Effects of Initial Grain Size and Strengthening Phase on Thermal Deformation and Recrystallization Behavior of GH4096 Superalloy

doi:10.11900/0412.1961.2021.00532

Acta Metall Sin

2023, Vol. 59

Issue (7): 855-870 DOI: 10.11900/0412.1961.2021.00532

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Effects of Initial Grain Size and Strengthening Phase on Thermal Deformation and Recrystallization Behavior of GH4096 Superalloy

LI Fulin¹^,², FU Rui¹^,²(

), BAI Yunrui³, MENG Lingchao¹^,², TAN Haibing³, ZHONG Yan³, TIAN Wei³, DU Jinhui¹^,², TIAN Zhiling²

¹GaoNa Aero Material Co., Ltd., Beijing 100081, China
²Central Iron and Steel Research Institute Co., Ltd., Beijing 100081, China
³AECC Sichuan Gas Turbine Research Institute, Chengdu 610400, China

Cite this article:

LI Fulin, FU Rui, BAI Yunrui, MENG Lingchao, TAN Haibing, ZHONG Yan, TIAN Wei, DU Jinhui, TIAN Zhiling. Effects of Initial Grain Size and Strengthening Phase on Thermal Deformation and Recrystallization Behavior of GH4096 Superalloy. Acta Metall Sin, 2023, 59(7): 855-870.

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Abstract

GH4096 alloy were used for disks and shafts of advanced gas turbine engines owing to its excellent properties such as resistance to creep, fatigue, and corrosion as well as microstructure stability up to about 700^oC. In this study, GH4096, a hard-to-deform disk superalloy, was processed through an advanced cast and wrought route to avoid the expensive power metallurgy (P/M) route. Many types of full-scale disk forgings possessing homogeneous fine-grained microstructures were successfully carried out, and the ultrasonic inspectability was comparative to that of the alloy produced by the P/M route. The effects of the initial grain size and strengthening phase on hot deformation behavior and dynamic recrystallization (DRX) were studied by OM, SEM, EBSD, and TEM under different deformation parameters. The results showed that as the initial grain size decreased within the temperature range of 1050-1120^oC, the flow peak stresses decreased and the fractions of DRX increased. With an increase in the initial grain size, the thermal deformation temperature required for complete dynamic recrystallization decreased, and also the critical strain of dynamic recrystallization decreased. The initial grain size and the strain did not affect the recrystallized grain size when deformed at a sub-solvus temperature. The thermal deformation constitutive equations related to the initial grain sizes were established and the activation energies of thermal deformation related to the original grain sizes were calculated. The effect of γ' phase size on the thermal deformation behavior in as-cast microstructure was studied. In the sub-solvus temperature range, the thermal deformation resistance could be effectively reduced with the increase in the size of γ' phase, the critical strain of DRX was decreased, and the DRX fraction was also increased. The dynamic recrystallization mechanisms related to the γ' phase and initial grain size were also discussed. DRX nucleation takes place at the sub-grains near original grain boundaries for samples with larger initial grain size deformed at sub-solvus temperature. For samples with fine initial grain size, the interface slip of incoherent γ' phase is the significant dynamic softening mechanism during the sub-solvus temperature deformation. For as-cast samples, the main dynamic softening mechanism is original grain boundary bowing out DRX nucleation and coarse second-phase-induced DRX nucleation.

