STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING
WANG Ming, ZHANG Bin, LIU Changsheng, ZHANG Guangping
1) Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials and Metallurgy, Northeastern University, Shenyang 110819
2) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016
Cite this article:
WANG Ming ZHANG Bin LIU Changsheng ZHANG Guangping. STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING. Acta Metall Sin, 2011, 47(5): 601-604.
Abstract Metallization interconnects in microelectronic integrated circuits usually fail during fabrication and long-term service under electrical, mechanical, or thermal field and coupled multi-field of them, such as electromigration (EM) failure induced by direct current, stress-induced voiding (SIV) damage and thermal fatigue under thermal cyclic strain, which affect the reliability of the interconnects. Although EM and SIV have been actively investigated for several decades, there is limited work on thermal cyclic strain-induced thermal fatigue behaviors of thin metal films, which are becoming a more and more important reliability issue. In this work, the failure behavior of the 200 nm-thick Au thin films was studied through applying thermal cyclic strain generated by alternating current. The total thermal cyclic strain was determined from the temperature distribution along the Au line with a width of 6 μm according to the experiment measurement and theoretical calculation. It was found that the grain size in the Au thin films increased inhomogenously and the damage along grain boundaries resulted in the fatal failure of the Au line in the condition of Δε≦0.35% after 5$\times$10$^{6}$ cyc. Based on the experimental observations, thermal fatigue and mechanical fatigue failure behaviors were analyzed comparatively, and the basic mechanisms were discussed.
[1] Hau–Riege C S. Microelectron Reliab, 2004; 44: 195
[2] Zhang G P, Wang Z G. Acta Metall Sin, 2005; 41: l
(张广平, 王中光. 金属学报, 2005; 41: 1)
[3] Read D T. Int J Fatigue, 1998; 20: 203
[4] Schwaiger R, Kraft O. Scr Mater, 1999; 41: 823
[5] Schwaiger R, Kraft O. Acta Mater, 2003; 51: 195
[6] Zhang G P, Volkert C A, Schwaiger R, Wellner P, Arzt E, Kraft O. Acta Mater, 2006; 54: 3127
[7] Keller R R, M¨onig R, Volkert C A, Arzt E, Schwaiger R, Kraft O. AIP Proceedings of the 6th International Workshop of Stress Induced Phenomena in Metallization, New York: AIP, 2002: 119
[8] Monig R. PhD Thesis, University of Stuttgart, Germany, 2005
[9] Monig R, Keller R R, Volkert C A. Rev Sci Instrum, 2004; 75: 4997
[10] Park Y B, M¨onig R, Volkert C A. Thin Solid Films, 2007; 515: 3253
[11] Park Y B, M¨onig R, Volkert C A. Thin Solid Films, 2006; 504: 321
[12] Zhang G P, Volkert C A, Schwaiger R, M¨onig R, Kraft O. Microelectron Reliab, 2007; 47: 2007
[13] Wang M, Zhang B, Zhang G P, Liu C S. Scr Mater, 2009; 60: 803
[14] Guan Z D, Zhang Z T, Jiao J S. Inorganic Materials Physical Property. Beijing: Tsinghua University Press, 1992: 127
(关振铎, 张中太, 焦金生. 无机材料物理性能. 北京: 清华大学出版社, 1992: 127)
[15] Zhang J, Zhang J Y, Liu G, Zhao Y, Ding X D, Zhang G P, Sun J. Scr Mater, 2009; 60: 228
[16] Zhang G P, Volkert C A, Schwaiger R, Arzt E, Kraft O. J Mater Res, 2005; 20: 201
[17] Zhang B, Sun K H, Liu Y D, Zhang G P. Acta Metall Sin, 2006; 42: 1
HE Shiyu;LI Ying;LIU Jianhong Harbin Institute of Technology Faculty of Metal;Harbin Institute of Technology; Harbin. THERMAL FATIGUE CRACK IN 5CrMnMo STEEL[J]. 金属学报, 1990, 26(4): 62-65.
