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Acta Metall Sin  2008, Vol. 44 Issue (3): 341-345     DOI:
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EFFECTS OF NiSO4 AND NaCl CONTENTS ON THROWING POWER OF SOLUTION ELECTROPLATING Ni AND Ni DEPOSIT
QU Wensheng; ZHANG Gong; LOU Langhong; DONG Jiasheng; YANG Ke
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QU Wensheng; ZHANG Gong; LOU Langhong; DONG Jiasheng; YANG Ke. EFFECTS OF NiSO4 AND NaCl CONTENTS ON THROWING POWER OF SOLUTION ELECTROPLATING Ni AND Ni DEPOSIT. Acta Metall Sin, 2008, 44(3): 341-345 .

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Abstract  Electrical conductivity is a key factor for determining the variables during electrodeposition process. In this study, several electrolytes based on Watts bath have been measured by comparing electrochemical polarization and throwing power, and the morphology of Ni deposit has also been analyzed. The results showed that high value of electrical conductivity multiplying polarizability is of great importance for enhancing the throwing power of electrolyte, and the morphology of Ni deposit is mainly dominated by electrochemical factor.
Key words:  electrical conductivity      throwing power      morphology of Ni deposite      
Received:  23 August 2007     
ZTFLH:  O646  

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https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2008/V44/I3/341

[1]Zhang H X,Wang W.Electroplating Technique.Tianjin: Tianjin Science and Technology Press,2002:50 (张宏祥,王位.电镀工艺学.天津:天津科学技术出版社,2002:501
[2]Ciszewski A,Posluszny S,Milczarek G,Baraniak M.Surf Coat Technol,2004;183:127
[3]Gao C,Lu Y,Yue S,Wang H.Trans Inst Met Finish, 1999;77:75
[4]Miluskin A S.Zashch Met,1993;29:275
[5]Gao C,Lu Y,Liu R.Plat Surf Finish,1997;47:83
[6]Gamburg Y D,Grosheva M Y,Biallozor S,Hass M.Surf Coat Technol,2002;150:95
[7]Ibrahim M A M,E1 Rehim S S A,El Wahaab S M A, Dankeria M M.Plat Surf Finish,1999;86:69
[8]Marikkannu K R,Kalaignan G P,Vasudevan T.J Alloys Compd,2007;438:332
[9]Wunsche M,Dahms W,Meyer H,Schumacher R.Elec- trochim Acta,1994;8-9:1133
[10]Hong R,Kuang S L.Electroplat Finish,1996;15(4):2 (洪榕,邝少林.电镀与涂饰,1996;15(4):2)
[11]Zheng H J,Ma C A,Zhao J Q.Electroplat Pollution Con- trol,2003;23(1):7 (郑华均,马淳安,赵建权.电镀与环保,2003;23(1):7)
[12]Abdel-Hamid Z.Mater Chem Phys,1998;53:235
[13]Zhou S M.Principle and Research Method for Metal Elec- trodeposition.Shanghai:Shanghai Science and Technol- ogy Press,1987:76 (周绍民.金属电沉积-原理与研究方法.上海:上海科学技术出版社,1987:76)
[14]Watanabe T,Minami S.J Jpn Inst Met,2000;64:67 (渡边澈,南修介.日本金属会志,2000;64:67)
[15]Winand R.Electrochim Acta,1994;38:1091
[16]Finch GI,Layton D N.J Electrodepositors Tech Soc,1951; 27:215
[17]Menzies I A,Ng C S.Trans Inst Met Finish,1969;47: 156
[18]Sibley F,Brook P A.Electrodeposition Surf Treat,1974; 2:117
[19]Jones M H,Kenez M G.Plating,1966;153:995
[20]Vagramyan A T,Fotueva T A.J Electrochem Soc,1963; 110:1030
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