Acta Metall Sin  2006, Vol. 42 Issue (6): 647-652     DOI:

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Microstructure and Fracture of Pb-free Solder Interconnects in Ceramic Ball Grid Array Packages under Thermal Cycling

WANG Wei; WANG Zhongguang; XIAN Aiping; SHANG Jianku

中国科学院金属所

WANG Wei; WANG Zhongguang; XIAN Aiping; SHANG Jianku. Microstructure and Fracture of Pb-free Solder Interconnects in Ceramic Ball Grid Array Packages under Thermal Cycling. Acta Metall Sin, 2006, 42(6): 647-652 .

Abstract References Related Articles Recommended Metrics Download:  PDF(551KB)  Export:  BibTeX | EndNote (RIS)       Abstract  Microstructure and thermal fatigue behavior of Pb-free solder interconnects in ceramic ball grid array (BGA) packages were examined by cross-sectional microscopy, thermal cycling experiments and finite element modeling. The BGA assemblies were made by reflow soldering Sn-Ag-Cu solder balls between Ag-metallized multilayer ceramic chip and Cu-metallized printed circuit board using the eutectic Sn-Ag-Cu solder paste. In the as-reflowed condition, Cu6Sn5 and Ag3Sn intermetallic compounds (IMCs) were formed at the solder interfaces with Cu and Ag metallizations respectively. Following thermal cycling, the Cu6Sn5 layer grew thicker and Cu3Sn IMC was found at the interface with Cu metallization. On the ceramic side, visible thickening of the Ag3Sn layer was also observed. The Ag3Sn in the solder near the interface went through a morphological change from the needle shape to spherical. As a result of repeated thermal cycling, fatigue cracks developed in the solder interconnects. The fatigue crack appeared first at the corner of the solder ball with the chip, where the maximum shear stress was found by the finite element analysis. Subsequent growth of the fatigue cracks led to final fracture of the solder interconnects. The cracks preferred to propagate along the Cu6Sn5/solder interface on the side of the print circuit board and in the solder joint near the interfacial Ag3Sn layer on the ceramic side. Key words:  Pb-free solder      interconnect      ceramic ball grid array (CBGA)       Received:  01 November 2005      ZTFLH:  TB302.3     TB303   Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors WANG Wei WANG Zhongguang XIAN Aiping SHANG Jianku URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y2006/V42/I6/647 [1] Xie D J, Wang Z P. Finite Elem Anal Design, 1998; 30: 31 [2] IPC (Association Connecting Electronics Industries). Moisture/Reflow Sensitivity Classification for Nonher-metic Solid State Surface Mount Devices. Joint Industry Standard, IPC/JEDEC J-STD-020C, 2004 [3] Sharif A, Islam M N, Chan Y C. Mater Sci Eng, 2004; B13: 84 [4] Allen S L, Notis M R, Chromik R R, Vinci R P. J Mater Res, 2004; 19: 1417 [5] Tu P L, Chan C, Hung C, Lai J K L. Microelectron Reliab, 2001; 41: 87 [6] Tu P L, Chan C, Hung C, Lai J K L. Microelectron Reliab, 2001; 41: 1993 [7] Xu X H. 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