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金属学报  1994, Vol. 30 Issue (4): 164-169    
  论文 本期目录 | 过刊浏览 |
62Sn─36Pb─2AgSMT封装焊点的等温剪切低周疲劳特征
李云卿;唐祥云;马莒生;黄乐
清华大学
ISOTHERMAL SHEAR LOW-CYCLE FATIGUE BEHAVIOUR OF 62Sn-36Pb-2Ag SURFACE MOUNT SOLDER JOINTS
LI Yunqing; TANG Xiangyun; M A Jusheng; HUANG Le(Tsinghua University; Beijing)(Manuscript received 19 July; 1993: in revised form 18 October; 1993)
引用本文:

李云卿;唐祥云;马莒生;黄乐. 62Sn─36Pb─2AgSMT封装焊点的等温剪切低周疲劳特征[J]. 金属学报, 1994, 30(4): 164-169.
, , , . ISOTHERMAL SHEAR LOW-CYCLE FATIGUE BEHAVIOUR OF 62Sn-36Pb-2Ag SURFACE MOUNT SOLDER JOINTS[J]. Acta Metall Sin, 1994, 30(4): 164-169.

全文: PDF(488 KB)  
摘要: 研究了表面封装焊在剪切应力作用下等温低周疲劳特征,得到疲劳寿命与循环应力幅的关系曲线.分析了62Sn─36Pb─2Ag焊点的低周疲劳失效机理。结果表明:62Sn─36Pb─2Ag表面封装焊点在剪应力控制等温低周疲劳过程中有明显的循环蠕变行为,焊点的失效是由于疲劳与蠕变的交互作用造成的。在25℃,低应力水平下,焊点的失效主要受疲劳过程控制,而高应力水平下,焊点的失效主要受蠕变过程控制;100℃等温低周疲劳的失效机理与室温疲劳相似,其由疲劳机理向蠕变机理转化的应力水平τ_(+)较室温下为低,但在相对应力水平(τ_+/τ_b和τ_+/τ_b')相同时,100℃与室温时疲劳裂纹的扩展速率da/dN基本一致。
关键词 62Sn─36Pb─2Ag表面封装焊点低周疲劳循环蠕变失效机理    
Abstract:The isothermal low-cycle fatigue behaviour of 62Sn-36Pb-2Ag surface mount solder joint under shear stress has been discussed, meanwhile, the curve of shear fatigue life vs cyclic shear stress amplitude has been obtained, and the failure mechanism under different shear stress amplitude at different temperatures is analyzed. The results show that:there are obvious cyclic creep behaviour during constant stress amplitude low-cycle fatigue in 62Sn-36Pb-2Ag surface mount solder joints. The failure of solder joint is due to the interaction of fatigue and creep. At 25℃, under low shear stress amplitude, the failure is controlled mainly by fatigue mechanism, in constrast, under high shear stress amplitude, controlled mainly by creep mechanism:the failure mechanism at 100℃ is similar to that at 25℃ , only the transfer stress τ_(+) from fatigue mechanism to creep mechanism is lower than that at 25℃. Under similar relatative shear stress amplitude (τ_(+)/τ_b and τ_(+)/τ_b'), the fatigue rack propagation rate da / dN at 100℃ is similar to that at 25℃ .Correspondent: LI Yunqing, lecturer, Department of Materials Science and Engineering, Tsinghua University,Beijing 100084
Key wordssurface mount packaging    solder joint    low-cycle fatigue    cyclic creep    failure mechanism
收稿日期: 1994-04-18     
基金资助:国家自然科学基金
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