Acta Metall Sin  1989, Vol. 25 Issue (3): 137-142    DOI:

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EXPERT SYSTEM IMEC FOR RETRIEVAL AND PREDICTION OF BINARY INTERMETALLC COMPOUNDS

ZHOU Ban;JIN Shiming;SHAO Jun;CHEN Nianyi Shanghai Institute of Metallurgy; Academia Sinica

ZHOU Ban;JIN Shiming;SHAO Jun;CHEN Nianyi Shanghai Institute of Metallurgy; Academia Sinica. EXPERT SYSTEM IMEC FOR RETRIEVAL AND PREDICTION OF BINARY INTERMETALLC COMPOUNDS. Acta Metall Sin, 1989, 25(3): 137-142.

Abstract References Related Articles Recommended Metrics Download:  PDF(405KB)  Export:  BibTeX | EndNote (RIS)       Abstract  An expert system, IMEC, for the retrieval and prediction of binaryintermetallic compounds has been built in our laboratory. The rules found by che-mical bond parameter-pattern recognition method have been used for computerizedprediction. Data base of known intermetallic compounds and chemical bond parame-ters of metallic elements and the knowledge processing system are included in theexpert system. By man-machine interfacing, the formation, stoichiometry and crystaltype of all biliary intermetallic compounds can be predicted or retrieved. Key words:  binary system      intermetallic compound      expert system      Received:  18 March 1989      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1989/V25/I3/137 1 Chen Nianyi. Scientia Sinica, 1975; 18: 517 2 Chen Nianyi, Xie Leiming, Shi Tianshen, Jiang Naixiong, Li Qingzhi. Scientia Sinica, 1981; 24: 1528． 3 Jiang Naixiong, Chen Nianyi, Xu Hua. Scientia Sinica, 1982; B25: 1 4 Chen Nianyi, Xu Hua, Ning Yuantao. J. Mol Sci, 1983 (1) : 115 S 陈念贻,徐桦,朱建中,杨传铮.金属学报,1983;19:A251 6 宁远涛,陈念贻.稀有金属,1985;4:31 7 陈念贻,徐桦,杨传铮,宁远涛,郑云.金属学报,1987;23:B145 8 朱建中,徐桦,陈念贻,李庆芝,倪素文.计算机与应用化学,198(3) :259 [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [4] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [5] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [6] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [7] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [8] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [9] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [10] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [11] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [12] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [13] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. [14] Manjiao CHEN,Jiankang HUANG,Cuicui HE,Yu SHI,Ding FAN. THERMODYNAMIC ANALYSIS OF THE FORMATION OF Fe-Al-Zn INTERMETALLIC COMPOUNDS IN Al/GALVANIZED STEEL INTERFACE[J]. 金属学报, 2016, 52(1): 113-119. [15] Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG. PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM[J]. 金属学报, 2015, 51(7): 873-882. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed