Research Progress and Outlook of Metal Whisker Spontaneous Growth on MAX Phase Substrates

doi:10.11900/0412.1961.2021.00119

Acta Metall Sin

2022, Vol. 58

Issue (3): 295-310 DOI: 10.11900/0412.1961.2021.00119

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Research Progress and Outlook of Metal Whisker Spontaneous Growth on MAX Phase Substrates

TIAN Zhihua¹, ZHANG Peigen¹(

), LIU Yushuang², LU Chengjie¹, DING Jianxiang³, SUN Zhengming¹(

)

^1.Jiangsu Key Laboratory of Advanced Metallic Materials, School of Materials Science and Engineering, Southeast University, Nanjing 211189, China
^2.Jiangsu Key Laboratory of Advanced Structural Materials and Application Technology, School of Materials Science and Engineering, Nanjing Institute of Technology, Nanjing 211167, China
^3.Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education, School of Materials Science and Engineering, Anhui University of Technology, Ma'anshan 243002, China

Cite this article:

TIAN Zhihua, ZHANG Peigen, LIU Yushuang, LU Chengjie, DING Jianxiang, SUN Zhengming. Research Progress and Outlook of Metal Whisker Spontaneous Growth on MAX Phase Substrates. Acta Metall Sin, 2022, 58(3): 295-310.

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Abstract

The spontaneous growth of metal whiskers, most notably tin whiskers, has a long history, and the electronics industry has suffered greatly as a result. Pb additive had previously deactivated research on the whiskering phenomenon, but the toxicity of lead alarmed people at the beginning of the century. Nevertheless, intricate conditions involved in the whisker growth research and the multifarious phenomena have hampered the research on this topic; therefore, a comprehensive understanding of the metal whisker growth has been absent. A related whiskering phenomenon on MAX phase substrates has been investigated in recent years, and the occurrence of MAX phase, compared with the whisker growth on metallic substrates, exhibits good repeatability, a short incubation period, a fast growth rate, and rich composition varieties. Therefore, the MAX phase as a new platform of whisker growth investigation is expected to speed up the understanding of the mechanisms related to this phenomenon. Regarding the general background of spontaneous metal whisker growth and our group's current findings, this review summarizes the current status of spontaneous metal whisker growth on MAX phase substrates, discusses and describes the growth mechanism from the two main processes of crystal growth (nucleation and growth), and concludes with a perspective on future research and potential applications of spontaneous whisker growth on the MAX phase substrates.

Key words: metal whisker spontaneous growth MAX phase mitigation strategy lead-free reliability

Received: 23 March 2021

ZTFLH:

TQ174

Fund: National Key Research and Development Program of China(2017YFE0301403);National Natural Science Foundation of China(51731004);Natural Science Foundation of Jiangsu Province(BK20201283)

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	Zhihua TIAN
	Peigen ZHANG
	Yushuang LIU
	Chengjie LU
	Jianxiang DING
	Zhengming SUN

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https://www.ams.org.cn/EN/10.11900/0412.1961.2021.00119 OR https://www.ams.org.cn/EN/Y2022/V58/I3/295

Fig.1 Layered crystal structure of MAX phases

Fig.2 The constituent elements of the MAX phase known to date in the periodic table^[55]

Fig.3 Ga whiskers grown on Cr₂GaN^[6]

Fig.4 The Ga whiskers or spheres very rapidly shrank back into the matrix leaving behind nanoribbons in Cr₂GaC system^[81]

Fig.5 Oxidation induced compressive stress model for whisker growth and its finite element simulation^[12]

Fig.6 Ga whisker nucleation schematic diagram of catalysis-like mechanism^[85]

Fig.7 Isotopic study of Sn whisker growth in Ti₂SnC/¹²⁰Sn system^[82]

Fig.8 Microstructures of the interface between Sn whisker and Ti₂SnC matrix^[90]

Fig.9 Morphology evolution of a Sn whisker alternately cultivated in vacuum and air^[89]

Fig.10 Sn whiskers cultured in vacuum (a, c) and the corresponding morphology simulation results (b, d)^[90]

