金刚石/Cu复合界面导热改性及其纳米化研究进展

doi:10.11900/0412.1961.2018.00355

金属学报

2018, Vol. 54

Issue (11): 1586-1596 DOI: 10.11900/0412.1961.2018.00355

材料与工艺

本期目录 | 过刊浏览

金刚石/Cu复合界面导热改性及其纳米化研究进展

张荻, 苑孟颖, 谭占秋(

), 熊定邦, 李志强

上海交通大学材料科学与工程学院金属基复合材料国家重点实验室上海 200240

Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites

Di ZHANG, Mengying YUAN, Zhanqiu TAN(

), Ding-Bang XIONG, Zhiqiang LI

State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

引用本文:

张荻, 苑孟颖, 谭占秋, 熊定邦, 李志强. 金刚石/Cu复合界面导热改性及其纳米化研究进展[J]. 金属学报, 2018, 54(11): 1586-1596.
Di ZHANG, Mengying YUAN, Zhanqiu TAN, Ding-Bang XIONG, Zhiqiang LI. Progress in Interface Modification and Nanoscale Study of Diamond/Cu Composites[J]. Acta Metall Sin, 2018, 54(11): 1586-1596.

全文: PDF(1860 KB) HTML

摘要:

金刚石/Cu复合材料以其高导热、低膨胀、耐热、耐蚀等优异特性,在热管理领域具有广泛的应用前景。但金刚石/Cu复合界面不相容限制了其性能水平。界面改性设计是改善界面结合、降低界面热阻的有效途径。本文以金刚石/Cu界面改性层的设计原理与主要因素为切入点,简述了金刚石/Cu复合材料界面设计的主要研究进展、存在的关键问题以及界面层厚小于200 nm的界面纳米化设计等几个方面的研究热点,并对其未来界面工程纳米化发展趋势予以展望。

关键词 ：金刚石/Cu复合材料, 热导率, 界面热导, 界面改性, 表面金属化

Abstract：

Due to the superiority in high thermal conductivity, low thermal expansion and good resistance from heat and corrosion, diamond/Cu composites show great prospect in thermal management applications. However, the thermal properties of diamond/Cu composites are impeded by their interface incompatibility. Interface modification is an effective method to enhance interfacial bonding and reduce interfacial thermal resistance. Based on the principles and factors related with interface design, this paper briefly reviewed some hot topics in diamond/Cu composites, including the main research progress, issues remained to be solved and nanoscale interface design with layer thickness lower than 200 nm, and its prospect of the future development.

Key words： diamond/Cu composite thermal conductivity interfacial thermal conductance interface modification surface metallization

收稿日期: 2018-07-16

ZTFLH:

TB331

基金资助:国家重点研发计划项目No.2017YFB0406200和国家自然科学基金项目No.51401123

作者简介:

作者简介张荻,男,1957年生,教授,博士

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图1 界面改性对金刚石/Cu致密度及热导率的影响

表1 常用界面改性层性质参数[52]

图2 双层镀层对复合材料致密化和金刚石分布的影响

图3 金刚石/Cu界面层厚度对热导率的影响

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