J Miner Met Mater Soc, 2002; 54: 34
[19] Ren F, Nah J W, Tu K N, Xiong B S, Pang L H L. Appl Phys Lett, 2006; 89: 141914
[20] Wagner C. Z Electrochem. 1961; 65: 581
[21] Lifshitz I M, Slyozov V V. J Phys Chem Solids, 1961; 19: 35
[22] Clark M A, Alden T H. Acta Metall, 1973; 21: 1195
[23] Senkov O N, Myshlyaev M M. Acta Metall. 1986; 34: 97
[24] Sarychev M E, Zhinikov Y V. J Appl Phys, 1999; 86: 3068
[25] Kim K S, Huh S H, Suganuma K. Mater Sci Eng, 2002; A333: 106
[26] Shen J, Liu Y C, Han Y J, Zhang P Z, Gao H X. J Mater Sci Technol, 2005; 21: 827
[27] Korhonen T M K, Turpeinen P, Lehman L P, Bowman B, Thiel G H, Parkes R C, Korhonen M, Henderson D W, Puttlitz K J. J Electron Mater, 2004; 33: 1581
[28] Evan R W, Wilshire B. Creep of Metals and Alloys, London: Institute of Metals, 1985: 104
[29] Darveaux R, Banerji K. IEEE Trans Comp, Hybrids, Manuf, Technol, 1992; 15: 1013
[30] Igoshev V I, Kleiman J I. J Electron Mater, 2000; 29: 244
[31] Ansell G S, Weertman J. Trans Metall Soc AIME, 1959; 215: 838
[32] Jung K, Conrad H. J Electron Mater, 2001; 30: 1294
[33] Jung K, Conrad H. J Electron Mater, 2001; 30: 1303
[34] Jung K, Conrad H. J Electron Mater, 2001; 30: 1308
[35] Vianco P T, Burchett S N, Neilsen M K, Rejent J A, Frear D R. J Electron Mater, 1999; 28: 1290
[36] Mei Y, Chow C L, Fang H E, Neilsen M K, Lim T J, Lu W. J Electron Packaging, 2004; 126: 100
[37] Senkov O N, Myshlyaev M M. Acta Metall, 1986; 34: 97
[38] Yeh E C C, Choi W J, Tu K N, Elenius P, Balkan H. Appl Phys Lett, 2002; 80: 580
[39] Darveaux R, Banerji K. IEEE Trans Comp, Hybrids, Manuf, Technol, 1992; 15: 1013
[40] Balzer R, Sigvaldason H. Phys Status Solidi, 1979; 92B: 143
[41] Clement J J, Thompson C V. J Appl Phys, 1995; 78: 900
[42] Basaran C, Lin M. Int J Solids Stuct, 2007; 44: 4909 |
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
| |
Shared |
|
|
|
|
| |
Discussed |
|
|
|
|