1	NASA . Tin whisker (and other metal whisker) homepage [EB/OL].
2	Franks J . Growth of whiskers in the solid phase [J]. Acta Metall., 1958, 6: 103
3	Zhao Z S , Xian A P . Mechanisms and questions of tin whisker growth [J]. Chin. J. Nonferrous Met., 2012, 22: 2267
	赵子寿, 冼爱平 . 锡晶须生长机理研究的现状与问题 [J]. 中国有色金属学报, 2012, 22: 2267
4	Zhang P G , Zhang Y M , Sun Z M . Spontaneous growth of metal whiskers on surfaces of solids: A review [J]. J. Mater. Sci. Technol., 2015, 31: 675
5	Liu M , Xian A P . TEM observation of tin whisker [J]. Sci. China Technol. Sci., 2011, 54: 1546
6	Barsoum M W , Farber L . Room-temperature deintercalation and self-extrusion of Ga from Cr₂GaN [J]. Science, 1999, 284: 937
7	El-Raghy T , Barsoum M W . Growing metallic whiskers: Alternative interpretation [J]. Science, 1999, 285: 1355
8	Hoffman E N , Barsoum M W , Wang W , et al . On the spontaneous growth of soft metallic whiskers [A]. Proceedings of the 51st IEEE Holm Conference on Electrical Contacts [C]. Chicago, IL, USA: IEEE, 2005: 121
9	Boettinger W J , Johnson C E , Bendersky L A , et al . Whisker and hillock formation on Sn, Sn-Cu and Sn-Pb electrodeposits [J]. Acta Mater., 2005, 53: 5033
10	Lin W C , Tseng T H , Liu W , et al . Effect of Sn film grain size and thickness on kinetics of spontaneous Sn whisker growth [J]. JOM, 2019, 71: 3041
11	Majumdar B S , Dutta I , Bhassyvasantha S , et al . Recent advances in mitigation of whiskers from electroplated tin [J]. JOM, 2020, 72: 906
12	Barsoum M W , Hoffman E N , Doherty R D , et al . Driving force and mechanism for spontaneous metal whisker formation [J]. Phys. Rev. Lett., 2004, 93: 206104
13	Shim W , Ham J , Lee K I , et al . On-film formation of Bi nanowires with extraordinary electron mobility [J]. Nano Lett., 2009, 9: 18
14	Cheng Y T , Weiner A M , Wong C A , et al . Stress-induced growth of bismuth nanowires [J]. Appl. Phys. Lett., 2002, 81: 3248
15	Sun Z M , Hashimoto H , Barsoum M W . On the effect of environment on spontaneous growth of lead whiskers from commercial brasses at room temperature [J]. Acta Mater., 2007, 55: 3387
16	Ellis W C . Morphology of whisker crystals of tin, zinc, and cadmium grown spontaneously from solid [J]. Trans. Metall. Soc. AIME, 1966, 236: 872
17	Davis J H . Growth of thallium whiskers [J]. J. Appl. Phys., 1968, 39: 5811
18	Tohmyoh H , Yasuda M , Saka M . Controlling Ag whisker growth using very thin metallic films [J]. Scr. Mater., 2010, 63: 289
19	Kosinova A , Wang D , Schaaf P , et al . Whiskers growth in thin passivated Au films [J]. Acta Mater., 2018, 149: 154
20	Saka M , Yamaya F , Tohmyoh H . Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films [J]. Scr. Mater., 2007, 56: 1031
21	Horváth B , Illés B , Shinohara T , et al . Copper-oxide whisker growth on tin-copper alloy coatings caused by the corrosion of Cu₆Sn₅ intermetallics [J]. J. Mater. Sci., 2013, 48: 8052
22	Matsumoto T , Harries D , Langenhorst F , et al . Iron whiskers on asteroid Itokawa indicate sulfide destruction by space weathering [J]. Nat. Commun., 2020, 11: 1117
23	Illés B , Skwarek A , Ratajczak J , et al . The influence of the crystallographic structure of the intermetallic grains on tin whisker growth [J]. J. Alloys Compd., 2019, 785: 774
