Acta Metall Sin  1996, Vol. 32 Issue (3): 231-234    DOI:

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BONDING CHARACTERISTICS OF A1_3Ti ALLOYS WITH DIFFERENT STRUCTURE OR COMPOSITION

ZHANG Jinxu; HU Gengxiang (Shanghai Jiaotong University; Shanghai 200030);XU Weixin (Shanghai Iron and Steel Research institute; Shanghai 200940) (Manuscript received 1995-05-30)

ZHANG Jinxu; HU Gengxiang (Shanghai Jiaotong University; Shanghai 200030);XU Weixin (Shanghai Iron and Steel Research institute; Shanghai 200940) (Manuscript received 1995-05-30). BONDING CHARACTERISTICS OF A1_3Ti ALLOYS WITH DIFFERENT STRUCTURE OR COMPOSITION. Acta Metall Sin, 1996, 32(3): 231-234.

Abstract References Related Articles Recommended Metrics Download:  PDF(325KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The bonding characteristics of Al3Ti and its alloys have been investigated by XPS technique. The anisotropic bonding of Al3Ti stablizes the DO22 crystal structure. In the Mn or Ni modified Al3Ti alloy appear the isotropic bonds which favour the Ll2 structure.Al(67)Ti(25)Mn8 alloy shows more spherical and weakly directional bonds than those in Al(67)Ti(25)Ni8. So the Mn-modified alloy is more ductile than the Ni modified alloy. Correspondent: HU Gengxiang, professor, Department of Materials Science, Shanghai Jiaotong University,Shanghai 200030 Key words:  Al_3Ti      intermetallic compound      bonding characteristic      XPS      Received:  18 March 1996      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1996/V32/I3/231 1HuGengxiang,ChenShipu,WuXiaohua,RongYonghua,ChenXiaofu．JMaterSciTechnol,1994;10:4352FuCL．JMaterRes．1990;5:9713YooMH,FuCL．IronsteelInstJpnInt,1991;3110494EberhartME,KumarKS,MaclarenJM．PhitosMag,1990;61B:9435CarlssonAE,MeschterPJ．JMaterRes,1989;4:10606MorrisDG,GunterS．ActaMetallMater,1992;40:30657HongT,FreemanAJ．JMaterRes,1991;6:3308孟长功,徐东生,郭建亭,胡壮麒．金属学报,1993;29:A56` [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] SONG Guihong,LI Guipeng,LIU Qiannan,DU Hao,HU Fang. Microstructure and Electric Conductance of Mg2(Sn, Si) Thin Films by Sputtering[J]. 金属学报, 2019, 55(11): 1469-1476. [7] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [8] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [9] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [10] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [11] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [12] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [13] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [14] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. [15] Manjiao CHEN,Jiankang HUANG,Cuicui HE,Yu SHI,Ding FAN. THERMODYNAMIC ANALYSIS OF THE FORMATION OF Fe-Al-Zn INTERMETALLIC COMPOUNDS IN Al/GALVANIZED STEEL INTERFACE[J]. 金属学报, 2016, 52(1): 113-119. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed