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金属学报  2015, Vol. 51 Issue (2): 209-215    DOI: 10.11900/0412.1961.2014.00343
  本期目录 | 过刊浏览 |
中间层金属对Al2O3/1Cr18Ni9Ti钎焊接头组织及剪切强度的影响*
刘毅1,2(), 江国锋2, 许昆1, 罗锡明1, 陈登权1, 李伟1
1 贵研铂业股份有限公司, 昆明 650106
2 昆明贵金属研究所, 昆明 650106
EFFECT OF INTERLAYERS ON THE MICROSTRUC-TURE AND SHEAR STRENGTH OF ALUMINA CERAMIC AND 1Cr18Ni9Ti STAINLESS STEEL BRAZED BONDING
LIU Yi1,2(), JIANG Guofeng2, XU Kun1, LUO Ximing1, CHEN Dengquan1, LI Wei1
1 Sino-Platinum Metals Co. Ltd, Kunming 650106
2 Kunming Institute of Precious Metals, Kunming 650106
引用本文:

刘毅, 江国锋, 许昆, 罗锡明, 陈登权, 李伟. 中间层金属对Al2O3/1Cr18Ni9Ti钎焊接头组织及剪切强度的影响*[J]. 金属学报, 2015, 51(2): 209-215.
Yi LIU, Guofeng JIANG, Kun XU, Ximing LUO, Dengquan CHEN, Wei LI. EFFECT OF INTERLAYERS ON THE MICROSTRUC-TURE AND SHEAR STRENGTH OF ALUMINA CERAMIC AND 1Cr18Ni9Ti STAINLESS STEEL BRAZED BONDING[J]. Acta Metall Sin, 2015, 51(2): 209-215.

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摘要: 

采用Ag-Cu-Ti活性钎料连接Al2O3陶瓷与1Cr18Ni9Ti不锈钢, 研究了Cu, Ni和表面镀Ni的Cu 3种中间层金属对钎焊接头组织和剪切强度的影响. 结果表明, Cu作为中间层时, 陶瓷与钎料能形成良好的界面反应; Ni作为中间层时, 焊缝中形成大量的Ni3Ti金属间化合物, 导致陶瓷/钎料不能形成良好的反应层, 降低了接头的剪切强度; 表面镀Ni的Cu片作为中间层金属时, 少量Ni的存在不影响钎料中活性元素Ti的含量, 钎料与陶瓷能形成良好的界面反应, 同时Ni层的存在降低了钎料对Cu的溶蚀作用, 该种中间层更能有效地缓解钎焊接头的残余应力. 当Ni层的厚度为30 mm, Cu片的厚度为0.2 mm时, 接头剪切强度可达到109 MPa。

关键词 中间层金属Al2O3 陶瓷1Cr18Ni9Ti不锈钢剪切强度    
Abstract

In recent years, there have been great efforts focused on joining ceramics to metals to establish processes for a wide range of industrial uses. Several important problems, however, still remain unsolved. Among them, how to produce atomic bonds at ceramic/metal interfaces and how to minimize the residual stress due to large thermal expansion mismatch between two constituents are the most critical. The thermal expansion mismatch effect is a serious problem because, even if a strong interface could be achieved, joints with large residual stress are easily broken. Therefore, it is desirable to reduce the magnitude of the residual stress. Some researchers have succeeded in achieving a strong joint between alumina and stainless steel by using a soft metallic interlayer. In this study, the effects of interlayers of nickel, copper and copper coated with nickel on the microstructure and shear strength of alumina ceramic and 1Cr18Ni9Ti stainless steel bonding with Ag-Cu-Ti filler metal were investigated. The results indicated that, when using copper as an interlayer, sufficient interfacial reaction between the ceramic and the filler metal could obtain. However, when using nickel as an interlayer, resulting in an insufficient reaction between the ceramic and the filler metal and the formation of large amount Ni3Ti intermetallic compounds, and thus, the strength of the joint decreased heavily. It is very interesting that when using copper coated with Ni, the existence of the small amount of nickel didn't affect the activity of titanium in the filler metal, meanwhile, it decreased the effect of the filler metal on the solubility of copper. Compared with copper and Ni interlayer, this interlayer could reduce interfacial residual stress more effectively. And the shear strength of 109 MPa was obtained when the thickness of Cu was 0.2 mm coated with 30 μm thick nickel。

Key wordsmetallic interlayer    Al2O3 ceramic    1Cr18Ni9Ti stainless steel    shear strength
收稿日期: 2014-06-27     
ZTFLH:  TG132  
基金资助:*云南省应用基础研究资助项目2010ZC56
作者简介: null

刘毅, 男, 1982年生, 副研究员, 博士

图1  钎焊试样装配示意图
Material Linear expansion coefficient
α / 10-6 K-1
Elastic modulus
E / GPa
Yield Strength
s0.2 / MPa
Density
r / (g·cm-3)
Al2O3 8.0 382 - 3.90
1Cr18Ni9Ti 20 206 197 7.93
Ni 13 210 148 8.88
Cu 17 124 60 8.96
表1  母材和中间层金属的物理性能[7,8,18,19]
图2  钎焊工艺曲线
图3  剪切试样装配示意图
图4  Cu, Ni和镀Ni的Cu (镀层厚度为50 μm)作为中间层时钎焊接头整体形貌
图5  Cu, Ni和镀Ni (镀层厚度为40 μm)的Cu作为中间层时钎焊接头中钎料与陶瓷的界面
Interlayer metal Point Ag Cu Ti O Al Ni
Cu 1 2.38 96.24 1.38
2 85.32 14.68
3 1.06 33.47 36.13 24.31 5.03
Ni 1 1.64 85.43 1.38 12.93
2 86.53 10.02 3.45
3 4.93 24.17 70.90
Cu coated with 1 2.43 91.46 0.85 4.52
Ni 2 87.93 2.67 1.65 1.32
3 4.39 24.20 71.44
4 1.97 28.59 31.18 34.69 2.92
表2  图5中焊缝EDS分析
图6  镀Ni层厚度不同时钎焊接头的整体形貌
图7  不同厚度的表面镀Ni (镀层厚度为30 μm)的Cu片的钎焊接头的剪切强度
图8  镀Ni (镀层厚度为30 mm)的Cu片作为中间层金属时陶瓷侧界面反应微观组织的SEM像及元素分布
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