24	Zhang Z H , Wei C W , Han J J , et al . Growth evolution and formation mechanism of η′-Cu₆Sn₅ whiskers on η-Cu₆Sn₅ intermetallics during room-temperature ageing [J]. Acta Mater., 2020, 183: 340
25	Hao H , Li G D , Shi Y W , et al . Study of rapid growth of tin whisker accelerated by rare earth Ce [J]. Rare Met. Mater. Eng., 2009, 38: 866
	郝虎, 李广东, 史耀武等 . 稀土Ce加速Sn晶须生长的研究 [J]. 稀有金属材料与工程, 2009, 38: 866
26	Li C F , Liu Z Q . Microstructure and growth mechanism of tin whiskers on RESn₃ compounds [J]. Acta Mater., 2013, 61: 589
27	Liu Y S , Zhang P G , Yang L , et al . Spontaneous Ga whisker formation on FeGa₃ [J]. Prog. Nat. Sci. Mater., 2018, 28: 569
28	Cobb H L . Cadmium whiskers [J]. Mon. Rev. Am. Electroplaters Soc., 1946, 33: 28
29	Compton K G , Mendizza A , Arnold S M . Filamentary growths on metal surfaces—“Whiskers” [J]. Corrosion, 1951, 7: 327
30	Chason E , Jadhav N , Pei F , et al . Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms [J]. Prog. Surf. Sci., 2013, 88: 103
31	George E , Pecht M . Tin whisker analysis of an automotive engine control unit [J]. Microelectron. Reliab., 2014, 54: 214
32	Mathew S , Osterman M , Shibutani T , et al . Tin whiskers: How to mitigate and manage the risks [A]. Proceedings of 2007 International Symposium on High Density Packaging and Microsystem Integration [C]. Shanghai, China: IEEE, 2007: 1
33	Li Y C , Sun M L , Ren S R , et al . The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter [J]. Mater. Lett., 2020, 258: 126773
34	NASA . Metal whisker photo gallery [EB/OL].
35	NASA . Whisker failures [EB/OL].
36	Arnold S M . The growth and properties of metal whiskers [A]. Proceedings of the 43rd Annual Convention of the American Electroplaters Society [C]. Washington, 1956: 26
37	Tu K N , Gusak A M , Li M . Physics and materials challenges for lead-free solders [J]. J. Appl. Phys., 2003, 93: 1335
38	Ruan Y , Ji X Q , Wen M , et al . Research progress of lead contamination detection technology in food [J]. Guizhou J. Anim. Husb. Vet. Med., 2012, 36(5): 12
	阮涌, 嵇辛勤, 文明等 . 食品中铅污染检测技术研究进展 [J]. 贵州畜牧兽医, 2012, 36(5): 12
39	Shangguan D K , translated by Liu J Y , Sun P . Lead-free Solder Interconnect Reliability [M]. Beijing: Publishing House of Electronics Industry, 2008: 352
	上官东凯著, 刘建影, 孙鹏译. 无铅焊料互联及可靠性 [M]. 北京: 电子工业出版社, 2008: 352
40	Jagtap P , Chakraborty A , Eisenlohr P , et al . Identification of whisker grain in Sn coatings by analyzing crystallographic micro-texture using electron back-scatter diffraction [J]. Acta Mater., 2017, 134: 346
41	Meschter S J , Saha S K . Process for mitigation of whisker growth on a metallic substrate [P]. US Pat, 10907030, 2020
42	Liu S H , Ma L M , Shu Y T , et al . Growth behavior of whiskers in Sn-based lead-free solders [J]. Rare Met. Mater. Eng., 2015, 44: 2868
	刘思涵, 马立民, 舒雨田等 . Sn基无铅钎料晶须生长行为的研究 [J]. 稀有金属材料与工程, 2015, 44: 2868
43	Peach M O . Mechanism of growth of whiskers on cadmium [J]. J. Appl. Phys., 1952, 23: 1401
44	Eshelby J D . A tentative theory of metallic whisker growth [J]. Phys. Rev., 1953: 91: 755
45	Ellis W C , Gibbons D F , Treuning R C . Growth of Metal Whiskers from the Solid, Growth and Perfection of Crystals [M]. New York: John Wiley & Sons, 1958: 102
46	Vianco P T , Cummings D P , Kotula P G , et al . Mitigation of long whisker growth based upon the dynamic recrystallization mechanism [J]. J. Electron. Mater., 2019, 49: 888
47	Tu K N . Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions [J]. Phys. Rev., 1994, 49B: 2030
48	Howard H P , Cheng J , Vianco P T , et al . Interface flow mechanism for tin whisker growth [J]. Acta Mater., 2011, 59: 1957
49	Glazunova V K . A study of the influence of certain factors on the growth of filamentary tin crystals [J]. Kristallografiya, 1962, 7: 761
50	Shibutani T , Yu Q , Yamashita T , et al . Stress-induced tin whisker initiation under contact loading [J]. IEEE Trans. Electron. Packag. Manuf., 2006, 29: 259
51	Jagtap P , Jain N , Chason E . Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth [J]. Scr. Mater., 2020, 182: 43
52	Liu Y S . Mechanisms behind the spontaneous A-site metal whisker gtowth on MAX phases [D]. Nanjing: Southeast University, 2019
	刘玉爽 . MAX相中A位金属晶须自发生长机理研究 [D]. 南京: 东南大学, 2019
53	Zhang P , Liu Y , Ding J , et al . Controllable growth of Ga wires from Cr₂GaC-Ga and its mechanism [J]. Physica, 2015, 475B: 90
54	Barsoum M W . MAX Phases: Properties of Machinable Ternary Carbides and Nitrides [M]. Weinheim: John Wiley & Sons, 2013: 1
55	Sokol M , Natu V , Kota S , et al . On the chemical diversity of the MAX phases [J]. Trend. Chem., 2019, 1: 210
56	Sun Z M . Progress in research and development on MAX phases: A family of layered ternary compounds [J]. Inter. Mater. Rev., 2011, 56: 143
57	Magnuson M , Mattesini M . Chemical bonding and electronic-structure in MAX phases as viewed by X-ray spectroscopy and density functional theory [J]. Thin Solid Films, 2017, 621: 108
58	Jeitschko W , Nowotny H , Benesovsky F , et al . Die H-phasen Ti₂InC, Zr₂InC, Hf₂InC und Ti₂GeC [J]. Monatsh. Chem., 1963, 94: 1201
59	Barsoum M W , Farber L , Levin I , et al . High-resolution transmission electron microscopy of Ti₄AlN₃, or Ti₃Al₂N₂ revisited [J]. J. Am. Ceram. Soc., 1999, 82: 2545
60	Procopio A T , Barsoum M W , El-Raghy T . Characterization of Ti₄AlN₃ [J]. Metall. Mater. Trans., 2000, 31A: 333
61	Barsoum M W , El-Raghy T . Synthesis and characterization of a remarkable ceramic: Ti₃SiC₂ [J]. J. Am. Ceram. Soc., 1996, 79: 1953
62	Barsoum M W . The M_N_{+ 1} AX_N phases: A new class of solids: Thermodynamically stable nanolaminates [J]. Prog. Solid State Chem., 2000, 28: 201
63	Lin Z J , Zhuo M J , Zhou Y C , et al . Microstructures and theoretical bulk modulus of layered ternary tantalum aluminum carbides [J]. J. Am. Ceram. Soc., 2006, 89: 3765
64	Zheng L Y , Wang J M , Lu X P , et al . (Ti_0.5Nb_0.5)₅AlC₄: A new-layered compound belonging to MAX phases [J]. J. Am. Ceram. Soc., 2010, 93: 3068
65	Palmquist J P , Li S , Persson P O Å , et al . M_n_{+ 1} AX_n phases in the Ti-Si-C system studied by thin-film synthesis and ab initio calculations [J]. Phys. Rev., 2004, 70B: 165401
66	Naguib M , Kurtoglu M , Presser V , et al . Two-dimensional nanocrystals produced by exfoliation of Ti₃AlC₂ [J]. Adv. Mater., 2011, 23: 4248
