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| Enhancing Adhesion Between Diamond Film and WC--Co Substrate |
| LI Jianguo; Hu Dongping; MEI Jun;LIU Shi; LI Yiyi |
| Institute of Structure Mechanics; China Academy of Engineering Physics; Mianyang 621900 |
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Cite this article:
LI Jianguo; Hu Dongping; MEI Jun; LIU Shi; LI Yiyi. Enhancing Adhesion Between Diamond Film and WC--Co Substrate. Acta Metall Sin, 2006, 42(7): 763-769 .
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Abstract The effect of Murakami solution and H2 plasma treatment on the morphology and structure of tungsten carbide-cobalt has been investigated by the use of SEM and XRD. Then these pretreated tungsten carbide-cobalt tools were coated with multiple diamond film. Finally, the adhesion between diamond film and WC-Co substrate was evaluated with indentation method and drilling test. The Murakami solution treatment induced uniform corrugation on tungsten carbide-cobalt surface, as a result, the critical load of diamond film of this treatment is about 1.5kN examined with indentation method, but the diamond coated drill pretreated with Murakami solution has a bad cutting performance. H2 plasma treatment promoted WC grain more coarse and closed, thus, the critical load of diamond film of this treatment is more than 1.5kN and the diamond coated drill pretreated with H2 plasma demonstrated excellent cutting performance.
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Received: 21 June 2005
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