Effect of Microstructure Instability on Hot Plasticity During Thermomechanical Processing in PM Nickel-Based Superalloy

doi:10.11900/0412.1961.2017.00172

Acta Metall Sin

2017, Vol. 53

Issue (11): 1469-1477 DOI: 10.11900/0412.1961.2017.00172

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Effect of Microstructure Instability on Hot Plasticity During Thermomechanical Processing in PM Nickel-Based Superalloy

Ming ZHANG^1,², Guoquan LIU^1,²(

), Benfu HU¹

1 School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China
2 Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China

Cite this article:

Ming ZHANG, Guoquan LIU, Benfu HU. Effect of Microstructure Instability on Hot Plasticity During Thermomechanical Processing in PM Nickel-Based Superalloy. Acta Metall Sin, 2017, 53(11): 1469-1477.

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Abstract

High alloying Ni-based powder metallurgy (PM) superalloys show excellent fatigue performance and damage tolerance properties, and good creep resistance at 750 ℃, and are used for advanced gas turbine disks and other hot components. The hot-working window of high alloying PM superalloy is narrow because of its poor workability. The formation of the γ+γ′ microduplex structure during the thermomechanical processing always results in a decrease in flow stress and a promotion of hot plasticity. However, the stability of the γ+γ′ microduplex structure has not been evaluated. The high temperature flow behavior of a Ni-based superalloy FGH98 prepared by hot isostatic pressing has been examined by means of uniaxial compression testing isothermally at 1060, 1105, 1138 and 1165 ℃ and at constant true strain rates between 0.01 and 10 s^-1. The microstructural evolution and instabilities during plastic flow have been studied. Under all testing conditions, the as-hipped material exhibits flow hardening, flow softening and steady-state flow sequentially with the true strain increased. The dynamic recrystallization occurs and the γ+γ′ microduplex structures are generated when steady state flow or highest strains achieved at temperatures below the γ′ solvus. The formation of the γ+γ′ microduplex structures results in a remarkable decrease in grain size and a promotion of hot plasticity. The relationships between steady-state grain sizes and steady-state stresses during deformation and the formation mechanism of the γ+γ′ microduplex structure were analyzed. The possibility of the microstructure controlling during hot working was discussed.

Key words: PM superalloy hot deformation grain size precipitate

Received: 08 May 2017

ZTFLH:	TG132.32
	TG113.12
	TG113.26

Fund: Supported by National High Technology Research and Development Program of China (No.2015AA034201) and National Natural Science Foundation of China No.51371030

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https://www.ams.org.cn/EN/10.11900/0412.1961.2017.00172 OR https://www.ams.org.cn/EN/Y2017/V53/I11/1469

Fig.1 Quantities for sizing irregular planar grain

Fig.2 Microstructure of hot isostatic pressed FGH98 alloy at 1180 ℃, 130 MPa, 3 h (a) and morphology of γ′ phase (b)

Fig.3 True stress-true strain (σ-ε) curves of hot isostatic pressed FGH98 alloy at 1060 ℃ (a), 1105 ℃ (b), 1138 ℃ (c) and 1165 ℃ (d)

Fig.4 Microstructures of as-deformed FGH98 alloy at T=1105 ℃,

ε ˙

=1 s^-1 and ε =0.2 (a), 0.4 (b), 0.6 (c) (T—temperature,

ε ˙

—strain rate)

Fig.5 Microstructures of as-deformed FGH98 alloy at ε =0.6,

ε ˙

=1 s^-1 and T=1060 ℃ (a), 1105 ℃ (b), 1138 ℃ (c) and 1165 ℃ (d)

Fig.6 Microstructures of as-deformed FGH98 alloy at ε =0.6, T=1105 ℃ and

ε ˙

=0.01 s^-1 (a), 0.1 s^-1 (b), 1 s^-1 (c) and 10 s^-1 (d)

Fig.7 TEM image of γ+γ′ microduplex structure

Fig.8 Strain induced γ-γ′ interface migration led to dissolution (a) and re-precipitation (b) of γ′phase (D, E and F are the new microduplex structures formed in discontinuous dynamic recrystallization. The arrows indicate the migration of γ-γ′ interface)

Fig.9 Processing maps at ε =0.2 (a), 0.4 (b) and 0.6 (c)

Fig.10 Effect of true strain on grain size (λ), σ and efficiency of power dissipation (η) at T=1105 ℃,

ε ˙

=1 s^-1

Fig.11 Effect of temperature on grain size, steady-state stress and efficiency of power dissipation at ε =0.6,

ε ˙

=1 s^-1 (σ_s—steady state stress)

Fig.12 Relationships between steady-state stress and steady-state grain size at ε =0.6

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