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| CU/AL INTERMETALLIC COMPOUNDS FORMATION ON CU BALL AND AL ALLOY PAD BONDING JOINT DURING THERMAL AGING |
| Hui XU;; |
| 哈尔滨工业大学 |
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Cite this article:
Hui XU. CU/AL INTERMETALLIC COMPOUNDS FORMATION ON CU BALL AND AL ALLOY PAD BONDING JOINT DURING THERMAL AGING. Acta Metall Sin, 2007, 43(2): 125-130 .
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Abstract Copper ball bonding is an alternative interconnection technology that serves as a viable and cost-saving alternative to gold wire bonding which is commonly applied in microelectronic packaging. In this paper, 50μm copper wire were bonded to the Al+1%Si+0.5%Cu pad successfully by thermosonic wire bonding. Scanning Electron Microscopy, Energy Dispersive X-ray Spectrometer and Micro X-Ray Diffractomer were adopted to investigate the intermetallic compounds (IMC) at the interface of wire and pad. The results show that Cu/Al IMC growth followed the parabolic law as a function of aging times at certain aging temperatures, Cu/Al IMC growth was more sensitive to the aging temperature than the aging time, the activation energy of Cu/Al IMC growth was 85Kcal/mol and the major forming IMC were CuAl2 and Cu9Al4.
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Received: 29 May 2006
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