EFFECT OF PROCESSING PARAMETERS ON SOLID-LIQUID INTERFACE OF Nb-Si BASE ALLOY FABRICATED BY ELECTROMAGNETIC COLD CRUCIBLE DIRECTIONAL SOLIDIFICATION

doi:10.11900/0412.1961.2013.00835

Acta Metall Sin

2014, Vol. 50

Issue (9): 1039-1045 DOI: 10.11900/0412.1961.2013.00835

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EFFECT OF PROCESSING PARAMETERS ON SOLID-LIQUID INTERFACE OF Nb-Si BASE ALLOY FABRICATED BY ELECTROMAGNETIC COLD CRUCIBLE DIRECTIONAL SOLIDIFICATION

YAN Yuncheng^1,², DING Hongsheng¹(

), SONG Jinxia², KANG Yongwang², CHEN Ruirun¹, GUO Jingjie¹

1 National Key Laboratory for Precision Hot Processing of Metals, Harbin Institute of Technology, Harbin 150001
2 Science and Technology on Advanced High Temperature Structural Materials Laboratory, Beijing Institute of Aeronautical Materials, Beijing 100095

Cite this article:

YAN Yuncheng, DING Hongsheng, SONG Jinxia, KANG Yongwang, CHEN Ruirun, GUO Jingjie. EFFECT OF PROCESSING PARAMETERS ON SOLID-LIQUID INTERFACE OF Nb-Si BASE ALLOY FABRICATED BY ELECTROMAGNETIC COLD CRUCIBLE DIRECTIONAL SOLIDIFICATION. Acta Metall Sin, 2014, 50(9): 1039-1045.

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Abstract

Nb-Si base alloys have attracted considerable attentions as the potential high temperature structural materials working in the service temperature range of 1200~1400 ℃ because of their high melting points (>1750 ℃), moderate densities (6.6~7.2 g/cm³) and excellent high temperature strength. However, the mismatching between room temperature fracture toughness and high temperature strength has limited their practical applications. Directional solidification (DS) and alloying have been proved to be the effective methods to overcome this critical issue. The DS processes used to prepare Nb-Si base alloys included Czochralski directional solidification in a copper crucible, electron beam directional solidification, optical floating zone melting, integrally directional solidification and electromagnetic cold crucible directional solidification (ECCDS). The previous studies focused on the effect of process parameters on microstructure and mechanical properties in the steady-state growth region (SSGR). However, the microstructure in the SSGR was controlled by the solid-liquid interface, and the solid-liquid interface was controlled by process parameters. Therefore, the study about the effect of process parameters on solid-liquid interface was very important. In this work, the master alloy with the nominal composition of Nb-22Ti-16Si-3Cr-3Al-2Hf (atomic fraction, %) was prepared by vaccum non-consumable arc-melting first, and then induction skull melting. The DS experiments were performed in the ECCDS device equipped with a square water cooled copper crucible (internal dimension: 26 mm×26 mm×120 mm) and a Ga-In alloy pool. There were three processing parameters in ECCDS including heating power of power supply, withdrawal rate and holding time. The DS ingots were prepared according to the orthogonal test (L₉(3³)). Instability degree was defined as the ratio of the height of solid-liquid interface to the width of the DS ingot. The results showed that there were three macroscopic morphologies of solid-liquid interfaces; the increase of holding time, decrease of withdrawal rate and elevation of heating power were conducive to keeping the solid-liquid interface macroscopic morphology planar. With the increase of withdrawal rate, primary dendrite arm spacing (d₁) and secondary dendrite arm spacing (d₂) decreased gradually; with the increase of heating power, d₁ and d₂ increased gradually; with the increase of holding time, d₁ and d₂ increased first and then decreased. The higher withdrawal rate, lower heating power and less holding time were beneficial to refining the d₁ and d₂.

Key words: electromagnetic cold crucible directional solidification instability degree solid-liquid interface processing parameter primary dendrite arm spacing secondary dendrite arm spacing

Received: 24 December 2013

ZTFLH:

TB331

Fund: Supported by National Natural Science Foundation of China (No.51171053)

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	Yuncheng YAN
	Hongsheng DING
	Jinxia SONG
	Yongwang KANG
	Ruirun CHEN
	Jingjie GUO

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https://www.ams.org.cn/EN/10.11900/0412.1961.2013.00835 OR https://www.ams.org.cn/EN/Y2014/V50/I9/1039

Table 1 Level factor table of orthogonal test L₉(3³)

Table 2 Orthogonal test table and visual analysis of the measurement results

Fig.1 OM images of S/L interface (H is the vertical distance from the highest point of the S/L interface to the straight line)

(a) Oex-2 (b) Oex-4 (c) Oex-5

Fig.2 Tendency chart of the instability degree of S/L interface

Table 3 Visual analysis of D_i

Fig.3 OM image of S/L interfaces of Oex-4 sample

Fig.4 Tendency chart of the primary dendrite arm spacing of primary Nbss

Table 4 Visual analysis of d₁ of the primary Nbss at S/L interface

Table 5 Visual analysis of d₂ of the primary Nbss at S/L interface

Fig.5 Tendency chart of the secondary dendrite arm spacing of primary Nbss

Fig.6 Lateral heat transfer schematic of electromagnetic cold crucible directional solidification (1—water-cooled copper crucible, 2—skin layer, 3—skull border determined by heat transfer, 4—molten pool, 5—directional solidification texture. d and d represent the depth of skin layer and the thickness of skull, respectively)

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