Electromigration,electroless Ni-P,interfacial reaction,intermetallic compound,failure," /> Electromigration,electroless Ni-P,interfacial reaction,intermetallic compound,failure,"/> Electromigration,electroless Ni-P,interfacial reaction,intermetallic compound,failure,"/> Ni-P消耗对焊点电迁移失效机理的影响
Please wait a minute...
Acta Metall Sin  2013, Vol. 49 Issue (1): 81-86    DOI: 10.3724/SP.J.1037.2012.00401
Current Issue | Archive | Adv Search |
EFFECT OF ELECTROLESS Ni-P CONSUMPTION ON THE FAILURE MECHANISM OF SOLDER JOINTS DURING ELECTROMIGRATION
HUANG Mingliang, ZHOU Shaoming, CHEN Leida, ZHANG Zhijie
School of Materials Science & Engineering, Dalian University of Technology, Dalian 116024
Cite this article: 

HUANG Mingliang, ZHOU Shaoming, CHEN Leida, ZHANG Zhijie. EFFECT OF ELECTROLESS Ni-P CONSUMPTION ON THE FAILURE MECHANISM OF SOLDER JOINTS DURING ELECTROMIGRATION. Acta Metall Sin, 2013, 49(1): 81-86.

Download:  PDF(983KB) 
Export:  BibTeX | EndNote (RIS)      
Abstract  

The consumption of electroless Ni-P and its effect on the failure mechanism of solder joints duringelectromigration under a current density of 1.0×104 A/cm2 at both 150 and 200℃ wereinvestigated using line-type Cu/Sn/Ni-P solder joints. Before the electroless Ni-P was completely consumed,the microstructural evolution of the Sn/Ni-P interface (cathode) was the formation of Ni2SnP and Ni3P accompanied by the consumption of the electroless Ni-P. Ni atoms diffused from the electroless Ni--P into the Sn solder under electron current stressing. Most Ni atoms precipitated as (Cu, Ni)6Sn5 or (Ni, Cu)3Sn4 in the Sn solder, and few Ni atoms could arrive at the opposite Cu/Sn interface (anode). After the electroless Ni-P was completely consumed, the microstructural evolutions of the Sn/Ni-P interface (cathode) were the formation of voids and the transformation from Ni3P to Ni2SnP. Furthermore, cracks that resulted from the propagation of voids significantly increased the current density through solder joints, and thus greatly enhanced the Joule heating of solder joints, resulting in the failure of solder joints by the fusing of Sn solder.

 
Key words:  Electromigration')" href="#">     
Received:  06 July 2012     
Service
E-mail this article Electromigration|electroless Ni-P|interfacial reaction|intermetallic compound|failure”. Please open it by linking:https://www.ams.org.cn/EN/abstract/abstract20989.shtml" name="neirong"> Electromigration|electroless Ni-P|interfacial reaction|intermetallic compound|failure">
Add to citation manager
E-mail Alert
RSS
Articles by authors
HUANG Mingliang
ZHOU Shaoming
CHEN Leida
ZHANG Zhijie

URL: 

https://www.ams.org.cn/EN/10.3724/SP.J.1037.2012.00401     OR     https://www.ams.org.cn/EN/Y2013/V49/I1/81

[1] Chen C, Tong H M, Tu K N. Annu Rev Mater Res, 2010; 40: 531


[2] Chan Y C, Yang D. Prog Mater Sci, 2010; 55: 428

[3] Zeng G, Xue S B, Zhang L, Gao L L, Dai W, Luo J D. J Mater Sci: Mater Electron, 2010; 21: 421

[4] Kumar A, He M, Chen Z, Teo P S. Thin Solid Films, 2004; 462--463: 4138

[5] Huang M L, Ye S, Zhao N. J Mater Res, 2011; 26: 3009

[6] Huang M L, Zhou S M, Chen L D. J Electron Mater, 2012; 41: 730

[7] Chen L D, Huang M L, Zhou S M. In: Scott N ed.,

 Proceedings IEEE 60th Electronic Components and Technology Conference (ECTC 2010), Las Vegas, 2010: 176

[8] Chang C W, Yang S C, Tu C T, Kao C R. J Electron Mater, 2007; 36: 1455

[9] Saunders N, Miodownik A P. Alloy Phase Diagrams, 1990; 11: 278

[10] Lu C T, Tseng H W, Chang C H, Huang T S, Liu C Y. Appl Phys Lett, 2010; 96: 232103

[11] Yang Q L, Shang P J, Guo J D, Liu Z Q, Shang J K. J Mater Res, 2009; 24: 2767

[12] Dyson B F, Anthony T R, Turnbull D. J Appl Phys, 1967; 38: 3408

[13] Lin Y H, Hu Y C, Tsai C M, Kao C R, Tu K N. Acta Mater, 2005; 53: 2029

[14] Tsai J Y, Hu Y C, Tsai C M, Kao C R. J Electron Mater, 2003; 32: 1203

[15] Huang M L, Kang N, Huang Y Z. J Mater Sci Technol, 2012; 28(in press)
[1] SHEN Yingying, ZHANG Guoxing, JIA Qing, WANG Yumin, CUI Yuyou, YANG Rui. Interfacial Reaction and Thermal Stability of the SiCf/TiAl Composites[J]. 金属学报, 2022, 58(9): 1150-1158.
[2] SONG Qingzhong, QIAN Kun, SHU Lei, CHEN Bo, MA Yingche, LIU Kui. Interfacial Reaction Between Nickel-Based Superalloy K417G and Oxide Refractories[J]. 金属学报, 2022, 58(7): 868-882.
[3] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580.
[4] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654.
[5] WANG Chao, ZHANG Xu, WANG Yumin, YANG Qing, YANG Lina, ZHANG Guoxing, WU Ying, KONG Xu, YANG Rui. Mechanisms of Interfacial Reaction and Matrix Phase Transition in SiCf /Ti65 Composites[J]. 金属学报, 2020, 56(9): 1275-1285.
[6] ZHANG Zhijie, HUANG Mingliang. In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect[J]. 金属学报, 2020, 56(10): 1386-1392.
[7] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388.
[8] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228.
[9] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614.
[10] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358.
[11] Feng QIU, Haotian TONG, Ping SHEN, Xiaoshuang CONG, Yi WANG, Qichuan JIANG. Overview: SiC/Al Interface Reaction and Interface Structure Evolution Mechanism[J]. 金属学报, 2019, 55(1): 87-100.
[12] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076.
[13] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823.
[14] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868.
[15] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600.
No Suggested Reading articles found!