Please wait a minute...
Acta Metall Sin    DOI: 10.3724/SP.J.1037.2013.00186
Current Issue | Archive | Adv Search |
MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT
AN Tong, QIN Fei, WANG Xiaoliang
Laboratory of Advanced Electronic Packaging Technology & Reliability, College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124
Download:  PDF(2615KB) 
Export:  BibTeX | EndNote (RIS)      
Abstract  

Thickness and roughness evolution of the intermetallic compounds (IMC) layer between Sn3.0Ag0.5Cu and Cu substrate are examined under various isothermal aging times at 150℃.The effect of the microstructure evolution of the IMC on the mechanical behavior of solder joints is experimentally investigated. The results show that the growth of the IMC follows the Fick's law that predicts the total mean thickness increases linearly with the square root of the aging time. With the increase of the isothermal aging time, the initial scallop morphology of the solder/IMC interface changes to a more planar type. Both the thickness and roughness of the IMC layer affect the tensile strength and fracture mode of the solder joints. The tensile strength decreases with the increase of either the IMC thickness or the solder/IMC interfacial roughness. With the increase of the isothermal aging time, the IMC thickness increases and the solder/IMC interfacial roughness decreases, and the fracture mode migrates from ductile fracture in bulk solder to brittle fracture in the IMC layer.

Key words:  solder joint      intermetallic compound      mechanical behavior      tensile strength      fracture mode     
Received:  15 April 2013     

Cite this article: 

AN Tong, QIN Fei, WANG Xiaoliang. MICROSTRUCTURE EVOLUTION AND MECHANICAL BEHAVIOR OF INTERMETALLIC COMPOUNDS IN SOLDER JOINT. Acta Metall Sin, 2013, 49(9): 1137-1142.

URL: 

https://www.ams.org.cn/EN/10.3724/SP.J.1037.2013.00186     OR     https://www.ams.org.cn/EN/Y2013/V49/I9/1137

[1] Lee H T, Chen M H.  Mater Sci Eng, 2002; A333: 24

[2] Liu P, Yao P, Liu J.  J Alloys Compd, 2009; 470: 188
[3] Yu D Q, Wang L.  J Alloys Compd, 2008; 458: 542
[4] Zuruzi A S, Chiu C H, Lahiri S K, Tu K N.  J Appl Phys, 1999; 86: 4916
[5] Li G Y, Chen B L.  IEEE Trans Compon Packag Technol, 2003; 26: 651
[6] Li X P, Zhou M B, Xia J M, Ma X, Zhang X P.  Acta Metall Sin, 2011; 47: 611
(李勋平, 周敏波, 夏建民, 马骁, 张新平. 金属学报. 2011; 47: 611)
[7] Yu D Q, Wu C M L, Law C M T, Wang L, Lai J K L.  J Alloys Compd, 2005; 392: 192
[8] Lim G T, Kim B J, Lee K, Kim J, Joo Y C, Park Y B.  J Electron Mater, 2009; 38: 2228
[9] Hayes S M, Chawla N, Frear D R.  Microelectron Reliab, 2009; 49: 269
[10] Prakash K H, Sritharan T.  Mater Sci Eng, 2004; A379: 277
[11] Zhang Q K, Zhang Z F.  J Alloys Compd, 2009; 485: 853
[12] Zhu Q S, Zhang L, Wang Z G, Wu S D, Shang J K.  Acta Metall Sin, 2007; 43: 41
(祝清省, 张黎, 王中光, 吴世丁, 尚建库. 金属学报, 2007; 43: 41)
[13] Lee H T, Chen M H, Jao H M, Liao T L.  Mater Sci Eng, 2003; A358: 134
[14] Zhao J, Cheng C Q, Qi L, Chi C Y.  J Alloys Compd, 2009; 473: 382
[15] Shang P J, Liu Z Q, Pang X Y, Li D X, Shang J K.  Acta Mater, 2009; 57: 4697
[16] Shang P J, Liu Z Q, Li D X, Shang J K.  J Electron Mater, 2009; 38: 2579
[17] Song F B.  PhD Dissertation, The Hong Kong University of Science and Technology, 2007
[18] Prakash K H, Sritharan T.  J Electron Mater, 2003; 32: 939
[19] Lee T Y, Choi W J, Tu K N, Jang J W, Kuo S M, Lin J K, Frear D R, Zeng K, Kivilahti J K.  J Mater Res, 2002; 17: 291
[1] Hanchen FENG,Xuegang MIN,Dasheng WEI,Lichu ZHOU,Shiyun CUI,Feng FANG. Effect of Low Temperature Annealing on Microstructure and Mechanical Properties of Ultra-Heavy Cold-DrawnPearlitic Steel Wires[J]. 金属学报, 2019, 55(5): 585-592.
[2] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388.
[3] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228.
[4] Aidong TU, Chunyu TENG, Hao WANG, Dongsheng XU, Yun FU, Zhanyong REN, Rui YANG. Molecular Dynamics Simulation of the Structure and Deformation Behavior of γ/α2 Interface in TiAl Alloys[J]. 金属学报, 2019, 55(2): 291-298.
[5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614.
[6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358.
[7] Ran TAO, Yutao ZHAO, Gang CHEN, Xizhou KAI. Microstructure and Properties of In-Situ ZrB2 np/AA6111 Composites Synthesized Under an Electromagnetic Field[J]. 金属学报, 2019, 55(1): 160-170.
[8] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076.
[9] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823.
[10] Peibei JI, Lichu ZHOU, Xuefeng ZHOU, Feng FANG, Jianqing JIANG. Study on Anisotropic Mechanical Properties of Cold Drawn Pearlitic Steel Wire[J]. 金属学报, 2018, 54(4): 494-500.
[11] Yanchun ZHAO, Hao SUN, Chunling LI, Jianlong JIANG, Ruipeng MAO, Shengzhong KOU, Chunyan LI. High Temperature Deformation Behavior of High Strength and Toughness Ti-Ni Base Bulk Metallic Glass Composites[J]. 金属学报, 2018, 54(12): 1818-1824.
[12] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868.
[13] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600.
[14] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574.
[15] Fei LI,Huayu ZHANG,Wenwu HE,Huiqin CHEN,Huiguang GUO. COMPRESSION AND TENSILE CONSECUTIVE DEFORMATION BEHAVIOR OF Mn18Cr18N AUSTENITE STAINLESS STEEL[J]. 金属学报, 2016, 52(8): 956-964.
No Suggested Reading articles found!