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Acta Metall Sin  2009, Vol. 45 Issue (4): 405-409    DOI:
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ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM
WANG Guangjun; WANG Dezhi; ZHOU Jie; WU Zhuangzhi; XU Bing
1. Key Laboratory of Nonferrous Metal Materials Science and Engineering; Ministry of Education; Central South University; Changsha 410083
2. School of Materials Science and Engineering; Central South University; Changsha 410083
Cite this article: 

WANG Guangjun WANG Dezhi ZHOU Jie WU Zhuangzhi XU Bing. ELECTROLESS PLATING Cu ON Mo POWDER AND ITS REACTION MECHANISM. Acta Metall Sin, 2009, 45(4): 405-409.

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Abstract  

By using Sn–Pd catalyst system, the electroless plating Cu on the surface of Mo powder was performed to fabricate Cu/Mo composite powder. Composition, morphology and formation process of Cu/Mo particles were analyzed by XRD, SEM/EDS and XPS. The formation mechanism of Cu/Mo particles can be described as follows: the PdCl2 (activator) deposited on the surface of Mo particles firstly and then was reduced by SnCl2 (sensitizer) to nano Pd particles, which are the nucleation sites for Cu depositionfinally Cu coating formed.

Key words:  electroless plating Cu      Mo powder      Cu/Mo coposite powder      reaction mechanism     
Received:  17 April 2008     
ZTFLH: 

TQ153.1

 

URL: 

https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2009/V45/I4/405

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