67	Verger L , Xu C , Natu V , et al . Overview of the synthesis of MXenes and other ultrathin 2D transition metal carbides and nitrides [J]. Curr. Opin. Solid State Mater. Sci., 2019, 23: 149
68	Verger L , Natu V , Carey M , et al . MXenes: An introduction of their synthesis, select properties, and applications [J]. Trend. Chem., 2019, 1: 656
69	Li M , Huang Q . Recent progress and prospects of ternary layered carbides/nitrides MAX phases and their derived two-dimensional nanolaminates MXenes [J]. J. Inorg. Mater., 2020, 35: 1
	李勉, 黄庆 . 三元层状碳氮化合物(MAX相)及其衍生二维纳米材料(MXene)研究趋势与展望 [J]. 无机材料学报, 2020, 35: 1
70	Sun Z M , Hashimoto H , Tian W B , et al . Synthesis of the MAX phases by pulse discharge sintering [J]. Int. J. Appl. Ceram. Technol., 2010, 7: 704
71	Li M , Li Y B , Luo K , et al . Synthesis of novel MAX phase Ti₃ZnC₂ via A-site-element-substitution approach [J]. J. Inorg. Mater., 2019, 34: 60
	李勉, 李友兵, 罗侃等 . 基于A位元素置换策略合成新型MAX相材料Ti₃ZnC₂ [J]. 无机材料学报, 2019, 34: 60
72	Whittle K R , Blackford M G , Aughterson R D , et al . Radiation tolerance of M_n_{+ 1} AX_n phases, Ti₃AlC₂ and Ti₃SiC₂ [J]. Acta Mater., 2010, 58: 4362
73	Ding J X , Tian W B , Wang D D , et al . Microstructure evolution, oxidation behavior and corrosion mechanism of Ag/Ti₂SnC composite during dynamic electric arc discharging [J]. J. Alloys Compd., 2019, 785: 1086
74	Wu J Y , Zhou Y C , Wang J Y . Tribological behavior of Ti₂SnC particulate reinforced copper matrix composites [J]. Mater. Sci. Eng., 2006, A422: 266
75	Shahzad F , Alhabeb M , Hatter C B , et al . Electromagnetic interference shielding with 2D transition metal carbides (MXenes) [J]. Science, 2016, 353: 1137
76	Ghidiu M , Lukatskaya M R , Zhao M Q , et al . Conductive two-dimensional titanium carbide ‘clay’ with high volumetric capacitance [J]. Nature, 2014, 516: 78
77	Kamysbayev V , Filatov A S , Hu H C , et al . Covalent surface modifications and superconductivity of two-dimensional metal carbide MXenes [J]. Science, 2020, 369: 979
78	Liu Y , Zhang P , Ling C , et al . Spontaneous Sn whisker formation on Ti₂SnC [J]. J. Mater. Sci.: Mater. Electron., 2017, 28: 5788
79	Zhang H B , Zhang J , Zhou Y C , et al . Synthesis of AlN nanowires by nitridation of Ti₃Si_0.9Al_0.1C₂ solid solution [J]. J. Mater. Res., 2007, 22: 561
80	Sun Z M , Gupta S , Ye H , et al . Spontaneous growth of freestanding Ga nanoribbons from Cr₂GaC surfaces [J]. J. Mater. Res., 2005, 20: 2618
81	Sun Z M , Barsoum M W . Alternate mechanism for the spontaneous formation of freestanding Ga nanoribbons on Cr₂GaC surfaces [J]. J. Mater. Res., 2006, 21: 1629
82	Lu C J , Liu Y S , Fang J , et al . Isotope study reveals atomic motion mechanism for the formation of metal whiskers in MAX phase [J]. Acta Mater., 2021, 203: 116475
83	Zhang Y , Lu C J , Liu Y S , et al . The effect of Bi addition on the formation of metal whiskers in Ti₂SnC/Sn-xBi system [J]. Vacuum, 2020, 182: 109764
84	Chuang T H . Rapid whisker growth on the surface of Sn-3Ag-0.5Cu-1.0Ce solder joints [J]. Scr. Mater., 2006, 55: 983
85	Zhang P , Shen L W , Ouyang J , et al . Room temperature mushrooming of gallium wires and its growth mechanism [J]. J. Alloys Compd., 2015, 619: 488
