|
|
THEORETICAL STUDY ON HEAT TRANSFER PERFORMANCE OF DIRECTIOANLLY SOLIDIFIED POROUS COPPER HEAT SINK |
CHEN Liutao, ZHANG Huawei, LIU Yuan, LI Yanxiang |
Key Laboratory for Advanced Materials Processing Technology, Ministry of Education, Department of Mechanical Engineering, Tsinghua University, Beijing 100084 |
|
Cite this article:
CHEN Liutao ZHANG Huawei LIU Yuan LI Yanxiang. THEORETICAL STUDY ON HEAT TRANSFER PERFORMANCE OF DIRECTIOANLLY SOLIDIFIED POROUS COPPER HEAT SINK. Acta Metall Sin, 2012, 48(11): 1374-1380.
|
Abstract Porous copper with long cylindrical pores fabricated by unidirectional solidification of metal-gas eutectic system can be used to manufacture a special kind of micro-channel heat sink. In order to simplify the heat transfer analysis, a fin model was introduced into the theoretical study on heat transfer performance of directionally solidified porous copper heat sink. The heat transfer performance of porous copper heat sink was also tested by experiments, and it was found that experimental values are far less than theoretical predicted ones. That is because the structure of porous copper might deviate from its ideal structure, such as, some pores are not penetrated, and the distribution of pore size and pore location is not uniform. After the model was modified by introducing area ratio of penetrating pores and mean diameter of penetrating pores, the theoretical results were consistent with the experimental results. Thus the analytical method based on the fin model in this paper can be used to predict the heat transfer performance of directionally solidified porous copper heat sink. According to the theoretical analysis, porous copper used for heat sink with excellent heat transfer performance should have the following porous structure: the pore diameter is 0.1-0.6 mm, the porosity is 30%-70%, the height of porous copper is more than 4 mm when its length along the direction of pore axis is 20 mm.
|
Received: 14 May 2012
|
Fund: Supported by National Natural Science Foundation of China (Nos.u0837603 and 51101092) |
[1] Mahajan R, Nair R, Wakharkar V, Swan J, Tang J, Vandentop G. Int Technol J Semicond Technol Manuf, 2002; 6: 61[2] Tuckerman D B, Pease R F W. IEEE Electron Dev Lett, 1981; 2: 126[3] Rosa P, Karayiannis T G, Collins M W. Appl Therm Eng, 2009; 29: 3447[4] Wei X J. J Electron Packag, 2004; 126: 60[5] Ogushi T, Chiba H, Nakajima H, Ikeda T. J Appl Phys, 2004; 95: 5843[6] Chiba H, Ogushi T, Nakajima H, Torji K, Tomimura T, Ono F. J Appl Phys, 2008; 103: 013515[7] Liu Y, Li Y X, Zhang H W, Wang J. Acta Metall Sin, 2005; 41: 886(刘源, 李言祥, 张华伟, 万疆. 金属学报, 2005; 41: 886)[8] Liu Y, Li Y X, Wan J, Zhang H W. Mater Sci Eng, 2005; A402: 47[9] Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1165(张华伟, 李言祥, 刘源. 金属学报, 2006; 42: 1165)[10] Li Y X, Liu Y, Zhang H W, Wang X. In: Nakajima H, Kanetake N eds., Proc Met Foam 2005, Sendai: The Japan Institute of Metals, 2006: 237[11] Zhang H W, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1171(张华伟, 李言祥, 刘 源. 金属学报, 2006; 42: 1171)[12] Wang X, Li Y X, Liu Y. Acta Metall Sin, 2006; 42: 1075(王雪, 李言祥, 刘源. 金属学报, 2006; 42: 1075)[13] Ogushi T, Chiba H, Nakajima H. In: Nakajima H, Kanetake N eds., Proc Met Foam 2005, Sendai: The Japan Institute of Metals, 2006: 27[14] Chiba H, Ogushi T, Nakajima H. In: Nakajima H, KanetakeN eds., Proc Met Foam 2005, Sendai: The Japan Institute of Metals, 2006: 35[15] Chen L T, Zhang H W, Liu Y, Li Y X. Acta Metall Sin, 2012: 48: 329(陈刘涛, 张华伟, 刘源, 李言祥. 金属学报, 2012: 48: 329)[16] Yang S M, Tao W Q. Heat Transfer. 4th Ed, Beijing: Higher Education Press, 2006: 57(杨世铭, 陶文铨. 传热学. 第4版, 北京: 高等教育出版社, 2006: 57)[17] Shah R K, London A L. Laminar Flow Forced Convection In Ducts. New York: Academic Press, 1978: 148[18] Li X Q, Li Y, Ding T. Engineering Fluid Mechanics. Beijing: China Water Power Press, 2009: 120(李小芹, 李 岩, 丁 涛. 工程流体力学. 北京: 中国水利水电出版社, 2009: 120) |
No Suggested Reading articles found! |
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|