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Acta Metall Sin  2005, Vol. 41 Issue (3): 321-325     DOI:
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Effect of electromagnetic field on the behavior and distribution of the particles in front of metallic solidification interface
SUN Qiuxia; ZHONG Yunbo; REN Zhongming; LOU Lei; DENG Kang; XU Kuangdi
Shanghai Enhanced Laboratory of Modern Metallurgy & Materials Processing; Shanghai University; Shanghai 200072
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SUN Qiuxia; ZHONG Yunbo; REN Zhongming; LOU Lei; DENG Kang; XU Kuangdi. Effect of electromagnetic field on the behavior and distribution of the particles in front of metallic solidification interface. Acta Metall Sin, 2005, 41(3): 321-325 .

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Abstract  The quantitative relationship between the nonmetallic particle's redistribution in metal and electromagnetic force (EMF) was developed during the process of unidirectional solidification in electromagnetic field. It was pointed theoretically that controlling the cycle of the electromagnetic field and the solidified parameters could produce a new composite material in which the content of the particles is a function of the unidistance from the growing interface. Experimental results show that by applying periodical electromagnetic force to the unidirectionally solidified hypereutectic Al-19%Si alloy, the primary silicon--rich particles distributed layer by layer, and the surface hardness fluctuated periodically. Through adjusting the frequency of the electromagnetic force and the rate of the solidifying interface, the width between the two adjacent layers could be changed freely.
Key words:  electromagnetic field      behavior of the particle      solidifying interface      
Received:  23 April 2004     
ZTFLH:  TF1  
  TG244  

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https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2005/V41/I3/321

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