86	Liu Y , Zhang P , Zhang Y M , et al . Spontaneous growth of Sn whiskers and a new formation mechanism [J]. Mater. Lett., 2016, 178: 111
87	Ali M S , Rayhan M A , Ali M A , et al . New MAX phase compound Mo₂TiAlC₂: First-principles study [J]. J. Sci. Res., 2016, 8: 109
88	Sun Z M , Barsoum M W , Zhang Y M , et al . On equilibrium Ga intergranular films in Cr₂GaC [J]. Mater. Res. Lett., 2013, 1: 109
89	Liu Y S , Zhang P G , Yu J , et al . Confining effect of oxide film on tin whisker growth [J]. J. Mater. Sci. Technol., 2019, 35: 1735
90	Liu Y S , Lu C J , Zhang P G , et al . Mechanisms behind the spontaneous growth of tin whiskers on the Ti₂SnC ceramics [J]. Acta Mater., 2020, 185: 433
91	Liao T , Wang J Y , Zhou Y C . Ab initio modeling of the formation and migration of monovacancies in Ti₂AlC [J]. Scr. Mater., 2008, 59: 854
92	Wang S , Cheng J , Zhu S Y , et al . A novel route to prepare a Ti₃SnC₂/Al₂O₃ composite [J]. Scr. Mater., 2017, 131: 80
93	Liu B , Wang J Y , Zhang J , et al . Theoretical investigation of A-element atom diffusion in Ti₂ AC (A = Sn, Ga, Cd, In, and Pb) [J]. Appl. Phys. Lett., 2009, 94: 181906
94	Zhang J , Liu B , Wang J Y , et al . Low-temperature instability of Ti₂SnC: A combined transmission electron microscopy, differential scanning calorimetry, and X-ray diffraction investigations [J]. J. Mater. Res., 2012, 24: 39
95	Chen K M , Wilcox G D . Observations of the spontaneous growth of tin whiskers on tin-manganese alloy electrodeposits [J]. Phys. Rev. Lett., 2005, 94: 066104
96	Chason E , Pei F , Jain N , et al . Studying the effect of grain size on whisker nucleation and growth kinetics using thermal strain [J]. J. Electron. Mater., 2019, 48: 17
97	Tang J W . The influence mechanism of alloying elements on whisker growth from Ti₂SnC/Sn composite system [D]. Nanjing: Southeast University, 2020
	唐静雯 . 合金元素对Ti₂SnC/Sn复合体系中Sn晶须生长行为的影响机制 [D]. 南京: 东南大学, 2020
98	Bramfitt B L . The effect of carbide and nitride additions on the heterogeneous nucleation behavior of liquid iron [J]. Metall. Mater. Trans., 1970, 1B: 1987
99	Tang J W , Zhang P G , Liu Y S , et al . Selective growth of tin whiskers from its alloys on Ti₂SnC [J]. J. Mater. Sci. Technol., 2020, 54: 206
100	Liu Y S , Lu C J , Zhang Y , et al . Effect of cultivation conditions on tin whisker growth on Ti₂SnC [J]. J. Electron. Mater., 2021, 50: 1083
101	Xian A P , Liu M . Observations of continuous tin whisker growth in NdSn₃ intermetallic compound [J]. J. Mater. Res., 2009, 24: 2775
102	Vasko A C , Warrell G R , Parsai E I , et al . Electron beam induced growth of tin whiskers [J]. J. Appl. Phys., 2015, 118: 125301
103	Oudat O , Arora V , Parsai E I , et al . Gamma- and X-ray accelerated tin whisker development [J]. J. Phys., 2020, 53D: 495305
104	Zhang P G , Tang J W , Sun Z M , et al . Purification method for low-melting-point metal [P]. Chin Pat, 201810677352.9, 2018
	张培根, 唐静雯, 孙正明等 . 一种低熔点金属提纯方法 [P]. 中国专利, 201810677352.9, 2018)
105	Zhang P G , Tang J W , Sun Z M , et al . Preparation method of dimension-control GaO nanometer tubes [P]. Chin Pat, 201910071310.5, 2019
	张培根, 唐静雯, 孙正明等 . 一种尺寸可控GaO纳米管的制备方法 [P]. 中国专利, 201910071310.5, 2019)

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