Acta Metall Sin  1995, Vol. 31 Issue (1): 24-28    DOI:

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DISLOCATION FEATURES IN FeAl INTERMETALLIC COMPOUND AFTER DEFORMATION AT HIGH TEMPERATURE

LIU Yi; LI Dingqiang; LIN Dongliang; CHEN Shipu(Shanghai Jiaotong University;200030;State Key Laboratory of Solid State Microstructures of Nanjing University; 210008);ZHAO Xiaoning;HONG Jianming(Nanjing University;210080)(Manuscript received 94-04-21)

LIU Yi; LI Dingqiang; LIN Dongliang; CHEN Shipu(Shanghai Jiaotong University;200030;State Key Laboratory of Solid State Microstructures of Nanjing University; 210008);ZHAO Xiaoning;HONG Jianming(Nanjing University;210080)(Manuscript received 94-04-21). DISLOCATION FEATURES IN FeAl INTERMETALLIC COMPOUND AFTER DEFORMATION AT HIGH TEMPERATURE. Acta Metall Sin, 1995, 31(1): 24-28.

Abstract References Related Articles Recommended Metrics Download:  PDF(388KB)  Export:  BibTeX | EndNote (RIS)       Abstract  The dislocation features in FeAl intermetallic compound deformed at 900℃have been investigated by TEM.A large number of sqaure dislocation loops and helical dipoles have been found．The loops are identified to have the Burgers vector[100] and lie on(100)planes due to vacancy condensation. The helices are identified to have the Burgers vector [111] and result from the climb process of screw [111] dislocation at high temperature.One evidences indicate that further climb of the helical dipoles could result in another kind of loop which has the same Burgers vector as the dipoles and lies on the planes perpendicular to the Burgers vector．It is assumed that the climb of dislocation is responsible for the high ductility of FeAl compound at high temperature.correspondent:(LIN Dongliang，professor,Department of Materials Science，Shanghai Jiaotong University，Shanghai 200030) Key words:  FeAl      intermetallic compound      dislocation loop      helix      climb      Received:  18 January 1995      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1995/V31/I1/24 1GaydoshDJ,DraperSL,NathalMV．MetallTrans,1989;20A:17012XiaoH,BakerI．ScrMetallMater,1993:28:14113UmakoshiY,YamaguchiM．PhilosMag,1980;A41:5734UmakoshiY,YamaguchiM．PhilosMag,1981;A44:7115MendirattaMG,KimHK,LipsittHA．MetallTrans,1984;15A:3956黄孝瑛．电子显微镜图像分析原理与应用．北京:宇航出版社,1989:2697 HirthJP,LotheJ．TheoryofDislocations．2nded,NewYork:Wiley,1982:6258MunroePR,BakerI．ActaMetallMater,1991;39:10118 [1] DING Zongye, HU Qiaodan, LU Wenquan, LI Jianguo. In Situ Study on the Nucleation, Growth Evolution, and Motion Behavior of Hydrogen Bubbles at the Liquid/ Solid Bimetal Interface by Using Synchrotron Radiation X-Ray Imaging Technology[J]. 金属学报, 2022, 58(4): 567-580. [2] ZHOU Lijun, WEI Song, GUO Jingdong, SUN Fangyuan, WANG Xinwei, TANG Dawei. Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System[J]. 金属学报, 2022, 58(12): 1645-1654. [3] LIANG Jinjie, GAO Ning, LI Yuhong. Interaction Between Interstitial Dislocation Loop and Micro-Crack in bcc Iron Investigated by Molecular Dynamics Method[J]. 金属学报, 2020, 56(9): 1286-1294. [4] Hua JI,Yunlai DENG,Hongyong XU,Weiqiang GUO,Jianfeng DENG,Shitong FAN. The Influence of Welding Line Energy on the Microstructure and Property of CMT Overlap Joint of 5182-Oand HC260YD+Z[J]. 金属学报, 2019, 55(3): 376-388. [5] Liqun CHEN, Zhengchen QIU, Tao YU. Effect of Ru on the Electronic Structure of the [100](010) Edge Dislocation in NiAl[J]. 金属学报, 2019, 55(2): 223-228. [6] CAO Lihua, CHEN Yinbo, SHI Qiyuan, YUAN Jie, LIU Zhiquan. Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder[J]. 金属学报, 2019, 55(12): 1606-1614. [7] HE Xianmei, TONG Liuniu, GAO Cheng, WANG Yichao. Effect of Nd Content on the Structure and Magnetic Properties of Si(111)/Cr/Nd-Co/Cr Thin Films Prepared by Magnetron Sputtering[J]. 金属学报, 2019, 55(10): 1349-1358. [8] Min ZHANG, Erlong MU, Xiaowei WANG, Ting HAN, Hailong LUO. Microstructure and Mechanical Property of the Welding Joint of TA1/Cu/ X65 Trimetallic Sheets[J]. 金属学报, 2018, 54(7): 1068-1076. [9] Huijun KANG, Jinling LI, Tongmin WANG, Jingjie GUO. Growth Behavior of Primary Intermetallic Phases and Mechanical Properties for Directionally Solidified Al-Mn-Be Alloy[J]. 金属学报, 2018, 54(5): 809-823. [10] Ning ZHAO,Jianfeng DENG,Yi ZHONG,Luqiao YIN. Evolution of Interfacial Intermetallic Compounds in Ni/Sn-xCu/Ni Micro Solder Joints Under Thermomigration During Soldering[J]. 金属学报, 2017, 53(7): 861-868. [11] Dawei WANG,Shichao XIU. Effect of Bonding Temperature on the Interfacial Micro-structure and Performance of Mild Steel/Austenite Stainless Steel Diffusion-Bonded Joint[J]. 金属学报, 2017, 53(5): 567-574. [12] Zhijie ZHANG,Mingliang HUANG. Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect[J]. 金属学报, 2017, 53(5): 592-600. [13] Ping DENG, Qunjia PENG, En-Hou HAN, Wei KE, Chen SUN, Haihong XIA, Zhijie JIAO. Study of Irradiation Damage in Domestically Fabricated Nuclear Grade Stainless Steel[J]. 金属学报, 2017, 53(12): 1588-1602. [14] Zongyue BI,Jun YANG,Haizhang LIU,Wanpeng ZHANG,Yaobin YANG,Lei TIAN,Xiaojiang HUANG. INVESTIGATION ON THE WELDING PROCESS AND MICROSTRUCTURE AND MECHANICAL PROPERTY OF BUTT JOINTS OF TA1/X65 CLAD PLATES[J]. 金属学报, 2016, 52(8): 1017-1024. [15] Liangshun LUO,Tong LIU,Yanning ZHANG,Yanqing SU,Jingjie GUO,Hengzhi FU. MICROSTRUCTURE EVOLUTION AND GROWTH BE-HAVIORS OF FACETED PHASE IN DIRECTIONALLY SOLIDIFIED Al-Y ALLOYS I. Microstructure Evolution of Directionally Solidified Al-15%Y Hypereutectic Alloy[J]. 金属学报, 2016, 52(7): 859-865. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed