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Acta Metall Sin  1998, Vol. 34 Issue (8): 892-896    DOI:
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STUDY ON THE PROCESS OF COPPER ELECTRODEPOSITION ON PLATINUM (111)
YIN Renhe; CAO Weimin; SHI Wenguang(Department of Chemistry; Shanghai University; Shanghai 201800)SUN Jielin(Institute of Nuclear Research; The Chinese Academy of Sciences; Shanghai 201800)MAO Bingwei; SUN Shigang(State Key Laboratory for Physics Chemistry of the Solid Surface; Xiamen University; Xiamen 361005)Correspondent: YIN Renhe; associate profsson Tel: (021)59532932-272; Fax: (021)59529932;E-mail: papayaly online. sh. ch
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YIN Renhe; CAO Weimin; SHI Wenguang(Department of Chemistry; Shanghai University; Shanghai 201800)SUN Jielin(Institute of Nuclear Research; The Chinese Academy of Sciences; Shanghai 201800)MAO Bingwei; SUN Shigang(State Key Laboratory for Physics Chemistry of the Solid Surface; Xiamen University; Xiamen 361005)Correspondent: YIN Renhe; associate profsson Tel: (021)59532932-272; Fax: (021)59529932;E-mail: papayaly online. sh. ch. STUDY ON THE PROCESS OF COPPER ELECTRODEPOSITION ON PLATINUM (111). Acta Metall Sin, 1998, 34(8): 892-896.

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Abstract  C-V curves of copper electrodeposition on Pt(111) showed that there were two stages of underpotential and bulk deposition for copper electrodeposition process. Single layer growth at underpotential deposition and three dimensional nucleation growth at bulk deposition had been in situ observed by electrochemical scanning tunneling microscopy (ECSTM) at different potentials and times. The reflection electron microscopy (REM) images also revealed three dimensional growth of Cu deposition at high overpotential. All of these results demonstrated Stranski-Krastanov growth mechanism of copper on Pt(111).
Key words:  underpotential deposition      ECSTM      REM      Stranski-Krastanov growth mechanism     
Received:  18 August 1998     
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