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| EFFECT OF Bi ON SHEAR STRENGTH OF Sn3Ag0.5Cu-xBi/Cu SOLDER JOINTS |
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| 大连理工大学 |
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Cite this article:
. EFFECT OF Bi ON SHEAR STRENGTH OF Sn3Ag0.5Cu-xBi/Cu SOLDER JOINTS. Acta Metall Sin, 2008, 44(4): 473-477 .
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Abstract The effect of Bi on the shear strength for Sn-3Ag-0.5Cu-xBi(x=0,1,3)/Cu solders joints has been studied after being aged at 140℃ and 195℃. The results indicate that fracture type changes from ductile fracture to brittle fracture with the increasing of IMC. Shear strength for Sn3Ag0.5Cu solder joints changes slightly when aged at lower temperature, but increases with the prolonging of the aging time and sharply drop at final by adding of Bi. When aged at higher temperature, shear strength for each kind solder joint decreases with the prolonging of aging time. Although the shear strength is relatively higher by adding Bi, the difference is small. It is seems that Bi can improve the shear strength by strengthening solder and decreasing the growth of IMC.
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Received: 13 August 2007
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