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Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能 |
田艳红1); 王春青1); 赵少伟2) |
1) 哈尔滨工业大学现代焊接生产技术国家重点实验室; 哈尔滨 150001
2) 四川西南电子设备研究所; 成都 610036 |
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ULTRASONIC BONDABILITY AND ANTIOXIDATION PROPERTY OF TiN/Ag METALLIZATION ON Cu PAD |
TIAN Yanhong1); WANG Chunqing1); ZHAO Shaowei2) |
1) 哈尔滨工业大学现代焊接生产技术国家重点实验室; 哈尔滨 150001
2) 四川西南电子设备研究所; 成都 610036 |
引用本文:
田艳红 王春青 赵少伟. Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能[J]. 金属学报, 2010, 46(5): 618-622.
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ULTRASONIC BONDABILITY AND ANTIOXIDATION PROPERTY OF TiN/Ag METALLIZATION ON Cu PAD[J]. Acta Metall Sin, 2010, 46(5): 618-622.
[1] Nieolet M A. Appl Surf Sci, 1995; 91: 269
[2] Haneda P, Aramaki K. J Electrochem Soc, 1998; 145: 1856
[3] Aoh J N, Chuang C L. J Electron Mater, 2004; 33: 300
[4] Kajiwara R, Takahashi T, Tsubosaki K. Quart J Jpn Weld Soc, 1998; 16: 93
[5] Chuang C L, Aoh J N, Din R F. Microelectron Reliab, 2006; 46: 449
[6] Takeyama M, Noya A, Taguchi M. Jpn J Appl Phys, 1996; 35: 704
[7] Hu Y Z, Sharangpani R, Tay S P. J Vac Sci Technol, 2000; 18A: 2527
[8] Tran T A, Yong L, Williams B. In: Reston V A ed., 2000 HD International Conference on High–Density Interconnect and Systems Packaging. Colorado, USA: IMAPS, SPIE, 2000: 273
[9] Chuang C L. Microelectron Eng, 2007; 84: 551
[10] Manepalli R, Stepniak F, Allen S. IEEE Trans Adv Packag, 1999; 22(1): 4
[11] Hymes S, Murarka S P, Shepard C. J Appl Phys, 1992; 71: 4623
[12] Harman G G, Johnson C E. IEEE Trans Adv Packag, 2002; 25: 667
[13] Ho H M, Lam W, Stoukatch S. Microelectron Reliab, 2003; 43: 913
[14] Tran T A, Young L, Chenl S. In: Schaefer J, ed., IEEE Electronic Components and Technology Conf, Trenton, New Jersey: IEEE, 2000: 1674
[15] Rohan J F, O’riordan G, Boardman J. Appl Surf Sci, 2002; 185: 289 |
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