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| MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION |
| LI Yesheng1), WANG Wei2) |
1) School of Materials Science and Chemical Engineering, Jiangxi University of Science and Technology, Ganzhou 341000
2) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016 |
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Cite this article:
LI Yesheng WANG Wei. MEASUREMENTS OF HARDNESS AND ELASTIC MODULUS OF Cu THIN FILM BY MEANS OF NANOINDENTATION. Acta Metall Sin, 2010, 46(9): 1098-1102.
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Abstract Hardness (H) and elastic modulus (E) of 1 $\mu$m thick Cu film deposited on Si substrate were measured by means of nanoindentation technique. The E value of Cu film obtained by using single stiffness measurement (SSM) is consistent with that obtained from continuous stiffness measurement (CSM). However, the H value obtained from SSM is much smaller than that from CSM because of occurrence of significant creep during the holding period at ambient temperature. The analysis of loading curves shows that the substrate effect on hardness measurement appears as the indentation depth is about 528-587 nm, indicating the ratio of penetration depth to film thickness (about 0.5) is consistent with the finite element calculation.
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Received: 24 December 2009
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| Fund: Supported by National Natural Science Foundation of China (No.50571097) and Natural Science Foundation of Jiangxi Province (No.2007GZC0712) |
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(张泰华, 待发表) |
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