Effects of drawing strain on formation of filamentary structure and conductivity for Cu-12%Ag alloy
ZHANG Lei; MENG Liang
College of Materials Science and Chemical Engineering; Zhejiang University; Hangzhou 310027
Cite this article:
ZHANG Lei; MENG Liang. Effects of drawing strain on formation of filamentary structure and conductivity for Cu-12%Ag alloy. Acta Metall Sin, 2005, 41(3): 255-259 .
Abstract Cu-12%Ag (mass fraction) filamentary composite was
prepared by heavy cold drawing.
The evolution of filamentary microstructure and the effect of strain
level on the electrical conductivity of the composite were
investigated. The mechanism responsible for the electrical
conductive behavior was discussed. With
increasing draw ratio, the original eutectic
colonies develop into fine fibrous bundles and the electrical
conductivity decreases. Electrical conduction of the composite
depends mainly on the Cu matrix instead of
eutectic fibrous bundles. The conductive loss
with strain enhancement can mainly be attributed to the
reduction of interfacial spacing between the Cu matrix and
eutectic fibrous bundle. The quantitative
relationship between the electrical resistivity and
draw ratio was derived on the basis of a size-effect model
and can be utilized to predict the electrical conductive level of
the composite under different strain conditions.
