Acta Metall Sin  1993, Vol. 29 Issue (8): 20-24    DOI:

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APPROACH TO STRENGTHENING AND DUCTILIZING OF Fe_3Al-BASED INTERMETALLIC ALLOYS

SUN Zuqing;HUANG Yuanding;YANG Wangyue;MAO Weimin;CHEN Guoliang University of Science and Technology Beijing; Beijingprofessor;Department of Materials Science and Engineering;University of Science and Technology Beijing; Beijing 100083

SUN Zuqing;HUANG Yuanding;YANG Wangyue;MAO Weimin;CHEN Guoliang University of Science and Technology Beijing; Beijingprofessor;Department of Materials Science and Engineering;University of Science and Technology Beijing; Beijing 100083. APPROACH TO STRENGTHENING AND DUCTILIZING OF Fe_3Al-BASED INTERMETALLIC ALLOYS. Acta Metall Sin, 1993, 29(8): 20-24.

Abstract References Related Articles Recommended Metrics Download:  PDF(1534KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The properties of Fe_3Al-based intermetallic alloys at room temperature havebeen significantly improved through multi-alloying composition control and optimization ofthermomechanical process. The elongation was increased from2--3% for as-cast state to 15--20%, the yield strength up to 500 MPa. It is found that the elongated flattened grains,B_2 structure and dispersive second phase are beneficial to the comperehensive improvementof mechanical properties at room temperature. Key words:  Fe_3Al      iron aluminide      intermetallic compound      thermomechanical process      degree of long range order      Received:  18 August 1993      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1993/V29/I8/20 1 McKamey C G, DeVan J H, Tortorelli P F, Sikka V K. J Mater Res. 1991; 6: 1779 2 McKamey C G, HortonJ A, Liu C T. J Mater Res. 1989; 4: 1156 3 孙祖庆,黄原定,杨王玥,陈国良,北京科技大学学报,1991;13:539 4 孙祖庆,黄原定,陈国良,北京科技大学学报,1992;14:328 5 郭建亭,孙超,谭明晖,李辉,赖万慧,金属学报,1990;26:A20 6 孙扬善,郭军,张力宁,张谨平,金属学报,1991;27:A225x [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [7] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [8] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [9] Kai ZHU, Cuilan WU, Pan XIE, Mei HAN, Yuanrui LIU, Xiangge ZHANG, Jianghua CHEN. Microstructure and Mechanical Properties of an Austenite/Ferrite Laminate Structured High-Manganese Steel[J]. 金属学报, 2018, 54(10): 1387-1398. [10] Yi CHEN, Mingxing GUO, Long YI, Bo YUAN, Gaojie LI, Linzhong ZHUANG, Jishan ZHANG. Optimization and Controlling on the Microstructure, Texture and Properties of an Advanced Al-Mg-Si-Cu-Zn Alloy Sheet[J]. 金属学报, 2017, 53(8): 907-917. [11] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [12] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [13] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [14] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [15] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed