微电子互连用锡基合金及复合钎料热-机械可靠性研究进展

doi:10.11900/0412.1961.2022.00593

金属学报

2023, Vol. 59

Issue (6): 744-756 DOI: 10.11900/0412.1961.2022.00593

综述

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微电子互连用锡基合金及复合钎料热-机械可靠性研究进展

郭福(

), 杜逸晖, 籍晓亮, 王乙舒

北京工业大学材料与制造学部北京 100124

Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection

GUO Fu(

), DU Yihui, JI Xiaoliang, WANG Yishu

Faculty of Materials and Manufacturing, Beijing University of Technology, Beijing 100124, China

引用本文:

郭福, 杜逸晖, 籍晓亮, 王乙舒. 微电子互连用锡基合金及复合钎料热-机械可靠性研究进展[J]. 金属学报, 2023, 59(6): 744-756.
Fu GUO, Yihui DU, Xiaoliang JI, Yishu WANG. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection[J]. Acta Metall Sin, 2023, 59(6): 744-756.

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摘要:

随着新能源汽车和5G通信等技术的快速发展，钎料及其焊点作为微电子互连中最关键的环节，往往需要在频繁的温度交变环境中长期服役，其热-机械可靠性面临更高的要求。锡基无铅钎料自21世纪初开始得到快速的发展，大量基于合金化和材料复合的研究方法对锡基无铅钎料进行成分设计，以弥补传统锡基二元、三元钎料存在的问题，获得了具有高性能、高可靠性的焊点。本文综述了近年来微电子互连用锡基合金及复合钎料的最新研究进展，对比了几种常见的钎料制备方法的优势和不足，重点梳理了锡基合金钎料以及锡基复合钎料组织性能及热-机械可靠性的研究进展，并对今后锡基无铅钎料的研究与制造前景作出展望。

关键词 ：微电子互连, 锡基无铅钎料, 组织性能, 热-机械可靠性

Abstract：

Over the past few decades, electronic products have evolved towards miniaturization, intelligence, and multi-functionality. With the rapid development of new energy vehicles and 5G mobile communication technologies, solder, the most commonly used interconnecting material in the microelectronic industry, may continuously undergo alternating temperature excursions. As a result, researchers have focused on improving the thermomechanical reliability of solder joints. For several decades, researchers have widely studied Sn-based lead-free solder and have established that adding an alloying element or foreign reinforcement can overcome the limitations of traditional Sn-based binary/ternary solder, resulting in highly reliable solder joints. Recently, the interest in Sn-based alloys and composite solders has increased due to their improved mechanical performance. However, various concerns, such as high manufacturing costs, microstructural heterogeneity, and incomplete reliability data. This paper reviews the latest research progress on Sn-based lead-free solders for microelectronic interconnection over the past five years, in particular Sn-based multi-element alloys and composite solders. First, the advantages and disadvantages of typical solder preparation methods are compared and discussed. Second, the effects of an alloying element or foreign reinforcement additions on the solder's microstructure, properties, and thermomechanical reliability are summarized. Finally, this paper presents the main problems in preparing and investigating Sn-based lead-free solders and proposes tentative solutions. The aim is to provide an essential basis for understanding the current development and future research directions for fast-evolving future application scenarios.

Key words： microelectronic interconnection Sn-based lead-free solder microstructure and property thermo-mechanical reliability

收稿日期: 2022-11-21

ZTFLH:

TG425.1

基金资助:国家自然科学基金项目(52001013);中国博士后科学基金项目(2022M710271);北京市教育委员会科研计划项目(KZ202210005002);北京市教育委员会科研计划项目(KM202310005011)

通讯作者: 郭福，guofu@bjut.edu.cn，主要从事微电子封装先进互连材料及电子封装可靠性的研究

Corresponding author: GUO Fu, professor, Tel:13911892016, E-mail: guofu@bjut.edu.cn

作者简介: 郭福，男，1971年生，教授，博士

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图1 团聚在SAC0307-0.3CeO2钎料表面的CeO2纳米颗粒[21]

图2 制备添加Cr的锡基钎料的温度曲线[31]

图3 真空熔炼法制备钎料合金示意图[35]

图4 SAC305-ZnO钎料中ZnO纳米颗粒的分布情况[36]

图5 Ag纳米颗粒包覆的多壁碳纳米管(MWCNTs)的TEM像[80]

表1 金属修饰非金属增强相在钎料中发生团聚现象导致性能降低对应的添加量[30,72,73,80~96]

图6 Al2O3纳米颗粒和游离Pr原子对金属间化合物(IMCs)作用示意图[107](a) SAC0307 (b) SAC0307-Al2O3 (c) SAC0307-Pr (d) SAC0307-Pr-Al2O3

图7 时效处理840 h后SAC0307-0.06Pr/Cu和SAC0307-0.06Pr-0.06Al2O3/Cu焊点断裂路径示意图[108]

1	Lall P, Yadav V, Suhling J, et al. Evolution of Anand parameters for thermally aged Sn-Ag-Cu lead-free alloys at low operating temperature [J]. J. Electron. Packag., 2022, 144: 021116
2	Zhong S J, Zhang L, Li M L, et al. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties [J]. Mater. Des., 2022, 215: 110439 doi: 10.1016/j.matdes.2022.110439
3	Samavatian M, Ilyashenko L K, Surendar A, et al. Effects of system design on fatigue life of solder joints in BGA packages under vibration at random frequencies [J]. J. Electron. Mater., 2018, 47: 6781 doi: 10.1007/s11664-018-6600-3
4	Hommel M, Knab H, Yousef S G. Reliability of automotive and consumer MEMS sensors—An overview [J]. Microelectron. Reliab., 2021, 126: 114252 doi: 10.1016/j.microrel.2021.114252
5	Cheng S F, Huang C M, Pecht M. A review of lead-free solders for electronics applications [J]. Microelectron. Reliab., 2017, 75: 77 doi: 10.1016/j.microrel.2017.06.016
6	Zhang L, He C W, Guo Y H, et al. Development of SnAg-based lead free solders in electronics packaging [J]. Microelectron. Reliab., 2012, 52: 559 doi: 10.1016/j.microrel.2011.10.006
7	Zhao M, Zhang L, Liu Z Q, et al. Structure and properties of Sn-Cu lead-free solders in electronics packaging [J]. Sci. Technol. Adv. Mater., 2019, 20: 421 doi: 10.1080/14686996.2019.1591168
8	Yang F, Zhang L, Liu Z Q, et al. Properties and microstructures of Sn-Bi-X lead-free solders [J]. Adv. Mater. Sci. Eng., 2016, 2016: 9265195
9	Wang F J, Chen H, Huang Y, et al. Recent progress on the development of Sn-Bi based low-temperature Pb-free solders [J]. J. Mater. Sci.: Mater. Electron., 2019, 30: 3222 doi: 10.1007/s10854-019-00701-w
10	Li Y, Lim A B Y, Luo K M, et al. Phase segregation, interfacial intermetallic growth and electromigration-induced failure in Cu/In-48Sn/Cu solder interconnects under current stressing [J]. J. Alloys Compd., 2016, 673: 372 doi: 10.1016/j.jallcom.2016.02.244
11	Liu S, Xue S B, Xue P, et al. Present status of Sn-Zn lead-free solders bearing alloying elements [J]. J. Mater. Sci.: Mater. Electron., 2015, 26: 4389 doi: 10.1007/s10854-014-2659-7
12	Curtulo J P, Dias M, Bertelli F, et al. The application of an analytical model to solve an inverse heat conduction problem: Transient solidification of a Sn-Sb peritectic solder alloy on distinct substrates [J]. J. Manuf. Process., 2019, 48: 164 doi: 10.1016/j.jmapro.2019.10.029
13	Wang X, Zhang L, Li M L. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: A review [J]. J. Mater. Sci.: Mater. Electron., 2022, 33: 2259 doi: 10.1007/s10854-021-07437-6
14	Li S, Wang X X, Liu Z Y, et al. Research status of evolution of microstructure and properties of Sn-based lead-free composite solder alloys [J]. J. Nanomater., 2020, 2020: 8843166
15	Chen G, Wu Y F. Main application limitations of lead-free composite solder doped with foreign reinforcements [J]. J. Mater. Sci.: Mater. Electron., 2021, 32: 24644 doi: 10.1007/s10854-021-06938-8
16	Rajendran S H, Cho D H, Jung J P. Comparative study on the wettability and thermal aging characteristics of SAC305 nanocomposite solder fabricated by stir-casting and ultrasonic treatment [J]. Mater. Today Commun., 2022, 31: 103814
17	Zhao Z L, Liu X, Li R, et al. Study on solder joint of SAC0307 solder paste reinforced by nano Ag/Cu particles [J]. Trans. China Weld. Inst., 2018, 39(9): 95
17	赵智力, 刘鑫, 李睿等. 纳米颗粒增强SAC0307锡膏焊点的分析 [J]. 焊接学报, 2018, 39(9): 95 doi: 10.12073/j.hjxb.2018390231
18	Xin T, Sun F L, Liu Y, et al. Study on the formation mechanism of porosity and properties of the SAC305-nano Cu composite solder paste reflowed [J]. Trans. China Weld. Inst., 2017, 38(11): 61
18	辛瞳, 孙凤莲, 刘洋等. SAC305-纳米铜复合焊膏焊后性能及孔隙形成机理 [J]. 焊接学报, 2017, 38(11): 61
19	Zhu Z, Chan Y C, Chen Z, et al. Effect of the size of carbon nanotubes (CNTs) on the microstructure and mechanical strength of CNTs-doped composite Sn0.3Ag0.7Cu-CNTs solder [J]. Mater. Sci. Eng., 2018, A727: 160
20	Li M L, Zhang L, Jiang N, et al. Influences of silicon carbide nanowires' addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion [J]. J. Mater. Sci.: Mater. Electron., 2021, 32: 18067 doi: 10.1007/s10854-021-06348-w
21	Tang Y, Guo Q W, Luo S M, et al. Formation and growth of interfacial intermetallics in Sn-0.3Ag-0.7Cu-xCeO₂/Cu solder joints during the reflow process [J]. J. Alloys Compd., 2019, 778: 741 doi: 10.1016/j.jallcom.2018.11.156
22	Wu J, Xue S B, Wang J W, et al. Effects of α-Al₂O₃ nanoparticles-doped on microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder [J]. J. Mater. Sci.: Mater. Electron., 2018, 29: 7372 doi: 10.1007/s10854-018-8727-7
23	Chellvarajoo S, Abdullah M Z. Microstructure and mechanical properties of Pb-free Sn-3.0Ag-0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process [J]. Mater. Des., 2016, 90: 499 doi: 10.1016/j.matdes.2015.10.142
24	Chen G, Cui X Z, Wu Y F, et al. Microstructural, compositional and hardness evolutions of 96.5Sn-3Ag-0.5Cu/TiC composite solder under thermo-migration stressing [J]. J. Mater. Sci.: Mater. Electron., 2020, 31: 9492 doi: 10.1007/s10854-020-03491-8
25	Chen G, Cui X Z, Wu Y F, et al. Performance of 96.5Sn-3Ag-0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing [J]. Soldering Surf. Mount Technol., 2021, 33: 35 doi: 10.1108/SSMT-02-2020-0004
26	Mohd Salleh M A A, Mcdonald S D, Terada Y, et al. Development of a microwave sintered TiO₂ reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy [J]. Mater. Des., 2015, 82: 136 doi: 10.1016/j.matdes.2015.05.077
27	Shin H, Lee S, Suk Jung H, et al. Effect of ball size and powder loading on the milling efficiency of a laboratory-scale wet ball mill [J]. Ceram. Int., 2013, 39: 8963 doi: 10.1016/j.ceramint.2013.04.093
28	Li Y, Xu L Y, Jing H Y, et al. Homogeneous dispersion of graphene and interface metallurgical bonding in Sn-Ag-Cu alloy induced by ball milling [J]. Mater. Sci. Eng., 2021, A824: 141823
29	Jing H Y, Guo H J, Wang L X, et al. Influence of Ag-modified graphene nanosheets addition into Sn-Ag-Cu solders on the formation and growth of intermetallic compound layers [J]. J. Alloys Compd., 2017, 702: 669 doi: 10.1016/j.jallcom.2017.01.286
30	Han Y D, Gao Y, Zhang S T, et al. Study of mechanical properties of Ag nanoparticle-modified graphene/Sn-Ag-Cu solders by nanoindentation [J]. Mater. Sci. Eng., 2019, A761: 138051
31	Bang J, Yu D Y, Ko Y H, et al. Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate [J]. Microelectron. Reliab., 2019, 99: 62 doi: 10.1016/j.microrel.2019.05.019
