Effects of drawing strain on formation of filamentary structure and conductivity for Cu-12%Ag alloy

Acta Metall Sin

2005, Vol. 41

Issue (3): 255-259 DOI:

Research Articles

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Effects of drawing strain on formation of filamentary structure and conductivity for Cu-12%Ag alloy

ZHANG Lei; MENG Liang

College of Materials Science and Chemical Engineering; Zhejiang University; Hangzhou 310027

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ZHANG Lei; MENG Liang. Effects of drawing strain on formation of filamentary structure and conductivity for Cu-12%Ag alloy. Acta Metall Sin, 2005, 41(3): 255-259 .

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Abstract Cu-12%Ag (mass fraction) filamentary composite was prepared by heavy cold drawing. The evolution of filamentary microstructure and the effect of strain level on the electrical conductivity of the composite were investigated. The mechanism responsible for the electrical conductive behavior was discussed. With increasing draw ratio, the original eutectic colonies develop into fine fibrous bundles and the electrical conductivity decreases. Electrical conduction of the composite depends mainly on the Cu matrix instead of eutectic fibrous bundles. The conductive loss with strain enhancement can mainly be attributed to the reduction of interfacial spacing between the Cu matrix and eutectic fibrous bundle. The quantitative relationship between the electrical resistivity and draw ratio was derived on the basis of a size-effect model and can be utilized to predict the electrical conductive level of the composite under different strain conditions.

Key words: Cu-Ag alloy filamentary microstructure electrical conductivity

Received: 19 May 2004

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