添加<strong>Ag</strong>中间层<strong>QAl10-5-5/TC6</strong>双金属界面金属间化合物的有序演化与界面强化机制

doi:10.11900/0412.1961.2025.00144

金属学报

2026, Vol. 62

Issue (8): 1454-1466 DOI: 10.11900/0412.1961.2025.00144

研究论文

本期目录 | 过刊浏览

添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制

孙利星¹, 薛航宇¹, 梁淑华¹, 杨倩², 姜琪¹, 邹军涛¹(

)

1 西安理工大学陕西省金属基异质材料先进制造技术工程研究中心西安 710048
2 西安比亚迪汽车有限公司西安 710119

Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer

SUN Lixing¹, XUE Hangyu¹, LIANG Shuhua¹, YANG Qian², JIANG Qi¹, ZOU Juntao¹(

)

1 Shaanxi Province Engineering Research Center of Advanced Manufacturing Technology for Metal Based Dissimilar Materials, Xi'an University of Technology, Xi'an 710048, China
2 Xi'an BYD Auto Co. Ltd. , Xi'an 710119, China

引用本文:

孙利星, 薛航宇, 梁淑华, 杨倩, 姜琪, 邹军涛. 添加Ag中间层QAl10-5-5/TC6双金属界面金属间化合物的有序演化与界面强化机制[J]. 金属学报, 2026, 62(8): 1454-1466.
Lixing SUN, Hangyu XUE, Shuhua LIANG, Qian YANG, Qi JIANG, Juntao ZOU. Ordering Process of Interfacial Intermetallic Compounds and Strengthening Mechanism of QAl10-5-5/TC6 Bimetals Adding Ag Interlayer[J]. Acta Metall Sin, 2026, 62(8): 1454-1466.

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摘要:

铜合金/钛合金双金属材料能够充分发挥铜合金与钛合金的优异性能，具有重要的工程应用价值。然而，高界面强度铜合金/钛合金双金属材料的可控制备面临着巨大的挑战。本工作分别采用添加Ag箔和电沉积Ag层制备了高界面强度QAl10-5-5/TC6双金属，表征并测试了双金属界面的组织和力学性能，阐明了双金属界面的强化机制。结果表明，QAl10-5-5/Ag箔/TC6双金属界面强度在连接温度为850 ℃时达到最大值(200 MPa)；电沉积Ag层的细晶组织促进了QAl10-5-5/TC6双金属在较低的连接温度下形成冶金结合，使得界面强度在连接温度为835 ℃时达到最大值(217 MPa)。电沉积Ag层制备的QAl10-5-5/TC6双金属TC6合金侧形成了由厚度约为1 μm的TiAlCu₂反应层以及亚微米尺度的Ti₂Cu相和Ti₃Al相组成的“影响区”，其中Ti₃Al相与基体α相形成了半共格界面。基于强化理论分析发现，细晶强化与析出强化协同提升了QAl10-5-5/TC6双金属TC6合金侧“影响区”的力学性能。

关键词 ：铜合金, 钛合金, 双金属, 金属间化合物, 界面强化

Abstract：

Structural-functional integrated Cu-alloy/Ti-alloy bimetals combine the advantageous properties of both constituents and therefore exhibit considerable potential for multifunctional applications. However, controlling the interfacial microstructure and achieving sufficient interfacial strength remain significant challenges in Cu-alloy/Ti-alloy systems. This study investigates the evolution of the interfacial microstructure, the ordering behavior of interfacial intermetallic compounds (IMCs), and the relationship between interfacial structure and mechanical performance, aiming to clarify the formation pathway of IMCs and its effect on the interface strength of Cu-alloy/Ti-alloy bimetals. QAl10-5-5/TC6 bimetals were fabricated via diffusion bonding using Ag interlayer (adding Ag foil as interlayer or electrodeposited Ag interlayer on QAl10-5-5 alloy). The resulting interfacial microstructures and shear strengths were systematically characterized, and the corresponding strengthening mechanism was clarified. For the QAl10-5-5/Ag foil/TC6 bimetals, the interfacial strength reached a maximum of 200 MPa at a bonding temperature of 850 ^oC. Meanwhile, for the Ag layer deposited QAl10-5-5/TC6 bimetals, the fine-grained structure of the electrodeposited Ag layer promoted metallurgical bonding, and the QAl10-5-5/TC6 bimetals achieved maximum interfacial strength of 217 MPa at a bonding temperature of 835 ^oC. Moreover, an “affected zone” formed on the TC6 alloy side of Ag layer deposited QAl10-5-5/TC6 bimetals, consisting of a TiAlCu₂ reaction layer with a thickness of ~1 μm, and submicron scale Ti₂Cu and Ti₃Al phases, in which a semi-coherent interface occurred between Ti₃Al and α-Ti. Theoretical strengthening analysis of Ag layer deposited QAl10-5-5/TC6 bimetal revealed that the grain refinement strengthening and precipitation strengthening enhanced the property of the “affected zone” on the TC6 alloy side.

