Acta Metall Sin  1994, Vol. 30 Issue (7): 331-336    DOI:

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IM-SITU TEM OBSERVATION OF {110} CLEAVAGE IN Ni_3Al WITH CHARGING HYDROGEN

CHEN Mingwei; LIN Dongliang (Lin T L) (Shanghai Jiaotong University);LIANG Wei (Taiyuan University of Technology)(Manuscript received 27 October; 1993; in revised form 29 December; 1993)

CHEN Mingwei; LIN Dongliang (Lin T L) (Shanghai Jiaotong University);LIANG Wei (Taiyuan University of Technology)(Manuscript received 27 October; 1993; in revised form 29 December; 1993). IM-SITU TEM OBSERVATION OF {110} CLEAVAGE IN Ni_3Al WITH CHARGING HYDROGEN. Acta Metall Sin, 1994, 30(7): 331-336.

Abstract References Related Articles Recommended Metrics Download:  PDF(345KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The {110} cleavage fracture of Ni_3Al after charging hydrogen has been investigated by in situ TEM observation technique. The dislocations which piled up at the {111} crack tip generate high stress concentration to nucleate microcrack in {110}. In addition,hydrogen decrease the cohension of {110}.Correspondent: LIN Dongliang, professor, Department of Materials Science, Shanghai Jiaotong University.Shanghai 200030 Key words:  Ni_3Al      intermetallic compound      cleavage      dislocation piling up      Received:  18 July 1994      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1994/V30/I7/331 1GeorgeEP,HortonJA,PorterWD,SchneibelJH．JMaterRes,1990:5:16392TakasugiT．ActaMetallMater,1991;39:21573KawabataT,TakasugiT．PhilosMag,1992:65:2154BakerI,SchulsonEM,HortonJA．ActaMetall,1987;15:15335FangJ,SchulsonEM．MaterResSocProcSymp,1993;288:5256郭可信,叶恒强,吴玉琨．电子衍射图．北京:科学出版社．1983:3027KuruvillaAK,StoloffNS．ScrMetall,1985;19:838OhrSM,MaterSciEng,1985;72:19HirthJP．ScrMetallMater,1993;28:70310KawabaT,TakezonoY,KanaiT,IzumiOActaMetall,1988;36:296711BondGM,RobertsonIM,BirnbaumHK．ActaMetall,1989;37:1407 [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [7] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [8] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [9] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [10] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [11] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [12] Jianhong CHEN, Rui CAO. Micromechanism of Cleavage Fracture of Weld Metals[J]. 金属学报, 2017, 53(11): 1427-1444. [13] Xiaolong LIU,Chengqi SUN,Yantian ZHOU,Youshi HONG. EFFECTS OF MICROSTRUCTURE AND STRESS RATIO ON HIGH-CYCLE AND VERY-HIGH-CYCLE FATIGUE BEHAVIOR OF Ti-6Al-4V ALLOY[J]. 金属学报, 2016, 52(8): 923-930. [14] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [15] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed