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电解铜箔镀锌工艺的研究 |
冷大光;胡京江;郭宗训;徐树民 |
山东招远金宝电子有限公司;山东招远;265400;山东招远金宝电子有限公司;山东招远;265400;山东招远金宝电子有限公司;山东招远;265400;山东招远金宝电子有限公司;山东招远;265400 |
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RESEARCH OF GALVANIZED PROCESS OF ELECTROLYTIC COPPER FOIL |
LENG Daguang;HU Jingjiang;GUO Zongxun;XU Shumin (Zhaoyuan;JINBAO Electronics Co. Ltd; Shandong 265400) |
引用本文:
冷大光;胡京江;郭宗训;徐树民. 电解铜箔镀锌工艺的研究[J]. 金属学报, 1998, 34(11): 1227-1229.
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RESEARCH OF GALVANIZED PROCESS OF ELECTROLYTIC COPPER FOIL[J]. Acta Metall Sin, 1998, 34(11): 1227-1229.
1 张继世,刘江金属表面工艺.北京:机械工业出版社,1995:75(Zhan J S, Liu J.Technology of Metal Surface.Bejing:Machinery Industry Press,1995:75) 2 朱庚惠,谭亮,朱修业,李静波.中级电镀工工艺学.北京:机械工业出版社,1988:54(Zhu G H,Tan L,Zhu X Y,Li J B.Middle Plating Technology.Bejing:Machinery Industry Press,1988:54 |
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