Acta Metall Sin  1988, Vol. 24 Issue (3): 229-235    DOI:

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PLASMA CHEMICAL VAPOR DEPOSITED TiN FILMS

LI Shizhi;XU Xiang Qingdao Institute of Chemical Technology; Qingdao; ShandongProfessor;Thin Solid Films Lab.;Qingdao Institute of Chemical Technology;53 Zhengzhou Road; Qingdao; Shandong

LI Shizhi;XU Xiang Qingdao Institute of Chemical Technology; Qingdao; ShandongProfessor;Thin Solid Films Lab.;Qingdao Institute of Chemical Technology;53 Zhengzhou Road; Qingdao; Shandong. PLASMA CHEMICAL VAPOR DEPOSITED TiN FILMS. Acta Metall Sin, 1988, 24(3): 229-235.

Abstract References Related Articles Recommended Metrics Download:  PDF(2012KB)  Export:  BibTeX | EndNote (RIS)       Abstract  TiN films were deposited onto high speed steel, Si(100) and Si(111) substrates using D. C. PCVD method. The crystallographic structure, surfacemorphology, fracture cross section, microhardness and the chlorine content of thePCVD TiN films were studied. Part of the samples were analyzed using SIMS, AESand ESCA. Experimental results indicated that the structure and properties of theTiN films on different substrates were almost the same when the same depositionparameters were used. At about 500℃, the mode of the film growth undergoes achange probably from layer growth to island growth. The PCVD TiN films had aratio N/Ti of 1, and revealed strong (200) texture. A mixed region existed betweenthe films and the substrates. It could be concluded that PCVD TiN films show goodadherence and excellent wear resistant properties, and are suitable for anti-frictioncoating. Key words:  plasma chemical vapor deposition      TiN film      Received:  18 March 1988      Service E-mail this article Add to citation manager E-mail Alert RSS （） Articles by authors URL:  https://www.ams.org.cn/EN/     OR     https://www.ams.org.cn/EN/Y1988/V24/I3/229 1 Li Shizhi, Huang Wu, Yang Hongshun, Wang Zhongshu. Plasma Chemistry and Plasma Processing 1984; 4: 148 2 Archer N J. Thin Solid Films, 1981; 80: 221 3 Rosler R S, Benjing W C, Baldo J. Solid State Technol, 1976; 19: 45 4 Bachmann P. In: Timmermans C J ed., 7th Int Symp Plasma Chemistry, Vol. 1, Eindhoven, The Netherlands, 1985: 7 5 土居阳,村上义夫.真空,1985;28:213 6 徐翔,谢雁,赵程,李世直.真空科学与技术,1985;5:77 7 #12 8 Thornton J A. Ann Rev Mater Sci, 1977; 7: 239 9 Veprek S., Thin Solid Films, 1985; 130: 135 10 Veprek S. In: Kaldis E ed., Current Topics in Materials Science Vol. 4, Amsterdam: North-Holland, 1980: 151 11 王兴源.青岛化工学院学报,1980;1:48 12 杨洪顺,李世直.(未发表结果) 13 Vook R W. Int Metall Rev, 1982; 27: 209 14 Li Shizhi, Yang Hongshun. In: Timmermans C J ed., 7th Ini Symp Plasma Chemistry, Vol. 1, Eindhoven, The Netherlands, 1985: 68 15 石玉龙,李世直.青岛化工学院学报,1988;1: 16 Sundgren J-E. Ttin Solid Films, 1985; 128: 21 17 Matthews A, Lefkow A R. Thin Solid Films, 1985; 126: 283 [1] Huiying SHI, Chao YANG, Bailing JIANG, Bei HUANG, Di WANG. Influences of Target Peak Current Density on the Microstructure and Mechanical Properties of TiN Films Deposited by Dual Pulsed Power Magnetron Sputtering[J]. 金属学报, 2018, 54(6): 927-934. [2] YU Li; LIU Jiwen;ZHAO Jie; DAI Shaoxia;JIN Zhujing;WANG Huijun(State Key Laboratory of Corroston and Protection;Institute of Corroston and Protection of Metals; Chinese Academy of Sciences;Shenyang;110015)( Metallurgical College; Mianjing Universily;Tianjin 300400 )(Manuscript received 1995-12-06; in revised form 1996-09-02). EFFECT OF SUBSTRATE TEMPERATURE ON THE PROPERTIES OF ION PLATING TiN FILMS[J]. 金属学报, 1996, 32(12): 1270-1274. [3] LIU Hanwei;CHEN Yuanru (Southwest Jiaotong University; Chengdu)ZHANG Xushou (Laboratory of Solid Lubrication; Lanzhou institute of Chemical Physics;Chinese Academy of Sciences; Lanzhou). TRIBOLOGICAL PROPERTIES OF TiN FILM BY ION BEAM ASSISTED DEPOSITION[J]. 金属学报, 1994, 30(19): 323-326. [4] ZHAO Cheng;PENG Hongrui;LI Shizhi Qingdao Institute of Chemical Technology. PLASMA CHEMICAL VAPOUR DEPOSITION OF Ti-N-C FILMS[J]. 金属学报, 1993, 29(1): 87-92. [5] LIU Changqing; LI Meishuan; JIN Zhujing; WU Weitao (Corrosion Science Lab.; Institute of Corrosion and Protection of Metals; Academia Sinica. Shenyang 110015). TENSILE AND ADHESIVE STRENGTHS OF FINE TiN FILM ON Ti SUBSTRATE[J]. 金属学报, 1992, 28(9): 91-94. [6] WANG Xi;YANG Genqing;LIU Xianghuai;ZHENG Zhihong;HUANG Wei;ZHOU Zuyao;ZOU Shichang Ion Beam Laboratory; Shanghai Institute of Metallurgy; Academia Sinica. PREPARATION OF TiN FILMS BY N_2 ASSISTED Xe~+ ION BEAM ENHANCED DEPOSITION AND THEIR MECHANICAL PROPERTIES[J]. 金属学报, 1992, 28(3): 87-91. [7] WANG Xi;ZHOU Jiankun;CHEN Youshan;LIU Xianghuai;ZOU Shichang Ion Beam Laboratory; Shanghai Institute of Metallurgy; Academia Sinica. COMPUTER SIMULATION OF ION BEAM ENHANCED DEPOSITION OF TiN FILMS[J]. 金属学报, 1991, 27(3): 136-141. [8] ZHOU Jiankun;LIU Xianghuai;CHEN Youshan;WANG Xi;ZHENG Zhihong;HUANG Wei;ZOU Shichang Shanghai Institute of Metallurgy. Academia Sinica Ion Beam Laboratory;Shanghai Institute of Metallurgy;Academia Sinica; Shanghai 200050. SYNTHESIS OF TiN FILM BY ION BEAM ENHANCED DEPOSITION AND ITS PROPERTIES[J]. 金属学报, 1990, 26(2): 136-141. No Suggested Reading articles found! Viewed Full text Abstract Cited   Shared      Discussed