Acta Metall Sin  1994, Vol. 30 Issue (21): 398-402    DOI:

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Na_2SO_4 INDUCED HOT CORROSION OF Ni_3Al－Fe INTERMETALLIC COMPOUND AT INTERMEDIATE TEMPERATURES

ZENG Chaoliu;ZHANG Jianqing;WU Weitao(Corrosion Science Laboratory; Institute of Corrosion and Protection of Metals; Chinese Academy of Sciences ;Shenyang)GUO Jianting (Institute of Metal Research; Chinese Academy of Sciences; Shenyang)

ZENG Chaoliu;ZHANG Jianqing;WU Weitao(Corrosion Science Laboratory; Institute of Corrosion and Protection of Metals; Chinese Academy of Sciences ;Shenyang)GUO Jianting (Institute of Metal Research; Chinese Academy of Sciences; Shenyang). Na_2SO_4 INDUCED HOT CORROSION OF Ni_3Al－Fe INTERMETALLIC COMPOUND AT INTERMEDIATE TEMPERATURES. Acta Metall Sin, 1994, 30(21): 398-402.

Abstract References Related Articles Recommended Metrics Download:  PDF(441KB)  Export:  BibTeX | EndNote (RIS)       Abstract  Ni_3Al-Fe suffers from catastrophic hot corrosion in the presence of Na_2SO_4 salt film at 700- 820 ℃,which may be ascribed to the formation of eutectic Na_2O-Na_2SO_4 melt produced by the reaction between Fe and Na_2SO_4 . Then, MoO_3, the oxidation product of Mo in the alloy, may also contribute to the electrochemical cathodic reduction, and induce rapid corrosion of Ni_3Al-Fe. The acidic conditions of molten salts established by the SO_3 produced by the reaction between Na_2SO_4 and MoO_3,and the internal sulphidation along substrate alloy may also accelerate the corrosion of Ni_3Al-Fe. Key words:  intermetallic compound      Ni_3Al-Fe      Na_2SO_4 hot corrosion      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1994/V30/I21/398 1李辉,郭建亭,谭明晖,孙超,赖万慧,王淑荷,金属学报,1992;28:A3372沈华清,曾潮流,楼翰一,王福会,郭建亭,吴维．腐蚀科学与防护技术,1993;29:B4503曾潮流,张鉴清,吴维．材料工程,1993;119:14张允书,李连方,石声泰．中国腐蚀与防护学报,1990;10:2755沈华清,曾潮流,吴维,郭建亭．金属学报,1993;29:B4506SternKH,DeanhardtML,PanayappanRm．JPhysChem,1979;83:2848 [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [7] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [8] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [9] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [10] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [11] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [12] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [13] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. [14] Manjiao CHEN,Jiankang HUANG,Cuicui HE,Yu SHI,Ding FAN. THERMODYNAMIC ANALYSIS OF THE FORMATION OF Fe-Al-Zn INTERMETALLIC COMPOUNDS IN Al/GALVANIZED STEEL INTERFACE[J]. 金属学报, 2016, 52(1): 113-119. [15] Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG. PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM[J]. 金属学报, 2015, 51(7): 873-882. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed