MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT

doi:10.3724/SP.J.1037.2013.00186

Acta Metall Sin

2013, Vol. 49

Issue (9): 1137-1142 DOI: 10.3724/SP.J.1037.2013.00186

Current Issue | Archive | Adv Search

MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT

AN Tong, QIN Fei, WANG Xiaoliang

Laboratory of Advanced Electronic Packaging Technology & Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124

Cite this article:

AN Tong, QIN Fei, WANG Xiaoliang. MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT. Acta Metall Sin, 2013, 49(9): 1137-1142.

Download:

PDF(2615KB)
Export: BibTeX | EndNote (RIS)

Abstract

Thickness and roughness evolution of the intermetallic compounds (IMC) layer between Sn3.0Ag0.5Cu and Cu substrate are examined under various isothermal aging times at 150℃.The effect of the microstructure evolution of the IMC on the mechanical behavior of solder joints is experimentally investigated. The results show that the growth of the IMC follows the Fick's law that predicts the total mean thickness increases linearly with the square root of the aging time. With the increase of the isothermal aging time, the initial scallop morphology of the solder/IMC interface changes to a more planar type. Both the thickness and roughness of the IMC layer affect the tensile strength and fracture mode of the solder joints. The tensile strength decreases with the increase of either the IMC thickness or the solder/IMC interfacial roughness. With the increase of the isothermal aging time, the IMC thickness increases and the solder/IMC interfacial roughness decreases, and the fracture mode migrates from ductile fracture in bulk solder to brittle fracture in the IMC layer.

Key words: solder joint intermetallic compound mechanical behavior tensile strength fracture mode

Received: 15 April 2013

	Service

	E-mail this article
	Add to citation manager
	E-mail Alert
	RSS
	（）
	Articles by authors
	AN Tong
	QIN Fei
	WANG Xiaoliang

URL:

https://www.ams.org.cn/EN/10.3724/SP.J.1037.2013.00186 OR https://www.ams.org.cn/EN/Y2013/V49/I9/1137

[1] Lee H T, Chen M H. Mater Sci Eng, 2002; A333: 24

[2] Liu P, Yao P, Liu J. J Alloys Compd, 2009; 470: 188

[3] Yu D Q, Wang L. J Alloys Compd, 2008; 458: 542

[4] Zuruzi A S, Chiu C H, Lahiri S K, Tu K N. J Appl Phys, 1999; 86: 4916

[5] Li G Y, Chen B L. IEEE Trans Compon Packag Technol, 2003; 26: 651

[6] Li X P, Zhou M B, Xia J M, Ma X, Zhang X P. Acta Metall Sin, 2011; 47: 611

(李勋平, 周敏波, 夏建民, 马骁, 张新平. 金属学报. 2011; 47: 611)

[7] Yu D Q, Wu C M L, Law C M T, Wang L, Lai J K L. J Alloys Compd, 2005; 392: 192

[8] Lim G T, Kim B J, Lee K, Kim J, Joo Y C, Park Y B. J Electron Mater, 2009; 38: 2228

[9] Hayes S M, Chawla N, Frear D R. Microelectron Reliab, 2009; 49: 269

[10] Prakash K H, Sritharan T. Mater Sci Eng, 2004; A379: 277

[11] Zhang Q K, Zhang Z F. J Alloys Compd, 2009; 485: 853

[12] Zhu Q S, Zhang L, Wang Z G, Wu S D, Shang J K. Acta Metall Sin, 2007; 43: 41

(祝清省, 张黎, 王中光, 吴世丁, 尚建库. 金属学报, 2007; 43: 41)

[13] Lee H T, Chen M H, Jao H M, Liao T L. Mater Sci Eng, 2003; A358: 134

[14] Zhao J, Cheng C Q, Qi L, Chi C Y. J Alloys Compd, 2009; 473: 382

[15] Shang P J, Liu Z Q, Pang X Y, Li D X, Shang J K. Acta Mater, 2009; 57: 4697

[16] Shang P J, Liu Z Q, Li D X, Shang J K. J Electron Mater, 2009; 38: 2579

[17] Song F B. PhD Dissertation, The Hong Kong University of Science and Technology, 2007

[18] Prakash K H, Sritharan T. J Electron Mater, 2003; 32: 939

[19] Lee T Y, Choi W J, Tu K N, Jang J W, Kuo S M, Lin J K, Frear D R, Zeng K, Kivilahti J K. J Mater Res, 2002; 17: 291

[1]	WANG Kai, JIN Xi, JIAO Zhiming, QIAO Junwei. Mechanical Behaviors and Deformation Constitutive Equations of CrFeNi Medium-Entropy Alloys Under Tensile Conditions from 77 K to 1073 K[J]. 金属学报, 2023, 59(2): 277-288.
[2]	DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580.
[3]	ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654.
[4]	LUO Xuan, HAN Fang, HUANG Tianlin, WU Guilin, HUANG Xiaoxu. Microstructure and Mechanical Properties of Layered Heterostructured Mg-3Gd Alloy[J]. 金属学报, 2022, 58(11): 1489-1496.
[5]	JIANG Minqiang, GAO Yang. Structural Rejuvenation of Metallic Glasses and Its Effect on Mechanical Behaviors[J]. 金属学报, 2021, 57(4): 425-438.
[6]	ZHANG Lin, GUO Xiao, GAO Jianwen, DENG Anyuan, WANG Engang. Effect of Electromagnetic Stirring on Microstructure and Mechanical Properties of TiB₂ Particle-Reinforced Steel[J]. 金属学报, 2020, 56(9): 1239-1246.
[7]	Hanchen FENG,Xuegang MIN,Dasheng WEI,Lichu ZHOU,Shiyun CUI,Feng FANG. Effect of Low Temperature Annealing on Microstructure and Mechanical Properties of Ultra-Heavy Cold-DrawnPearlitic Steel Wires[J]. 金属学报, 2019, 55(5): 585-592.
[8]	Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388.
[9]	Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228.
[10]	Aidong TU, Chunyu TENG, Hao WANG, Dongsheng XU, Yun FU, Zhanyong REN, Rui YANG. Molecular Dynamics Simulation of the Structure and Deformation Behavior of γ/α₂ Interface in TiAl Alloys[J]. 金属学报, 2019, 55(2): 291-298.
[11]	CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614.
[12]	HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358.
[13]	Ran TAO, Yutao ZHAO, Gang CHEN, Xizhou KAI. Microstructure and Properties of In-Situ ZrB_{2 np}/AA6111 Composites Synthesized Under an Electromagnetic Field[J]. 金属学报, 2019, 55(1): 160-170.
[14]	Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076.
[15]	Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823.

No Suggested Reading articles found!

Viewed

Full text

Abstract

Cited

Shared

Discussed