32	Wang Y, Wang Y S, Ma L M, et al. Effect of Sn grain c-axis on Cu atomic motion in Cu reinforced composite solder joints under electromigration [J]. J. Electron. Mater., 2020, 49: 2159 doi: 10.1007/s11664-019-07897-x
33	Wang Y, Wang Y S, Han J, et al. Effects of Sn grain c-axis on electromigration in Cu reinforced composite solder joints [J]. J. Mater. Sci.: Mater. Electron., 2018, 29: 5954 doi: 10.1007/s10854-018-8568-4
34	Wang Y, Han J, Guo F, et al. Effects of grain orientation on the electromigration of Cu-reinforced composite solder joints [J]. J. Electron. Mater., 2017, 46: 5877 doi: 10.1007/s11664-017-5585-7
35	Wen Y N, Zhao X C, Chen Z, et al. Reliability enhancement of Sn-1.0Ag-0.5Cu nano-composite solders by adding multiple sizes of TiO₂ nanoparticles [J]. J. Alloys Compd., 2017, 696: 799 doi: 10.1016/j.jallcom.2016.12.037
36	Hammad A E, Ibrahiem A A. Enhancing the microstructure and tensile creep resistance of Sn-3.0Ag-0.5Cu solder alloy by reinforcing nano-sized ZnO particles [J]. Microelectron. Reliab., 2017, 75: 187 doi: 10.1016/j.microrel.2017.07.034
37	Abd El-Rehim A F, Zahran H Y, Yassin A M. Microstructure evolution and tensile creep behavior of Sn-0.7Cu lead-free solder reinforced with ZnO nanoparticles [J]. J. Mater. Sci.: Mater. Electron., 2019, 30: 2213 doi: 10.1007/s10854-018-0492-0
38	Mansour M M, Fawzy A, Wahab L A, et al. Tensile characteristics of Sn-5wt%Sb-1.5wt%Ag reinforced by Nano-sized ZnO particles [J]. J. Mater. Sci.: Mater. Electron., 2019, 30: 4831 doi: 10.1007/s10854-019-00777-4
39	Callister W D, Rethwisch D G. Materials science and engineering [M]. 9th Ed., Hoboken: John Wiley and Sons Ltd., 2014: 3
40	Nguyen V S, Rouxel D, Hadji R, et al. Effect of ultrasonication and dispersion stability on the cluster size of alumina nanoscale particles in aqueous solutions [J]. Ultrason. Sonochem., 2011, 18: 382 doi: 10.1016/j.ultsonch.2010.07.003 pmid: 20667760
41	Li J W, Momono T, Tayu Y, et al. Application of ultrasonic treating to degassing of metal ingots [J]. Mater. Lett., 2008, 62: 4152 doi: 10.1016/j.matlet.2008.06.016
42	Li Q, Qiu F, Dong B X, et al. Fabrication, microstructure refinement and strengthening mechanisms of nanosized SiC_P/Al composites assisted ultrasonic vibration [J]. Mater. Sci. Eng., 2018, A735: 310
43	Li M L, Zhang L, Jiang N, et al. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review [J]. Mater. Des., 2021, 197: 109224 doi: 10.1016/j.matdes.2020.109224
44	Shen J, Pu Y Y, Yin H G, et al. Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn-Bi-based solder alloys [J]. J. Alloys Compd., 2014, 614: 63 doi: 10.1016/j.jallcom.2014.06.015
45	Wei Y H, Zhao X C, Liu Z C, et al. Impact of precipitated phases on the microstructure and mechanical properties of eutectic Sn58Bi alloy [J]. J. Alloys Compd., 2022, 903: 163882 doi: 10.1016/j.jallcom.2022.163882
46	Wei Y H, Zhao X C, Liu Z C, et al. Effects of various second phase ratios and contents on microstructure and mechanical properties of eutectic Sn58Bi alloy [J]. Mater. Des., 2022, 218: 110698 doi: 10.1016/j.matdes.2022.110698
47	Nurulakmal M S, Aili Zuriatie N. Effect of Zn and in to microstructure of aged SAC305/Cu joint [J]. Mater. Today: Proc., 2022, 66: 3014
48	Kong X X, Zhai J J, Sun F L, et al. Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints [J]. Microelectron. Reliab., 2020, 107: 113618 doi: 10.1016/j.microrel.2020.113618
49	Du Y H, Wang Y S, Ji X L, et al. Impact of Ni-coated carbon fiber on the interfacial (Cu,Ni)₆Sn₅ growth of Sn-3.5Ag composite solder on Cu substrate during reflow and isothermal aging [J]. Mater. Today Commun., 2022, 31: 103572
50	Sivakumar P, O'donnell K, Cho J. Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders [J]. Mater. Today Commun., 2021, 26: 101787
51	Beáta Š, Erika H, Ingrid K. Development of SnAgCu solders with Bi and In additions and microstructural characterization of joint interface [J]. Weld. World, 2017, 61: 613 doi: 10.1007/s40194-017-0446-9
52	Chen Y Y, You K D, Yu S T, et al. Optimization of mechanical properties of Sn-3.8Ag-0.7Cu alloys by the additions of Bi, In and Ti [J]. Prog. Nat. Sci.: Mater. Int., 2022, 32: 643 doi: 10.1016/j.pnsc.2022.10.004
53	Rashidi R, Naffakh-Moosavy H. Metallurgical, physical, mechanical and oxidation behavior of lead-free chromium dissolved Sn-Cu-Bi solders [J]. J. Mater. Res. Technol., 2021, 13: 1805 doi: 10.1016/j.jmrt.2021.05.055
54	Rashidi R, Naffakh-Moosavy H. The influence of chromium addition on the metallurgical, mechanical and fracture aspects of Sn-Cu-Bi/Cu solder joint [J]. J. Mater. Res. Technol., 2021, 15: 3321 doi: 10.1016/j.jmrt.2021.10.015
55	Albrecht H J, Bartl K H G, Kruppa W, et al. Soldering material based on Sn Ag and Cu [P]. US Pat, 10376994B2, 2019
56	Tao Q B, Benabou L, Nguyen Van T A, et al. Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni [J]. J. Alloys Compd., 2019, 789: 183 doi: 10.1016/j.jallcom.2019.02.316
57	Zhong Y, Liu W, Wang C Q, et al. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling [J]. Mater. Sci. Eng., 2016, A652: 264
58	Zhu T K, Zhang Q K, Bai H L, et al. Investigations on deformation and fracture behaviors of the multi-alloyed SnAgCu solder and solder joint by in-situ observation [J]. Microelectron. Reliab., 2022, 135: 114574 doi: 10.1016/j.microrel.2022.114574
59	Lee N C, Geng J, Zhang H W, et al. Novel solder alloy with wide service temperature capability for automotive applications [A]. 2018 IEEE 68th Electronic Components and Technology Conference [C]. San Diego: IEEE, 2018: 2336
60	Zhang L, Tu K N. Structure and properties of lead-free solders bearing micro and Nano particles [J]. Mater. Sci. Eng., 2014, R82: 1
61	Kanlayasiri K, Mongkolwongrojn M, Ariga T. Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy [J]. J. Alloys Compd., 2009, 485: 225 doi: 10.1016/j.jallcom.2009.06.020
62	Mehreen S U, Nogita K, Mcdonald S D, et al. Effect of Ni, Zn, Au, Sb and In on the suppression of the Cu₃Sn phase in Sn-10 wt.%Cu alloys [J]. J. Electron. Mater., 2021, 50: 881 doi: 10.1007/s11664-020-08709-3
63	Tikale S, Prabhu K N. Development of low-silver content SAC0307 solder alloy with Al₂O₃ nanoparticles [J]. Mater. Sci. Eng., 2020, A787: 139439
64	Huo F P, Jin Z, Le Han D, et al. Interface design and the strengthening-ductility behavior of tetra-needle-like ZnO whisker reinforced Sn1.0Ag0.5Cu composite solders prepared with ultrasonic agitation [J]. Mater. Des., 2021, 210: 110038 doi: 10.1016/j.matdes.2021.110038
65	Yin L M, Zhang Z W, Su Z L, et al. Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu-xSiC solder joints [J]. Mater. Sci. Eng., 2021, A809: 140995
66	Li Z H, Tang Y, Guo Q W, et al. Effects of CeO₂ nanoparticles addition on shear properties of low-silver Sn-0.3Ag-0.7Cu-xCeO₂ solder alloys [J]. J. Alloys Compd., 2019, 789: 150 doi: 10.1016/j.jallcom.2019.03.013
67	Dele-Afolabi T T, Azmah Hanim M A, Ojo-Kupoluyi O J, et al. Impact of different isothermal aging conditions on the IMC layer growth and shear strength of MWCNT-reinforced Sn-5Sb solder composites on Cu substrate [J]. J. Alloys Compd., 2019, 808: 151714 doi: 10.1016/j.jallcom.2019.151714
68	Vidyatharran K, Azmah Hanim M A, Dele-Afolabi T T, et al. Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish [J]. J. Mater. Res. Technol., 2021, 15: 2497 doi: 10.1016/j.jmrt.2021.09.067
69	Jung D H, Sharma A, Jung J P. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor [J]. J. Alloys Compd., 2018, 743: 300 doi: 10.1016/j.jallcom.2018.02.017
70	Mo L P, Hu S C, Zhou Z, et al. Wettability and shear strength of SAC305 based composite solder with co-doping X (Ni or Al₂O₃) and CNTs reinforcements [A]. 19th International Conference on Electronic Packaging Technology [C]. Shanghai: IEEE, 2018: 1415
71	Yao P, Liu P, Liu J. Effects of multiple reflows on intermetallic morphology and shear strength of SnAgCu-xNi composite solder joints on electrolytic Ni/Au metallized substrate [J]. J. Alloys Compd., 2008, 462: 73 doi: 10.1016/j.jallcom.2007.08.041
72	Sun H Y, Chan Y C, Wu F S. Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints [J]. Mater. Sci. Eng., 2016, A656: 249
73	Khodabakhshi F, Zareghomsheh M, Khatibi G. Nanoindentation creep properties of lead-free nanocomposite solders reinforced by modified carbon nanotubes [J]. Mater. Sci. Eng., 2020, A797: 140203
74	Sayyadi R, Khodabakhshi F, Javid N S, et al. Influence of graphene content and nickel decoration on the microstructural and mechanical characteristics of the Cu/Sn-Ag-Cu/Cu soldered joint [J]. J. Mater. Res. Technol., 2020, 9: 8953 doi: 10.1016/j.jmrt.2020.06.026
75	Pal M K, Gergely G, Koncz-Horváth D, et al. Investigation of the electroless nickel plated sic particles in SAC305 solder matrix [J]. Powder Metall. Met. Ceram., 2020, 58: 529 doi: 10.1007/s11106-020-00107-y
76	Gain A K, Chan Y C. The influence of a small amount of Al and Ni nano-particles on the microstructure, kinetics and hardness of Sn-Ag-Cu solder on OSP-Cu pads [J]. Intermetallics, 2012, 29: 48 doi: 10.1016/j.intermet.2012.04.019
77	Yakymovych A, Švec P, Orovcik L, et al. Nanocomposite SAC solders: The effect of adding Ni and Ni-Sn nanoparticles on morphology and mechanical properties of Sn-3.0Ag-0.5Cu solders [J]. J. Electron. Mater., 2018, 47: 117 doi: 10.1007/s11664-017-5834-9
78	Lai Y Q, Hu X W, Jiang X X, et al. Effect of Ni addition to Sn0.7Cu solder alloy on thermal behavior, microstructure, and mechanical properties [J]. J. Mater. Eng. Perform., 2018, 27: 6564 doi: 10.1007/s11665-018-3734-7
79	Gain A K, Zhang L C. Effects of Ni nanoparticles addition on the microstructure, electrical and mechanical properties of Sn-Ag-Cu alloy [J]. Materialia, 2019, 5: 100234 doi: 10.1016/j.mtla.2019.100234
80	Kim J, Jung K H, Kim J H, et al. Electromigration behaviors of Sn58%Bi solder containing Ag-coated MWCNTs with OSP surface finished PCB [J]. J. Alloys Compd., 2019, 775: 581 doi: 10.1016/j.jallcom.2018.10.028