Key words: dynamic recrystallization initial grain size grain boundary strengthening phase GH4096 hot deformation

Received: 06 December 2021

ZTFLH:

TG146.1

Fund: China Postdoctoral Science Foundation(2017M6132235)

Corresponding Authors: FU Rui, professor, Tel: (010)62182410, E-mail: furui208@sina.com

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	Articles by authors
	LI Fulin
	FU Rui
	BAI Yunrui
	MENG Lingchao
	TAN Haibing
	ZHONG Yan
	TIAN Wei
	DU Jinhui
	TIAN Zhiling

URL:

https://www.ams.org.cn/EN/10.11900/0412.1961.2021.00532 OR https://www.ams.org.cn/EN/Y2023/V59/I7/855

Fig.1 OM images of d1-d4 samples with different initial grain sizes before hot deformation
(a) d1 (180 μm) (b) d2 (90 μm) (c) d3 (45 μm) (d) d4 (15 μm)

Fig.2 OM images (a, b) and SEM images of γ' phase (c, d) of as-cast samples treated by different processes before hot compression (a, c) c1 (1 μm) (b, d) c2 (2 μm)

Fig.3 True stress-strain curves (a-d) and peak stress curves (e) of samples d1-d4 under thermal compression at the strain rate of 0.1 s^-1 and different temperatures
(a) 1060^oC (b) 1080^oC (c) 1100^oC (d) 1120^oC (e) comparison of peak stress

Fig.4 True stress-strain curves of the two samples c1 and c2 in the as-cast state under hot compression at the sub-solvus solution temperatures of 1060^oC (a) and 1080^oC (b)

Fig.5 Critical strain of dynamic recrystallization (DRX) of samples c1 and c2 in as-cast state at the strain rate of 0.1 s^-1

Table 1 ɑ values of samples d1-d4 under different true strains

Table 2 Average ɑ values, stress index n and thermal deformation activation energies Q of samples d1-d4

Fig.6 Peak stress of sample d2 as a function of strain rate ( $ε ˙$ ) (a) and temperature (T) (b)

Fig.7 Peak stress of samples d1 (a) and d2 (b) as a function of Z parameters

Fig.8 OM images of samples d1 (a, b), d2 (c, d), d3 (e, f), and d4 (g, h) under hot compression at different temperatures, the strain rate of 0.1 s^-1, and the engineering strain of 50% (a, c, e, g) 1120^oC (b, d, f, h) 1080^oC

Fig.9 OM images of fine grained d4 sample deformed at 1100^oC, 0.1 s^-1 and different engineering strains
(a) 30% (b) 50% (c) 70%

Fig.10 Dynamic recrystallization critical strain of the samples d1-d4 during thermal compression

Fig.11 Grain boundary-subgrain boundary recrystallization structure evolution diagrams (a-d) and orientation analyses (e-g) of d2 sample obtained by EBSD after hot compression at 1100^oC (HAGB—high angle grain boundary, LAGB—low angle grain boundary, SB—subgrain boundary) (a, e) 50% engineering strain (b, f) 70% engineering strain (c, d, g) 80% engineering strain

Fig.12 EBSD images of the grain boundary-subgrain boundary recrystallization structure of d4 sample after hot compression at 1100^oC
(a) 30% engineering strain (b) 50% engineering strain

Fig.13 TEM images of coarsen grained d2 samples after hot compression at 1100^oC, 0.1 s^-1
(a) 30% engineering strain (b) 50% engineering strain

Fig.14 TEM images of fine grained d4 samples after hot compression at 1100^oC, 0.1 s^-1 and different engineering strains (SF—stacking fault)
(a) 30% engineering strain (b) 50% engineering strain (c, d) 70% engineering strain

Fig.15 EBSD images of grain boundary-subgrain boundary of cast samples c1 (a, c) and c2 (b, d) after hot compression (50%, 0.1 s^-1)
(a, b) 1060^oC (c, d) 1080^oC

Fig.16 SEM images of c2 sample after thermal deformation at 1060^oC, 50%, and 0.1 s^-1, showing the interaction between γ' phase and recrystallized grains
(a) coasening of the γ' phase in the DRX grain boundary (b) DRX grains interacting with γ' phase

Fig.17 TEM images of as-cast c1 and c2 samples after hot compression 50% at 1060^oC, 0.1 s^-1 (a, b) c1 sample, grain boundary absorbing lots of dislocation lines (c, d) c2 sample, showing γ' stimulated DRX nucleation

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