Key words： Cu alloy Ti alloy bimetal intermetallic compounds interface strengthening

收稿日期: 2025-05-27

ZTFLH:

TG406

基金资助:国家自然科学基金项目(U2341271);国家自然科学基金项目(52104385);陕西省科技创新团队项目(2025RS-CXTD-020);陕西省青年科技新星项目(2025ZC-KJXX-33);陕西省重点研发计划项目(2023GXLH-037);航空科学基金项目(202400070T6001)

通讯作者: 邹军涛，zoujuntao@xaut.edu.cn，主要从事铜合金及双金属材料可控制备技术研究

Corresponding author: ZOU Juntao, professor, Tel: (029)82312185, E-mail: zoujuntao@xaut.edu.cn

作者简介: 孙利星，男，1990年生，副教授，博士

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https://www.ams.org.cn/CN/10.11900/0412.1961.2025.00144 或 https://www.ams.org.cn/CN/Y2026/V62/I8/1454

图1 QAl10-5-5合金和TC6合金微观组织的SEM像

图2 QAl10-5-5合金表面电沉积Ag层制备流程示意图

图3 Ag箔EBSD反极图

图4 不同工艺条件下，QAl10-5-5合金/TC6合金直接连接双金属界面及QAl10-5-5合金/Ag箔/TC6合金双金属界面组织形貌的SEM像和剪切强度(a) QAl10-5-5/TC6 bimetal at a bonding temperature of 850 oC(b-d) QAl10-5-5/Ag foil/TC6 bimetal at bonding temperatures of 825 oC (b), 850 oC (c), and 875 oC (d)

表1 连接温度为850和875 ℃时，QAl10-5-5合金/Ag箔/TC6合金双金属界面过渡层EDS点扫描结果 (atomic fraction / %)

图5 不同电沉积工艺下，电沉积Ag层QAl10-5-5合金横截面显微组织的SEM像和样品的宏观形貌，及电沉积电流强度0.5 A、电沉积时间25 min下电沉积Ag层QAl10-5-5合金横截面的反极图

图6 不同连接温度下电沉积Ag层QAl10-5-5合金/TC6合金双金属界面显微组织的SEM像和剪切强度

表2 连接温度为850 ℃时，电沉积Ag层QAl10-5-5合金/TC6合金双金属界面过渡层EDS点扫描结果 (atomic fraction / %)

图7 不同连接温度下电沉积Ag层QAl10-5-5合金/TC6合金双金属界面断口形貌

表3 不同连接温度下电沉积Ag层QAl10-5-5合金/TC6合金双金属界面断口EDS点扫描结果 (atomic fraction / %)

图8 连接温度为805 ℃时，电沉积Ag层QAl10-5-5合金/TC6合金双金属界面过渡层的组织形貌及合金元素分布

图9 连接温度为805 ℃时，电沉积Ag层QAl10-5-5合金/TC6合金双金属界面过渡层TC6合金侧的TEM-HAADF像、EDS元素面分布图和SAED花样

图10 连接温度为805 ℃时，电沉积Ag层QAl10-5-5合金/TC6双金属界面过渡层的TEM明场像，及α-Ti/Ti3Al相界面的HRTEM像和快速Fourier变换

图11 双金属界面过渡层不同金属间化合物的晶体结构(Ti3Al、Ti2Cu、TiAlCu2)及界面原子结构示意图(a) Ti3Al (b) Ti2Cu (c) TiAlCu2

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