81	Wang H G, Zhang K K, Zhang M. Fabrication and properties of Ni-modified graphene nanosheets reinforced Sn-Ag-Cu composite solder [J]. J. Alloys Compd., 2019, 781: 761 doi: 10.1016/j.jallcom.2018.12.080
82	Park H J, Lee C J, Min K D, et al. Microstructures and mechanical properties of the Sn58wt.%Bi composite solders with Sn decorated MWCNT particles [J]. J. Electron. Mater., 2019, 48: 1746 doi: 10.1007/s11664-018-06882-0
83	Lee C J, Min K D, Park H J, et al. Effect of Sn-decorated MWCNTs on the mechanical reliability of Sn-58Bi solder [J]. Electron. Mater. Lett., 2019, 15: 693 doi: 10.1007/s13391-019-00176-1
84	Sharma A, Srivastava A K, Ahn B. Microstructure, wetting, and tensile behaviors of Sn-Ag alloy reinforced with copper-coated carbon nanofibers produced by the melting and casting route [J]. Metall. Mater. Trans., 2019, 50A: 5384
85	Han Y D, Nai S M L, Jing H Y, et al. Development of a Sn-Ag-Cu solder reinforced with Ni-coated carbon nanotubes [J]. J. Mater. Sci.: Mater. Electron., 2011, 22: 315 doi: 10.1007/s10854-010-0135-6
86	Yang Z B, Zhou W, Wu P. Effects of Ni-coated carbon nanotubes addition on the microstructure and mechanical properties of Sn-Ag-Cu solder alloys [J]. Mater. Sci. Eng., 2014, A590: 295
87	Qu M, Gao Z X, Chen J, et al. Effect of Ni-coated carbon nanotubes addition on the wettability, microhardness, and shear strength of Sn-3.0Ag-0.5Cu/Cu lead-free solder joints [J]. J. Mater. Sci.: Mater. Electron., 2022, 33: 10866 doi: 10.1007/s10854-022-08067-2
88	Yang L Z, Zhou W, Liang Y H, et al. Improved microstructure and mechanical properties for Sn58Bi solder alloy by addition of Ni-coated carbon nanotubes [J]. Mater. Sci. Eng., 2015, A642: 7
89	Lee C J, Hwang B U, Min K D, et al. Bending reliability of Ni-MWCNT composite solder with a differential structure [J]. Microelectron. Reliab., 2020, 113: 113934 doi: 10.1016/j.microrel.2020.113934
90	Lee C J, Min K D, Jeong H, et al. The fabrication of Ni-MWCNT composite solder and its reliability under high relative humidity and temperature [J]. J. Electron. Mater., 2020, 49: 6746 doi: 10.1007/s11664-020-08426-x
91	Mao J, Yang W C, Song Q Q, et al. The effects of the addition of CNT@Ni on the hardness, density, wettability and mechanical properties of Sn-0.7Cu lead-free solder [J]. J. Mater. Sci.: Mater. Electron., 2021, 32: 10843 doi: 10.1007/s10854-021-05742-8
92	Chantaramanee S, Wisutmethangoon S, Sikong L, et al. Development of a lead-free composite solder from Sn-Ag-Cu and Ag-coated carbon nanotubes [J]. J. Mater. Sci.: Mater. Electron., 2013, 24: 3707 doi: 10.1007/s10854-013-1307-y
93	Min K D, Lee C J, Park H J, et al. Microstructures and mechanical properties of Sn-58wt.% Bi solder with Ag-decorated multiwalled carbon nanotubes under 85^oC/85% relative humidity environmental conditions [J]. J. Electron. Mater., 2020, 49: 1527 doi: 10.1007/s11664-019-07863-7
94	Lee C J, Min K D, Park H J, et al. Mechanical properties of Sn-58wt%Bi solder containing Ag-decorated MWCNT with thermal aging tests [J]. J. Alloys Compd., 2020, 820: 153077 doi: 10.1016/j.jallcom.2019.153077
95	Lee C J, Myung W R, Park B G, et al. Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package [J]. J. Mater. Sci.: Mater. Electron., 2020, 31: 10170 doi: 10.1007/s10854-020-03562-w
96	Xu L Y, Chen X, Jing H Y, et al. Design and performance of Ag nanoparticle-modified graphene/SnAgCu lead-free solders [J]. Mater. Sci. Eng., 2016, A667: 87
97	Dele-Afolabi T T, Hanim M A A, Calin R, et al. Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions [J]. Microelectron. Reliab., 2020, 110: 113681 doi: 10.1016/j.microrel.2020.113681
98	Sun R, Sui Y W, Qi J Q, et al. Influence of SnO₂ nanoparticles addition on microstructure, thermal analysis, and interfacial IMC growth of Sn1.0Ag0.7Cu solder [J]. J. Electron. Mater., 2017, 46: 4197 doi: 10.1007/s11664-017-5374-3
99	Yassin A M, Zahran H Y, Abd El-Rehim A F. Effect of TiO₂ nanoparticles addition on the thermal, microstructural and room-temperature creep behavior of Sn-Zn based solder [J]. J. Electron. Mater., 2018, 47: 6984 doi: 10.1007/s11664-018-6624-8
100	Choi K, Yu D Y, Ahn S, et al. Joint reliability of various Pb-free solders under harsh vibration conditions for automotive electronics [J]. Microelectron. Reliab., 2018, 86: 66 doi: 10.1016/j.microrel.2018.05.006
101	Wang Y, Zhao X C, Liu Y, et al. Microstructure, wetting property of Sn-Ag-Cu-Bi-xCe solder and IMC growth at solder/Cu interface during thermal cycling [J]. Rare Met., 2021, 40: 714 doi: 10.1007/s12598-015-0526-1
102	Wu C M L, Yu D Q, Law C M T, et al. Properties of lead-free solder alloys with rare earth element additions [J]. Mater. Sci. Eng., 2004, R44: 1
103	Wu J, Xue S B, Wang J W, et al. Effect of Pr addition on properties and Sn whisker growth of Sn-0.3Ag-0.7Cu low-Ag solder for electronic packaging [J]. J. Mater. Sci.: Mater. Electron., 2017, 28: 10230 doi: 10.1007/s10854-017-6790-0
104	Zhang L, Yang F, Zhong S J. Effect of Nd on whiskers growth behavior of SnAgCu solders in electronic packaging [J]. J. Mater. Sci.: Mater. Electron., 2016, 27: 9584 doi: 10.1007/s10854-016-5012-5
105	Xue P, He P, Long W M, et al. Influence of rare earths, Ga element and their synergistic effects on the microstructure and properties of lead-free solders [J]. Trans. China Weld. Inst., 2021, 42(4): 1
105	薛鹏, 何鹏, 龙伟民等. 稀土、Ga元素及其协同效应对无铅钎料组织和性能的影响 [J]. 焊接学报, 2021, 42(4): 1
106	Wu J, Xue S B, Wang J W, et al. Coupling effects of rare-earth Pr and Al₂O₃ nanoparticles on the microstructure and properties of Sn-0.3Ag-0.7Cu low-Ag solder [J]. J. Alloys Compd., 2019, 784: 471 doi: 10.1016/j.jallcom.2019.01.034
107	Wu J, Xue S B, Huang G Q, et al. In-situ synergistic effect of Pr and Al₂O₃ nanoparticles on enhancing thermal cycling reliability of Sn-0.3Ag-0.7Cu/Cu solder joint [J]. J. Alloys Compd., 2022, 905: 164152 doi: 10.1016/j.jallcom.2022.164152
108	Wu J, Xue S B, Wang J W, et al. Effect of in-situ formed Pr-coated Al₂O₃ nanoparticles on interfacial microstructure and shear behavior of Sn-0.3Ag-0.7Cu-0.06Pr/Cu solder joints during isothermal aging [J]. J. Alloys Compd., 2019, 799: 124 doi: 10.1016/j.jallcom.2019.05.226
109	El-Daly A A, Eid N A M, Ibrahiem A A. Synergic effect of Te, Ni and MWCNT on creep behavior and microstructural evolution of Sn-1.0Ag-0.7Cu low-Ag solder [J]. J. Alloys Compd., 2022, 902: 163808 doi: 10.1016/j.jallcom.2022.163808
110	El-Daly A A, Ibrahiem A A, Eid N A M. Development of Sn-1.0Ag-0.7Cu composite solder with improved resistivity and strength-ductility synergy through additions of Ni, Te and MWCNT [J]. J. Mater. Sci.: Mater. Electron., 2021, 32: 19871 doi: 10.1007/s10854-021-06512-2

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