Acta Metall Sin  1993, Vol. 29 Issue (11): 18-21    DOI:

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EFFECT OF Sn ON INHIBITOR INTENSITY IN HIGH INDUCTION GRAIN-ORIENTED SILICON STEELS

ZHAO Yu;HE Zhongzhi;ZHU Jing;WENG Yuqing;WU Baorong Central Iron and Steel Research Institute; Ministry of Metallurgical Industry; Beijing

ZHAO Yu;HE Zhongzhi;ZHU Jing;WENG Yuqing;WU Baorong Central Iron and Steel Research Institute; Ministry of Metallurgical Industry; Beijing. EFFECT OF Sn ON INHIBITOR INTENSITY IN HIGH INDUCTION GRAIN-ORIENTED SILICON STEELS. Acta Metall Sin, 1993, 29(11): 18-21.

Abstract References Related Articles Recommended Metrics Download:  PDF(755KB)  Export:  BibTeX | EndNote (RIS)       Abstract  TEM observations were made of the precipitated particles in two high induc-tion grain-oriented silicon stfeels with and without Sn. The inhibiting ability of precipitatedparticles in the Sn bearing material for primary grain growth was compared with that in theSn free one.The temperature dependence of the primary grain size for the two materials wasstudied. A comparison of the total intensity of inhibitors was made between the twomaterials.Based on the above results, it can be concluded that Sn plays a role of an impor-tant inhibitor through segregation on primary grain boundaries. Key words:  high induction grain-oriented silicon steel      Sn      inhibitor      AlN      Received:  18 November 1993      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1993/V29/I11/18 1 赵宇,何忠治,翁宇庆,吴宝榕.金属学报,1992;28(8) :A327 2 黑泽文夫,田口勇,谷野满.日本金属学会会报,1981;20:377 3 Sakai T. Shiozaki M, Takashina K. J Appl Phys, 1979, 50: 2369 4 中岛正三郎,高鸠邦秀,原势二郎.日本金属学会志,1991;55:830 5 Zener C., quoted by Smith C S. Trans AIME, 1948; 175: 15 6 小松肇,进藤卓嗣,谷野满.铁钢,1984;70:S1469 [1] FENG Aihan, CHEN Qiang, WANG Jian, WANG Hao, QU Shoujiang, CHEN Daolun. Thermal Stability of Microstructures in Low-Density Ti2AlNb-Based Alloy Hot Rolled Plate[J]. 金属学报, 2023, 59(6): 777-786. [2] WANG Furong, ZHANG Yongmei, BAI Guoning, GUO Qingwei, ZHAO Yuhong. First Principles Calculation of Al-Doped Mg/Mg2Sn Alloy Interface[J]. 金属学报, 2023, 59(6): 812-820. [3] GUO Fu, DU Yihui, JI Xiaoliang, WANG Yishu. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection[J]. 金属学报, 2023, 59(6): 744-756. [4] CAO Fengting, WEI Jie, DONG Junhua, KE Wei, WANG Tiegang, FAN Qixiang. Corrosion Inhibition Behavior of 1-Hydroxyethylidene-1, 1-Diphosphonic Acid on 20SiMn Steel in Simulated Concrete Pore Solution Containing Cl-[J]. 金属学报, 2020, 56(6): 898-908. [5] LIU Zhenpeng, YAN Zhiqiao, CHEN Feng, WANG Shuncheng, LONG Ying, WU Yixiong. Fabrication and Performance Characterization of Cu-10Sn-xNi Alloy for Diamond Tools[J]. 金属学报, 2020, 56(5): 760-768. [6] ZHANG Zhijie, HUANG Mingliang. In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect[J]. 金属学报, 2020, 56(10): 1386-1392. [7] Zhengguan LU,Jie WU,Lei XU,Xiaoxiao CUI,Rui YANG. Ring Rolling Forming and Properties of Ti2AlNb Special Shaped Ring Prepared by Powder Metallurgy[J]. 金属学报, 2019, 55(6): 729-740. [8] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [9] SONG Guihong,LI Guipeng,LIU Qiannan,DU Hao,HU Fang. Microstructure and Electric Conductance of Mg2(Sn, Si) Thin Films by Sputtering[J]. 金属学报, 2019, 55(11): 1469-1476. [10] Mingliang HUANG, Hongyu SUN. Interaction Between β-Sn Grain Orientation and Electromigration Behavior in Flip-Chip Lead-Free Solder Bumps[J]. 金属学报, 2018, 54(7): 1077-1086. [11] Piao GAO, Kaiwen WEI, Hanchen YU, Jingjing YANG, Zemin WANG, Xiaoyan ZENG. Influence of Layer Thickness on Microstructure and Mechanical Properties of Selective Laser Melted Ti-5Al-2.5Sn Alloy[J]. 金属学报, 2018, 54(7): 999-1009. [12] Yongyong GONG, Shumin CHENG, Yuyi ZHONG, Yunhu ZHANG, Qijie ZHAI. The Solidification Technology of Pulsed Magneto Oscillation[J]. 金属学报, 2018, 54(5): 757-765. [13] Xiaoyi ZHANG, Hailong SHANG, Bingyang MA, Rongbin LI, Geyang LI. Brazing of Coated Al Foil Filler to AlN Ceramic[J]. 金属学报, 2018, 54(4): 575-580. [14] Yu PAN, Xin LU, Chengcheng LIU, Jianzhuo SUN, Jianbo TONG, Wei XU, Xuanhui QU. Effect of Sn Addition on Densification and Mechanical Properties of Sintered TiAl Base Alloys[J]. 金属学报, 2018, 54(1): 93-99. [15] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed